Nec Corporation

Olympus Corporation

Biosense Webster (israel) Ltd.

Biosense Webster, Inc.

Kimura, Takehiro

Takehiro Kimura

Natan Sharon Katz

Gal Hayam

Masayuki Kobayashi

Yoshiro Okazaki

Seiya Isozaki

Michihiro Sugahara

Shunichiro Miyoshi

A three-dimensional (3D) electrical mapping system and method may be used to generate a 3D image of the epicardial surface of a heart by integrating one or more epicardial images with a 3D image of the cardiac structure that may be generated by real-time 3D location and mapping system for cardiac mapping and ablation. The visual textural representation of the epicardial surface of the heart may be reconstructed using, for example, an image sensor or camera-based catheter to collect images of the epicardial surface. For each image that is captured, the system and method may store the image data along with the corresponding catheter location, orientation and/or distance information relative to the cardiac structure. The location, orientation, and/or distance information may be used to reconstruct a 3D textural model of the epicardial surface of the cardiac structure.

Method to project a two dimensional image/photo onto a 3D reconstruction, such as an epicardial view of heart

Disclosed is an operation method of an endoscope, the method comprising: a sheath insertion step of percutaneously inserting at least one sheath in a pericardial cavity of a heart; an insertion step of inserting a rigid scope in the sheath; a view field securing step for securing the view field for a surgical site within the pericardial cavity; a guide step for guiding the rigid scope to the surgical site; and an observation step of observing the surgical site with the rigid scope.

Operation method of endoscope

A semiconductor device allowing a finer terminal pitch, a low profile, and easy product inspection is disclosed. A semiconductor device includes a semiconductor chip and a film substrate having the semiconductor chip connected thereon. The film substrate includes an insulating film having a plurality of openings formed in a desired pattern and a wiring layer formed in a chip-connecting surface of the insulating film. Solder balls are each directly bonded to the external connection pads through the openings. The wiring layer includes substrate pads each being connected to the chip pads of the semiconductor chip, and external connection pads each being electrically connected to these substrate pads. The external connection pads are each formed over the openings so that the openings are covered with the external connection pads on the chip-connecting surface of the insulating film, respectively.

Semiconductor device

A semiconductor device has a substrate for bumps having a first and a second surface opposite to each other. At least one groove or a plurality of holes are formed at the first surface of the substrate for bumps. A semiconductor chip is mounted on the second surface of the substrate for bumps. The semiconductor chip and the substrate for bumps are bonded by an adhesive. A plurality of bumps are formed on the first surface of the substrate for bumps.

Growing community of inventors

Tokyo, Japan

Takehiro Kimura