Murata Manufacturing Co., Ltd.

Takehisa Sasabayashi

Tomoyuki Nakamura

Akihiro Motoki

Masayuki Ishihara

Makoto Ogawa

Yasuyuki Shimada

Shinichi Kokawa

Naoto Muranishi

Hideyuki Hashimoto

Yasuhiro Nishisaka

Takayuki Yao

Harunobu Sano

Satoshi Muramatsu

Akihiro Shiota

Takayuki Kayatani

Makoto Matsuda

Hironori Suzuki

Tomonori Muraki

Yoko Okabe

Takumi Taniguchi

Kenji Kimura

Akira Kato

Daiki Fukunaga

Toshiyuki Iwanaga

Takashi Hiramatsu

Akitaka Doi

Kazuhisa Uchida

Masahito Saruban

Daisuke Hamada

Akihiro Tsuru

Kotaro Shimizu

Atsushi Ishida

Shinya Isota

Kazuo Muto

Satoshi Matsuno

Kenji Ueno

Tsuyoshi Ito

Kiyoshiro Ishibe

Yuta Oshima

Tomoyuki Kuwano

Kenjiro Gomi

Wataru Oshima

Ai Fukumori

A multilayer ceramic capacitor includes a body including dielectric ceramic layers and inner electrode layers. The dielectric ceramic layers include crystal grains including a perovskite oxide including at least one A-site element and at least one B-site element. When a cross-section of the dielectric ceramic layers is observed using a scanning transmission electron microscope, the dielectric ceramic layers include grains, on which a plane of a perovskite structure is observed, as crystal grains. In the cross-section, a percentage by number of the grains in the crystal grains is about 4% or more.

Multilayer ceramic capacitor

A multilayer ceramic capacitor includes dielectric ceramic layers and inner electrode layers. The dielectric ceramic layers include crystal grains including a perovskite oxide including at least one A-site element and at least one B-site element. When a cross-section of the dielectric ceramic layers is observed using a scanning transmission electron microscope, the dielectric ceramic layers include grains, on which a plane of a perovskite structure is observed, as crystal grains. The grains, when subjected to compositional analysis by energy dispersive x-ray spectroscopy, have an atom-distributed region in which a concentration of the A-site element or B-site element (c) subtracted from a maximum concentration of the element (c) (Δc=c−c) is about 2 atm % or less, at one or more atomic sites in the grains, and an area of the atom-distributed region (S) is about 0.050 nmor less.

A multilayer ceramic capacitor includes a base body including first and second main surfaces, first and second side surfaces, first and second end surfaces, and dielectric layers and internal electrode layers, and external electrodes at the first and second end surfaces, and electrically connected to the internal electrode layers. The base body includes an inner layer, first and second outer layers, first and second side margin portions. The dielectric layers in the inner layer and the first and second outer layers include main crystal grains including barium and titanium, and with respect to 100 parts by mol of titanium, nickel in an amount of about 0.2 to about 3.0 parts by mol, and at least one rare earth element selected from yttrium, praseodymium, neodymium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium, and lutetium in an amount of about 0.6 parts to about 2.0 parts by mol.

A multilayer electronic component includes a multilayer body including dielectric layers and inner electrode layers. Each of the dielectric layers includes first crystal grains defining and functioning as plate-shaped objects that have an average thickness of less than or equal to about 300 nm and an average aspect ratio of more than or equal to about 5, each of the inner electrode layers includes second crystal grains defining and functioning as plate-shaped objects that have an average thickness of less than or equal to about 150 nm and an average aspect ratio of more than or equal to about 5, where an aspect ratio is represented by a ratio of a major axis of each plate-shaped object to a thickness of the plate-shaped object with the major axis of the plate-shaped object being orthogonal or substantially orthogonal to a thickness direction of the plate-shaped object.

Multilayer electronic component and method for manufacturing multilayer electronic component

A multilayer ceramic capacitor includes a multilayer body including dielectric layers and layered internal electrodes, first and second main surfaces, first and second side surfaces, first and second end surfaces, and an external electrode connected to the internal electrodes and provided on each of the first and second end surfaces. A region where the internal electrodes are superimposed is defined as an effective region, regions respectively located on sides of the first and second end surfaces relative to the effective region are defined as first and second regions, and a bent portion where the dielectric layers and the internal electrodes are bent is located in the first region. In the bent portion, all vertices in the stacking direction are located within a range that extends by about 25 &#x3bc;m to about 35 &#x3bc;m in a length direction from the effective region of the multilayer body.

An end surface outer layer Mn/Ti peak intensity ratio, which is a ratio of a peak intensity of Mn found by laser ICP to a peak intensity of Ti found by laser ICP in a dielectric ceramic layer in an end surface outer layer portion, is higher than a central portion Mn/Ti peak intensity ratio, which is a ratio of a peak intensity of Mn found by laser ICP to a peak intensity of Ti found by laser ICP in the dielectric ceramic layer in a central portion in a width direction, a length direction, and a layering direction in an effective portion, and a peak intensity of Ni found by TEM-EDX is in a portion of the dielectric ceramic layers in the end surface outer layer portion.

In a multilayer ceramic capacitor, when a ratio of an ICP peak intensity of Mn to an ICP peak intensity of Ti is an Mn/Ti peak intensity ratio, a value of the Mn/Ti peak intensity ratio in a dielectric ceramic layer in at least one of a main surface outer layer portion, a side surface outer layer portion, and an end surface outer layer portion is in a range of two times to fifteen times a value of the Mn/Ti peak intensity ratio in a dielectric ceramic layer in a central portion of an effective portion in a width direction, a length direction, and a stacking direction.

An Mn/Ti peak intensity ratio in a dielectric ceramic layer in an end surface outer layer portion is within two times to fifteen times of the Mn/Ti peak intensity ratio in a central portion, a rare earth element/Ti peak intensity ratio in the dielectric ceramic layer in the end surface outer layer portion is within two times to seven times the rare earth element/Ti peak intensity ratio in the central portion, an Si/Ti peak intensity ratio in the dielectric ceramic layer in a side surface outer layer portion is within two times to five times the Si/Ti peak intensity ratio in the central portion, and the rare earth element/Ti peak intensity ratio in the dielectric ceramic layer in the side surface outer layer portion is within two times to seven times the rare earth element/Ti peak intensity ratio.

A multilayer ceramic capacitor includes a ceramic body including a stack of dielectric layers and internal electrodes, and an external electrode electrically connected to each of the internal electrodes and provided at each of both end surfaces of the ceramic body. The external electrode includes a metal layer and a plating layer on the metal layer. In a cross section of the metal layer that is obtained by cutting the external electrode along a plane parallel to a side surface at a central position in a width direction, the metal layer includes a dielectric material at an area ratio of about 20% or more, and includes cavities at an area ratio of about 5% or more and about 20% or less, the cavities having an average diameter of about 0.5 &#x3bc;m or more and about 1.5 &#x3bc;m or less, and having a maximum diameter of about 5.0 &#x3bc;m or less.

An electronic component includes a laminate including internal electrodes alternately laminated in a lamination direction with dielectric layers interposed therebetween. The laminate includes main surfaces opposite to each other in the lamination direction, side surfaces opposite to each other in a width direction, and end surfaces opposite to each other in a length direction, and external electrodes provided on surfaces of the laminate and electrically connected to the internal electrodes. Each of the dielectric layers includes Ti and Mg. When a cross section including the length direction and the width direction of the laminate is viewed from the lamination direction, side margin portions in which the internal electrodes do not exist each include a dielectric including Ti and Mg with a molar ratio in each of the side margin portions smaller than a molar ratio of Mg to Ti included in each of the dielectric layers.

Electronic component

A multilayer electronic component having a plurality of laminated dielectric layers and inner electrode layers. The dielectric layers have a plurality of crystal grains including first regions where Re is dissolved in a solid state; and second regions where Re is not dissolved in the solid state. A median size of the crystal grains to an average thickness of the dielectric layers is 0.5&#x2264;t&#x2264;0.7. A ratio of a sum of cross sectional areas of the first regions to those of the plurality of crystal grains is 0.7&#x2264;s&#x2264;0.9. When a total amount of Ti, Zr, and Hf is 100 molar parts in the dielectric layers, a sum of the Zr and the Hf is 0&#x2264;a&#x2264;1.0; an amount b of Si is 0.1&#x2264;b&#x2264;1.0; an amount c of Re is 0.5&#x2264;c&#x2264;10.0; and a ratio m of a total of Ba and Re to a total of Ti, Zr, and Hf is 0.990&#x2264;m&#x2264;1.050.

Multilayer type electronic component

A method for manufacturing a multilayer ceramic capacitor includes preparing a green multilayer body including a stack of dielectric sheets printed with inner electrodes, coating the green multilayer body with a conductive paste that is connected to the inner electrodes, and firing the conductive paste and the green multilayer body at the same time, wherein a rate of temperature increase from about 800&#xb0; C. to about 1,100&#xb0; C. during the firing is about 15&#xb0; C. per minute or more.

Method for manufacturing multilayer ceramic capacitor

A multilayer ceramic capacitor includes an external electrode that is unlikely to be peeled. First and second external electrodes each include base layers provided over a ceramic body and including a metal and glass, and Cu plated layers provided over the base layers. The multilayer ceramic capacitor includes a reactive layer. The reactive layer contains about 5 atomic % to about 15 atomic % of Ti, about 5 atomic % to about 15 atomic % of Si, and about 2 atomic % to about 10 atomic % of V.

A multilayer ceramic capacitor provided in a multilayer printed wiring board includes a ceramic body with a plurality of ceramic layers and internal electrodes stacked, and an external electrode including a base layer that includes a sintered metal containing a metal and glass and a plated layer provided on the surface of the base layer, which is provided on an end surface of the ceramic body to be connected to the internal electrodes. The external electrode includes a principal surface portion disposed on a principal surface of the ceramic body. The outermost layer of the plated layer includes a Cu plated layer. The ratio of arithmetic mean roughness (Ra) at the surface of the ceramic body/arithmetic mean roughness (Ra) at the surface of the external electrode satisfies a condition: about 0.06&#x2266;the arithmetic mean roughness (Ra) at the surface of the ceramic body/the arithmetic mean roughness (Ra) at the surface of the external electrode&#x2266;about 0.97.

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Nagaokakyo, Japan

Takehisa Sasabayashi