Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Sandisk Technologies Inc.

Hefei Reliance Memory Limited

Takeki Ninomiya

Takumi Mikawa

Yukio Hayakawa

Takeshi Takagi

Yoshio Kawashima

Zhiqiang Wei

Koji Arita

Shunsaku Muraoka

Yoshihiko Kanzawa

Koji Katayama

Satoru Fujii

Ryoko Miyanaga

Haruyuki Sorada

Teruo Okina

Shinichi Yoneda

Yusuke Yoshida

Tomoyuki Obu

Ryutaro Yasuhara

Tomohiro Uno

Toshihiro Iizuka

Mikawa Takumi

A memory device includes a memory cell comprising a bottom electrode, a top electrode, and a dielectric layer interposed between the bottom electrode and the top electrode. The bottom electrode has a first width W. The top electrode has a top surface that has a second width Wbetween two edges of the top surface. The memory cell has a first height Hextending from a lower surface of the bottom electrode to the top surface of the top electrode. The memory device further includes a top contact wire coupled to the top electrode. The top contact wire has a top surface that has a third width W, a second height Hat a location between two adjacent memory cells, and a third height Hextending between the top surface of the top contact wire and the insulating layer, where W>W>Wand H>H>H

Memory device having improved memory cell structures to prevent formation of voids therein

A three-dimensional memory device includes an alternating stacks of insulating layers and electrically conductive layers. Memory opening fill structures located in memory openings include a memory film and plural vertical semiconductor channels.

Three-dimensional memory device with plural channels per memory opening and methods of making the same

A memory die includes an alternating stack of insulating layers and electrically conductive layers, memory stack structures extending through the alternating stack, and each of the memory stack structures includes a respective vertical semiconductor channel and a respective memory film, drain regions located at a first end of a respective one of the vertical semiconductor channels, and a source layer having a first surface and a second surface. The first surface is located at a second end of each of the vertical semiconductor channels, and a semiconductor wafer is not located over the second surface of the source layer.

Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layer

A method is provided that includes forming a word line above a substrate, the word line disposed in a first direction, forming a bit line above the substrate, the bit line disposed in a second direction perpendicular to the first direction, forming a nonvolatile memory material between the word line and the bit line by selectively forming a conductive oxide material layer adjacent the word line, and forming a semiconductor material layer adjacent the bit line, and forming a memory cell comprising the nonvolatile memory material at an intersection of the bit line and the word line.

Methods and apparatus for three-dimensional nonvolatile memory

An estimation method for a variable resistance element including (i) a first electrode, (ii) a second electrode, and therebetween (iii) a variable resistance layer in which a local region is formed which has resistive status that reversibly changes according to an electric pulse applied between the first electrode and the second electrode, the estimation method including: obtaining, when changes are made to the resistive status of the local region, measurement values each indicating a resistance state after one of the changes; and determining, based on a distribution of the obtained measurement values, an estimated amount of a physical parameter regarding structural characteristics of the local region by a calculation.

Estimation method, estimation device, and inspection device for variable resistance element, and nonvolatile memory device

A variable resistance nonvolatile storage element includes: a first electrode; a second electrode; and a variable resistance layer having a resistance value that reversibly changes based on an electrical signal applied between the electrodes, wherein the variable resistance layer has a structure formed by stacking a first transition metal oxide layer, a second transition metal oxide layer, and a third transition metal oxide layer in this order, the first transition metal oxide layer having a composition expressed as MO(where M is a transition metal and O is oxygen), the second transition metal oxide layer having a composition expressed as MO(where x&#x3e;y), and the third transition metal oxide layer having a composition expressed as MO(where y&#x3e;z).

Nonvolatile storage element and method for manufacturing same

A variable resistance nonvolatile memory element includes: first and second electrode layers; a first variable resistance layer between the first and second electrode layers; and a second variable resistance layer between the second electrode layer and the first variable resistance layer and having a higher resistance value than the first variable resistance layer. When viewed in a direction perpendicular to the major surface of the second variable resistance layer, an outline of the second variable resistance layer is located inwardly of the outline of any one of the second electrode layer and the first variable resistance layer, and an outline of a face of the second variable resistance layer, the face being in contact with the first variable resistance layer is located inwardly of an outline of a face of the first variable resistance layer, the face being in contact with the second variable resistance layer.

Variable resistance nonvolatile memory element and method of manufacturing the same

In a driving method of a non-volatile memory element, the polarity of a write voltage pulse applied to change a variable resistance layer from a high-resistance state to a low-resistance state is such that an input/output terminal which is more distant from the variable resistance element becomes a source terminal, and when a first write voltage pulse is applied to change the variable resistance layer in the high-resistance state to the low-resistance state, a first gate voltage is applied to a gate terminal, while when a second write voltage pulse which is greater in absolute value of voltage than the first write voltage pulse is applied to change the variable resistance layer in an excess-resistance state to the low-resistance state, a second gate voltage which is smaller in absolute value than the first gate voltage is applied to the gate terminal.

Driving method of non-volatile memory element and non-volatile memory device

A nonvolatile memory element which inhibits deterioration of an oxygen concentration profile of a variable resistance layer due to a thermal budget and is able to stably operate at low voltages, and a method for manufacturing the nonvolatile memory element are provided. The nonvolatile memory element includes a first electrode layer formed above a substrate, a variable resistance layer disposed on the first electrode layer, and a second electrode layer disposed on the variable resistance layer, and the variable resistance layer has a two-layer structure in which an oxygen- and/or nitrogen-deficient tantalum oxynitride layer and a tantalum oxide layer are stacked.

Variable resistance nonvolatile memory element and method for manufacturing the same

Provided is a method for manufacturing a variable resistance element, the method including: forming a first electrode material layer above a substrate; forming a first tantalum oxide material layer; forming a second tantalum oxide material layer; forming a second electrode material layer; and annealing at least the first tantalum oxide material layer after forming the first tantalum oxide material layer and before forming the second electrode material layer, wherein an oxygen content percentage of one of the first tantalum oxide material layer and the second tantalum oxide material layer is higher than an oxygen content percentage of the other.

Method for manufacturing variable resistance element

Provided is a method for manufacturing a variable resistance nonvolatile semiconductor memory element, and a nonvolatile semiconductor memory element which make it possible to operate at a low voltage and high speed when initial breakdown is caused, and exhibit favorable diode element characteristics. The method for manufacturing the nonvolatile semiconductor memory element includes, after forming a top electrode of a variable resistance element and at least before forming a top electrode of an MSM diode element, oxidizing to insulate a portion of a variable resistance film in a region around an end face of a variable resistance layer.

Method for manufacturing nonvolatile semiconductor memory element, and nonvolatile semiconductor memory element

A nonvolatile memory element includes a variable resistance layer located between a lower electrode and an upper electrode and having a resistance value that reversibly changes based on electrical signals applied between these electrodes. The variable resistance layer includes at least two layers: a first variable resistance layer including a first transition metal oxide; and a second variable resistance layer including a second transition metal oxide and a transition metal compound. The second transition metal oxide has an oxygen content atomic percentage lower than an oxygen content atomic percentage of the first transition metal oxide, the transition metal compound contains either oxygen and nitrogen or oxygen and fluorine, and the second transition metal oxide and the transition metal compound are in contact with the first variable resistance layer.

Nonvolatile memory element, manufacturing method thereof, nonvolatile memory device, and design support method for nonvolatile memory element

A nonvolatile memory element includes: a first electrode; a second electrode; and a variable resistance layer comprising a metal oxide positioned between the first electrode and the second electrode. The variable resistance layer includes: a first oxide layer having a resistivity &#x3c1;, on the first electrode; a second oxide layer having a resistivity &#x3c1;(&#x3c1;&#x3c;&#x3c1;), on the first oxide layer; a third oxide layer having a resistivity &#x3c1;(&#x3c1;&#x3c;&#x3c1;), on the second oxide layer; and a localized region that is positioned in the third oxide layer and the second oxide layer to be in contact with the second electrode and not to be in contact with the first oxide layer, and is, in resistivity, lower than the third oxide layer and different from the second oxide layer.

Nonvolatile memory element and nonvolatile memory device

A non-volatile memory element including a first electrode; a second electrode; and a variable resistance layer. The variable resistance layer including, when a first metal is M and a second metal is N: a third metal oxide layer NO; a second metal oxide layer NO; and a first metal oxide layer MOsuch that the third, second and first metal oxide layers are stacked in this order; wherein when an oxygen content atomic percentage of an oxide of the first metal M in a stoichiometric state is A, an oxygen content atomic percentage of an oxide of the second metal N in a stoichiometric state is B, an oxygen content atomic percentage of MOis C, an oxygen content atomic percentage of NOis D, and an oxygen content atomic percentage of NOis E, (D/B)&#x3c;(C/A), (E/B)&#x3c;(C/A) and y&#x3c;z are satisfied.

Non-volatile memory element and manufacturing method thereof

A current steering element () formed such that the current steering element covers a lower opening () of a via hole () formed in an interlayer insulating layer (), comprises: a corrosion-suppressing layer () formed on a lower side of a lower opening of the via hole such that the corrosion-suppressing layer covers an entire portion of the lower opening; a second electrode layer () formed under the corrosion-suppressing layer and comprising a material different from a material of the corrosion-suppressing layer; a current steering layer () formed under the second electrode layer such that the current steering layer is physically in contact with the second electrode layer; and a first electrode layer () formed under the current steering layer such that the first electrode layer is physically in contact with the current steering layer; and the first electrode layer, the current steering layer and the second electrode layer constitute one of a MSM diode and a MIM diode.

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Osaka, Japan

Takeki Ninomiya