Denso Corporation

Takehito Teramae

Toshihiro Miyake

Yoshitaro Yazaki

Tomohiro Yokochi

Makoto Totani

Hajime Nakagawa

Kazuyuki Deguchi

Ichiro Yoshida

Takafumi Ito

Tomoaki Mizuno

Katsuaki Kojima

Tomoyuki Nanami

Tetsuichi Takeuchi

Hiroyasu Iwama

Toshiya Takeuchi

Takahiko Naruse

Kenzo Hirano

An automatic brake control apparatus controls a braking device of a vehicle to execute a brake operation at a brake operating timing. The automatic brake control apparatus includes a brain activity state acquirer unit configured to acquire an activity state of a brain of a driver of the vehicle; a change determiner unit configured to use the activity state of the brain of the driver acquired after the braking device has executed a brake operation at a brake operating timing to determine whether changing the brake operating timing is necessary or unnecessary; and a change controller configured to change the brake operating timing in response to that changing the brake operating timing is determined to be necessary.

Automatic brake control apparatus and computer-readable non-transitory storage medium

Lands formed on a flexible printed circuit board are electrically connected with lands formed on a rigid printed circuit board through solder. At this point, solder resist is formed between neighboring two lands on the rigid printed circuit board, and is terminated with an end portion that is interposed between the rigid printed circuit board and the flexible printed circuit board. Accordingly, even when surplus solder is extruded onto the rigid printed circuit board, the solder resist can prevent solder bridges from being formed between the lands.

Connecting structure of printed circuit boards

Connecting method and connecting structure of printed circuit boards

In interconnecting printed circuit boards: preparing a first and second printed circuit board is accomplished with the first having an insulating substrate of thermoplastic resin and a conductive pattern with a land, while the second has a conductive pattern with a land; overlapping the land of the first with the land of the second is done to form an interconnection portion; and heating the interconnection portion at a temperature approximately higher than a glass transition temperature of the thermoplastic resin while applying pressure to the interconnection portion to create an electrical interconnection sealed with a part of the thermoplastic resin constituting the insulating substrate of the first board is accomplished. The insulating substrate of the first board is overlapped with an insulating substrate of the second printed board to interpose a film, the film including material to reduce a modulus of elasticity of the insulating substrate of the first board.

Method for interconnecting printed circuit boards and interconnection structure

Growing community of inventors

Chiryu, Japan

Takehito Teramae