Seiko Epson Corporation

Takehisa Saeki

Takeo Kawase

Hitoshi Yamamoto

Tsutomu Miyamoto

Takashi Aoki

Soichi Moriya

Hirofumi Hokari

Tomoyuki Okuyama

Mitsuaki Harada

In at least one embodiment of the disclosure, a display device includes a first substrate and a second substrate. A layer is located between the first substrate and the second substrate. The layer includes a first region and a second region. The first region comprises an electrophoretic display layer having electrophoretic particles. The second region is located between the first region and an edge of the first substrate and includes a contact portion. The distance between the first substrate and the second substrate corresponding to the second region is smaller than the distance between the first substrate and the second substrate corresponding to the first region.

Electrophoretic display device

In at least one embodiment of the disclosure, a driving substrate includes a substrate having a first portion and a second portion formed surrounding the first portion. A flexible printed circuit is formed on the second portion. The flexible printed circuit includes a protruding portion extending to the first portion.

Electrophoretic display sheet, electrophoretic display device, and electronic apparatus

In at least one embodiment of the disclosure, an electrophoretic display sheet includes an electrophoretic display layer and a substrate provided with the electrophoretic display layer. An end portion of the substrate includes a chamfered edge. The electrophoretic sheet may be attached to a driving substrate.

A method of forming a contact hole includes forming a first conductive layer patterned so as to serve as an electrode or a wiring on a substrate, forming an insulation layer on the substrate and the first conductive layer, inserting a cutting instrument into the insulation layer at an angle to a surface of the insulation layer, the angle being in the range from 5&#xb0; to 80&#xb0;, and forming a tapered opening extending to the electrode or the wiring in the insulation layer by drawing out the cutting instrument.

Method of forming contact hole, method of manufacturing wiring board, method of manufacturing semiconductor device, and method of manufacturing electro-optical device

Growing community of inventors

Suwa, Japan

Takehisa Saeki