Kabushiki Kaisha Toyota Jidoshokki

Takehiko Sawada

Tomoaki Asai

Hitoshi Shimadu

Ryou Yamauchi

Takahiro Hayakawa

Kazunori Kondou

Disclosed is a wiring substrate that is provided with a wiring pattern formed from a metal plate, and an insulation layer as a base material to which the wiring pattern is to be fixed. The wiring pattern has a mounting pad for having electronic parts () surface-mounted. Electronic parts are mounted onto the surface of the wiring pattern, by pouring solder into the mounting pad of the wiring pattern.

Wiring substrate and manufacturing method for wiring substrate

Provided is a circuit board manufacturing method capable of securing circuit patterns on a plate-like insulator while keeping the relative position between the circuit patterns, and also provided is a circuit board in which the relative position between a plurality of circuit patterns is kept. A first coil () having one turn is formed in a planar shape from a metal plate. Next, a second coil () having four turns is formed in a planar shape from a metal plate, wherein both of the ends () of the coil are linked to other adjacent regions via linking portions (). A pair of the first coil () and the second coil () are then overlapped so as to face each other through a plastic plate () in which a plurality of prepregs are stacked, after which the links by the linking portions () are disconnected.

Growing community of inventors

Obu, Japan

Takehiko Sawada