Tokyo Electron Limited

Toko Electron Limited

Takehiro Kato

Shinji Himori

Etsuji Ito

Yoshiyuki Kobayashi

Akira Kodashima

Shinichi Miyano

A semiconductor manufacturing device includes a stage, a plurality of pins, and a driving unit. The stage includes a mounting surface. The mounting surface has a first region for mounting thereon a substrate, and a second region for mounting thereon a focus ring. The second region is provided to surround the first region. A plurality of holes is formed in the stage. The holes extend in a direction that intersects the mounting surface while passing through the boundary between the first region and the second region. The pins are provided in the respective holes. Each of the pins has a first and a second upper end surface. The second upper end surface is provided above the first upper end surface, and is offset towards the first region with respect to the first upper end surface. The driving unit moves the pins up and down in the aforementioned direction.

Semiconductor manufacturing device and processing method

A transfer apparatus transfers an object to be transferred onto a case. The transfer apparatus includes a transfer arm, an arm shaft, a plurality of electromagnets, and a control unit. The transfer arm has a pick unit on a front end thereof and extends and retracts in a horizontal direction. The object to be transferred is held on the pick unit. The arm shaft supports the transfer arm. The plurality of electromagnets apply an force in upward direction to the transfer arm by generating a magnetic field in the case. The control unit controls the plurality of electromagnets in such a manner that when the transfer arm extends and retracts in the horizontal direction, the force in upward direction applied to the transfer arm increases as a length from the arm shaft to the front end of the transfer arm increases.

Transfer apparatus and plasma processing system

A substrate processing apparatus which enables the work efficiency of maintenance to be improved. The substrate processing apparatus comprises a plurality of processing chambersfor carrying out plasma processing on a wafer to be processed. Each processing chamberhas a chamber lidthat can be suspended and supported by a crane unit. The crane unitcomprises an air cylinderand a linear guide. The air cylinderholds the chamber lidmovably in a vertical direction thereabove. The linear guideholds the chamber lidmovably in a horizontal direction.

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Miyagi, Japan

Takehiro Kato