Rohm Co., Ltd.

Takehiro Fujii

Hiroki Ishinaga

Nobuaki Suzuki

An object of the present invention is to manufacture a white light-emitting diode element by coating a blue light-emitting diode chip with a coating of a synthetic resin containing a fluorescent material. The object is achieved by bonding an LED material plate corresponding to a plurality of LED chips to an expansion sheet, dividing the LED material plate into individual LED chips, stretching the expansion sheet to widen the spacing between the LED chips, forming a synthetic resin layer between the chips, and dicing the synthetic resin layer to remove portions of the synthetic resin layer between the LED chips while leaving part of the synthetic resin layer on a side surface of each of the LED chips.

Process for producing light-emitting diode element emitting white light

A side-emission type semiconductor light-emitting deviceincludes a substrate, and the substrateis provided with a caseformed of a resin having opacity and reflectivity. The substrateis formed, on its surface, with electrodesandonto which an LED chipis bonded. A transparent or translucent resinis charged between the substrateand the casewhereby the LED chipis molded. A light-emitting surface of the side-emission type semiconductor light-emitting deviceincludes surfacesand a surface opposite to the surfacewhich are formed of the transparent or translucent resin. Furthermore, the light-emitting surface is formed by a roughened surface. Due to this, a light outputted from the LED chip and a light reflected from the caseis scattered by the light-emitting surface.

Side-emission type semiconductor light-emitting device and manufacturing method thereof

The notch is formed at one end of the board ( ) and the two notches ( and ) are formed at both sides of the other end. The first and second electrode patterns ( and ) covering, which cover the notches formed at both ends, are formed on the board surface, the light emitting diode (LED) chip ( ) is connected to the first electrode pattern ( ) and the electrode ( ) of the LED chip ( ) and the surface electrode ( ) of the second electrode pattern ( ) are bonded to each other with the metal wire ( ). The LED chip ( ) and the metal wire ( ) are embedded with the translucent resin mold . Wire bonding on the surface electrode ( ) of the second electrode pattern ( ) with the other end ( ) of the metal wire is made on the board located between the two notches ( and ). As a result, wire bonding can be made stably. Moreover, the polarity of the LED chip can be checked easily based on the appearance. Furthermore, handling jprocess can be performed smoothly.

Chip light-emitting device

A display device for performing a display by turning on selected ones of a plurality of light sources is disclosed. This display device comprises a substrate having an upper surface disposed with the light sources, a reflecting case mounted to the substrate and provided with a plurality of window holes each corresponding to one of the light sources, and a lower surface terminal portions each provided in a lower surface of the substrate and electrically connected to one of the light sources. The lower surface terminal portions are disposed in a region inward of outer edges of the substrate.

Display device and display device assembly

An LED chip component has a resin molding which can be firmly fixed to an insulating substrate even in a case where the exposed area of the insulating substrate cannot be increased any further. To achieve this object, according to a first embodiment, a resin molding is so formed as to flow into (i.e., reach the inside of) a through hole formed in an insulating substrate, and according to a second embodiment, a resin molding is so formed as to flow into two cuts formed respectively at two opposing side edges of an insulating substrate so that the resin molding holds the insulating substrate at two opposing side edges.

Light-emitting diode chip component and a light-emitting device

A semiconductor light emitting device has a light emitting chip and a conductive member. A light emitting chip is formed by an insulating substrate. A semiconductor layered portion has semiconductor layers forming a light emitting layer grown on the insulating substrate. A first electrode (p-side electrode) is formed in electrical connection with a first conductivity type semiconductor layer on a surface side of the semiconductor layered portion. A second electrode (n-side electrode) is formed in electrical connection with a second conductivity type semiconductor layer at a position exposed by partly etching the semiconductor layered portion. The light emitting chip is adhered at a backside of the insulating substrate to the conductive member through a conductive adhesive, and the conductive member is electrically connected to the second electrode.

Semiconductor light emitting device

A light-emitting diode chip having an anode electrode and a cathode electrode both arranged on its top surface is placed in a cavity formed in a base board that has conductors so laid as to extend from its top surface to its bottom surface. The anode and cathode electrodes are connected, by way of wires, to the conductors laid on the top surface of the base board, respectively, and then the light-emitting diode chip and the wires are sealed in a resin mold. The electrodes are situated at a level equal to or higher than the top surface of the base board so that the wires can be fixed on the electrodes without interference between the wire-bonding tool and the base board.

Light-emitting device

An arrangement for mounting a display device to a mother board is disclosed. The display device comprises a substrate mounted with a plurality of light sources and having an edge portion formed with a plurality of terminal portions each connected with one of the light sources, and a reflecting case formed with window holes each at a location corresponding to one of the light sources. The mother board is formed with a through hole for receiving the reflecting case, and has a lower surface formed with terminal portions. The display device has the reflecting case fitted into the through hole from a lower surface side of the mother board, with the terminal portions of the substrate electrically connected with respective terminal portions of the mother board.

Display device mounting arrangement and method

In a two-color LED chip component, the terminals are so arranged that side-surface light emission can be achieved simply by vertically mounting the insulating substrate. This LED chip component is produced by forming on the top surface of the insulating substrate three conductive patterns that extend up to one side surface of the substrate, fixing two LED elements of different colors with conductive paste onto the conductive pattern formed at the center, and connecting the LED elements individually to the other conductive patterns with wires. The central conductive pattern may be so formed as to reach the bottom surface through a through hole formed in the substrate so that it further extends to the side surface within the bottom surface.

Growing community of inventors

Kyoto, Japan

Takehiro Fujii