Other

Takehiro Yuasa

Taichi Yasuda

Kazumasa Asai

Masanao Sasaki

Kazuaki Aoki

Daisuke Furukawa

Taketoshi Sato

A double-side polishing method of polishing both surfaces of a wafer by holding the wafer with a carrier including a holding hole configured to hold the wafer and a ring-shaped resin insert disposed along an internal circumference of the holding hole, the resin insert having an inner circumferential surface configured to contact a peripheral portion of the wafer, interposing the carrier between upper and lower turn tables to which polishing pads are attached, polishing both the surfaces of the wafer while maintaining planarity of the inner circumferential surface at or below 100 &#x3bc;m and verticalness of the inner circumferential surface at or below 5&#xb0;. The method can inhibit the degradation of the flatness of the polished wafer, such as particularly an outer circumferential sag, due to variation in shape of the inner circumferential surface of the resin insert of a carrier.

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Takasaki, Japan

Takehiro Yuasa