Hitachi-High-Technologies Corporation

Hitachi-Science Systems, Ltd.

Takehiko Konno

Hiroshi Miyai

Kazuo Aoki

Naomasa Suzuki

Satoshi Takada

Ryuichi Funatsu

Kouichi Kurosawa

Masanari Furiki

Takayuki Hoshino

The objective of the present invention is to simultaneously achieve image observations at a high resolution using an electron microscope, and X-ray analysis at a high energy-resolution using a microcalorimeter. An X-ray detector is disposed at a position where the intensity of the magnetic field from an objective lens is weaker than the critical magnetic field of a material used in a thermal insulation shield for a superconducting transition-edge sensor or a microcalorimeter. In addition, an optical system for transmitting X-rays to the detector is inserted between a sample and the detector. Alternatively, a magnetic field shield for shielding the X-ray detector is used.

Electron microscope

Provided is a defect review technique that can accurately correct coordinate differences with respect to unusual defects in which it is difficult to accurately correct coordinate misalignments by conventional automatic fine alignment. If it is impossible to correct a coordinate misalignment on the basis of a first optical microscope image acquired by a first light source, a defect review apparatus acquires a second optical microscope image using a second light source, and determines whether it is possible to correct the coordinate misalignment on the basis of the second optical microscope image.

Defect review apparatus and method for correcting coordinate misalignment using two light sources

An inspection system includes a SEM visual inspection apparatus for detecting a defect in a semiconductor sample in steps of manufacturing a semiconductor device and a review apparatus for observing, at a high resolution, the defect in the semiconductor sample detected by the SEM visual inspection apparatus. The system has a function of transmitting an alignment dictionary image as one of alignment parameters to be set by the SEM visual inspection apparatus using an inspection recipe to the review apparatus.

Method of alignment for efficient defect review

The object of the present invention is to transmit the position information of a defect that has been specified by means of a circuit pattern inspection apparatus quickly and precisely so that the position information is efficiently used in another apparatus. Marking is carried out on the peripheral area of the defect by use of a charged particle beam irradiation mechanism of the inspection apparatus. The marking realizes sharing of the defect position information with another apparatus. The marking technique includes deposition of a deposit and charging up by means of irradiation of a charged particle beam. The marking in the inspection apparatus allows the defect position information to be transmitted to another apparatus more correctly and easily, and as a result, analysis accuracy is improved and analysis time is shortened.

Growing community of inventors

Mito, Japan

Takehiko Konno