Kabushiki Kaisha Toshiba

Takehiro Hiramatsu

Katsuo Iwata

Toyokazu Aizawa

According to one embodiment, there is provided a camera module formed with substantially the same scale as a chip of an image sensor, includes a lens held by a lens holder, an image sensor placed in a position in which an image is formed by the lens, and a wiring board disposed between the lens and the image sensor and electrically connected to the image sensor. An opening that permits light entering the image sensor to pass therethrough is formed in the wiring board. Further, a passive component is contained in the wiring board.

Camera module

An optical head includes: a first optical element having an optical characteristic of reflecting a light of a first wavelength and transmitting lights of second and third wavelengths, on the first optical element the light of the first wavelength from a first light source being incident; and a second optical element having an optical characteristic of transmitting the light of the first wavelength, reflecting the light of the second or the third wavelength in a first polarization state and transmitting the light of the second or the third wavelength in a second polarization state, a first surface on which the light reflected by the first optical element is incident, a second surface on which the lights of the second and the third wavelengths from second and third light sources are incident, and a third surface emitting the first, the second and the third lights incident from the first and the second surfaces.

Growing community of inventors

Chigasaki, Japan

Takehiro Hiramatsu