Toppan Printing Co., Ltd.

Dsm IP Assets B.v.

Adeka Corporation

Takehito Tsukamoto

Junko Toda

Susumu Maniwa

Takao Minato

Koichi Kumai

Masayuki Ode

Jun Sasaki

Mamoru Ishizaki

Takao Tomono

Osamu Yoshioka

Ryuji Ueda

Yasuhiro Sakai

Hatsune Hara

Shinichi Inoue

Masahiro Wada

Masataka Maehara

Hiroshi Matsuzawa

Masako Saito

Takuya Kanazawa

Daisuke Inokuchi

Satoshi Akimoto

Ryota Chiba

Shigeru Hirayama

Ichiro Hiratsuka

Masakichi Yoshida

Takumi Suemoto

Yuichi Sakaki

Hitoshi Motomura

Kenta Yotsui

A metal foil pattern layered body of the invention includes a base member; a metal foil including a metal pattern formed by an opening and a metal portion; and a protuberance provided at the metal foil and at a boundary between the opening and the metal portion.

Metal foil pattern layered body, metal foil layered body, metal foil multi-layer substrate, solar cell module, and method of manufacturing metal foil pattern layered body

A metal foil pattern layered body of the invention includes: a base member; a metal foil including a metal foil pattern formed by an opening and a metal portion; and a protuberance provided at the metal foil and at a boundary between the opening and the metal portion.

A lead frame comprises on a same plane, a pad part including an LED chip mounting upper surface A on which at least an LED chip is to be mounted, and a lead part including an electric connection area C in which an electric connection with the LED chip is made. A relationship between an area Sof the mounting upper surface of the pad partand an area Sof a radiating lower surface opposite to the mounting upper surface is represented by 0&#x3c;S&#x3c;S. Side surfaces of the pad part between the mounting upper surface and the radiating lower surface are provided with stepped parts or tapered parts which spread in a direction from the mounting upper surface toward the radiating lower surface and hold a resin-filled during molding.

Lead frame, its manufacturing method, and semiconductor light emitting device using the same

A curable composition includes: 100 parts by mass of a silicon-containing polymer having a Mw of 3,000 to 100,000 obtainable by hydrolysis-condensation of an organosilane mixture including RSiX, RSiX, RRSiXand RSiX, the total of RSiXand RRSiX2 being 5 to 60 mol %, optionally a prepolymer, optionally a cyclic siloxane compound, 0.0001 to 10 parts by mass of an organic peroxide and optionally a metal catalyst, and 10 to 1,500 parts by mass of a filler, wherein Ris a C2-6 alkenyl group, Ris a C1-6 alkyl group, Rand Rare each a C1-6 alkyl group, Ris a phenyl group optionally substituted with a C1-6 alkyl group, and X is a C1-6 alkoxy group, one or more of Rto Ris a methyl group, f represents a number of 2 to 10, g represents a number of 0 to 8, and n represents 1 or 2.

Silicon-containing curable composition, cured product of the silicon-containing curable composition and lead frame substrate formed of the silicon-containing curable composition

A manufacturing method of a lead frame substrate includes: applying a photosensitive resist or a dry film to first and second surfaces of a metal plate; pattern-exposing the photosensitive resist or the dry film, and then developing the first surface and the second surface to form on the first surface a first resist pattern for forming a connection post and to form on the second surface a second resist pattern for forming a wiring pattern; etching the first surface partway down the metal plate to form the connection post; filling the first surface with a pre-molding resin to a thickness with which the etched surface is buried; removing the pre-molding resin uniformly in a thickness direction of the pre-molding resin until a bottom surface of the connection post is exposed; and etching the second surface to form a wiring pattern.

Manufacturing method of lead frame substrate

A lead frame substrate, includes: a metal plate having first and second surfaces; a semiconductor element mounting section, semiconductor element electrode connection terminals, and a first outer frame section formed on the first surface; external connection terminals formed on the second surface and electrically connected with the semiconductor element electrode connection terminals; a second outer frame section formed on the second surface; and a resin layer formed on a gap between the first outer frame and the second outer frame. Each external connection terminal buried in the resin layer has at least one projection formed on a side surface thereof throughout a side lower portion of the first surface.

Lead frame substrate and method of manufacturing the same, and semiconductor device

A lead frame substrate, including: a metal plate with a first surface and a second surface; a connection post formed on the first surface; wiring formed on the second surface; and a pre-molding resin layer, in which a thickness of the pre-molding resin layer is the same as a height of the connection post.

Manufacturing method of lead frame substrate and semiconductor apparatus

A manufacturing method of a semiconductor element substrate including: forming a first photoresist pattern on a first surface of a metallic plate, to form a semiconductor element mounting part, a semiconductor element electrode connection terminal, a wiring, an outer frame part, and a slit; forming a second photoresist pattern on the second surface of the metallic plate; forming the slit by half etching to connect the metallic chip with a four corners of the outer frame part; forming a plurality of concaved parts on the second surface of the metallic plate; forming a resin layer by injecting a resin to the plurality of concaved parts; and etching the first surface of the metallic plate and forming the semiconductor element electrode connection terminal and the outer frame.

Method for manufacturing substrate for semiconductor element

A manufacturing method of a substrate for a semiconductor element, wherein a first step includes: forming a first and second photosensitive resin layer on a first and second surface of a metal plate, respectively; forming a first and second resist pattern on the first and second surface, for forming a connection post and a wiring pattern, respectively. A second step includes: forming the connection post and wiring pattern; filling in a premold liquid resin to the first surface which was etched; forming a premold resin layer by hardening the premold liquid resin; performing a grinding operation on the first surface, and exposing an upper bottom surface of the connection post from the premold resin layer. A groove structure is formed by the first and second steps, wherein a depth of the groove is up to an intermediate part in a thickness direction of the metal plate.

Method of manufacturing substrate for semiconductor element, and semiconductor device

Provided is a manufacturing method of a substrate for a semiconductor element including the steps of: providing a first photosensitive resin layer on a first surface of a metal plate; providing a second photosensitive resin layer on a second surface different from the first surface of the metal plate; forming a first etching mask for forming a connection post on the first surface of the metal plate; forming a second etching mask for forming a wiring pattern on the second surface of the metal plate; forming the connection post by performing an etching from the first surface to a midway of the metal plate; filling in a premold resin to a portion of the first surface where the connection post does not exist; processing so that a height of the connection post of the first surface is lower than a height of the premold resin surrounding the connection post; and forming the wiring pattern by performing an etching on the second surface.

Method for manufacturing substrate for semiconductor element, and semiconductor device

A lead frame substrate, including: a metal plate having a first surface and a second surface; a semiconductor element mount portion and a semiconductor element electrode connection terminal that are formed on the first surface; an external connection terminal formed on the second surface and electrically connected to the semiconductor element electrode connection terminal; a conducting wire that connects the semiconductor element electrode connection terminal and the external connection terminal to each other; a resin layer formed on the metal plate; a hole portion that is partly formed in the second surface of the metal plate and does not penetrate the metal plate; and a plurality of protrusions that are formed on a bottom surface of the hole portion and protrude in a direction away from the metal plate, the protrusions having a height lower than a position of the second surface, not being in electrical conduction with the conducting wire, and being dispersed separately.

Lead frame substrate, manufacturing method thereof, and semiconductor apparatus

Provided is a manufacturing method of a semiconductor element substrate including: a step of forming a first photoresist pattern on a first surface of a metallic plate, to form a semiconductor element mounting part, a semiconductor element electrode connection terminal, a wiring, an outer frame part, and a slit; a step of forming a second photoresist pattern on the second surface of the metallic plate; a step of forming the slit by half etching to connect the metallic chip with a four corners of the outer frame part; a step of forming a plurality of concaved parts on the second surface of the metallic plate; a step of forming a resin layer by injecting a resin to the plurality of concaved parts; and a step of etching the first surface of the metallic plate and forming the semiconductor element electrode connection terminal and the outer frame.

Substrate for semiconductor element, method for manufacturing substrate for semiconductor element, and semiconductor device

A method includes: forming a photoresist pattern to form each of a semiconductor element mounting section on which a semiconductor element is mounted, semiconductor element electrode connection terminals for connection with electrodes of the semiconductor element, and a first outer frame section on a first surface of a metal plate; forming a photoresist pattern to form each of external connection terminals, a second outer frame section, and grooves in at least a part of the second outer frame section on a second surface of the metal plate; etching a metal plate exposing section, in which the metal plate of the second surface is exposed, to form holes that do not pass through the metal plate exposing section and grooves that run from an inside to an outside of the second outer frame section; coating a pre-mold resin on the holes and the grooves, and heating the pre-mold resin under pressure using a flat-bed press to form a resin layer; and etching the first surface to form the semiconductor element mounting section, the semiconductor element electrode connection terminals electrically connected with the external connection terminals, and the first outer frame section.

Lead frame substrate and method of manufacturing the same

A method of manufacturing a multi-layer circuit wiring board, including simultaneously laminating a second flexible resin film on one surface of a first flexible resin film having a first wiring pattern on at least one surface thereof, and a third wiring pattern on another surface of the first flexible resin film, the second flexible resin film having a second wiring pattern formed on at least one surface thereof, and the third flexible resin film having a third wiring pattern formed on at least one surface thereof.

Method of manufacturing multi-layer wiring board

Some of the embodiments of this invention provide optical waveguides which achieve high use efficiency of core material and which are inexpensive. Some other embodiments of the invention provide methods of manufacturing such optical waveguides. An method of manufacturing an optical waveguide, according to the invention, comprises a step of forming a first clad by applying a resin on a substrate and curing the resin, a step of applying a core material between a recessed mold which has a recess having a shape identical to a shape of the core, and the first clad which is provided on the substrate, a step of curing the core material thus applied, thereby forming a core pattern having a shape corresponding to that of the recess, and a step of peeling the recessed mold from the core pattern and the first clad.

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Tokyo, Japan

Takehito Tsukamoto