Konica Minolta, Inc.

Otsuka Pharmaceutical Company, Limited

Konica Minolta Opto, Inc.

Wako Pure Chemical Industries, Inc.

Takehiko Goshima

Yoshihiro Okumura

Hiroshi Umetsu

Seiji Yuasa

Kanji Sekihara

Hiroshi Hirayama

Naoki Shimizu

Takashi Washizu

Toshinori Takimura

Yoshiyuki Masuda

Yoshifumi Imazu

Kenta Fuji

An injection molded article is obtained by injection molding a molten resin into a mold. The injection molded article includes: a base as a thin plate-shaped member that is connected to a gate of the mold; and a plurality of protrusions each integrally molded on the base and having a thickness greater than a plate thickness of the base. The plurality of protrusions have holes each extending through the base, and the holes in the respective protrusions are connected through another component to form a flow channel. A processed region processed to have a surface roughness greater than a surface roughness of a mirror surface region including a region between the holes on the base is formed in a projected region where a region having a predetermined thickness value is projected on the base.

Injection molded article

To provide a method for manufacturing an optical element, which improves the surface precision of the optical surface as well as reducing the birefringence at a low cost. A method for manufacturing an optical elementA having optical surfacesandand a non-optical surfaceA that is adjacent to the optical surfacevia a ridge by injection molding includes forming the non-optical surfaceA with a mold surface. The mold surface includes a sink forming areaas a first area having a first surface roughness, and a high transfer areaas a second area having a second surface roughness different from the first surface roughness. The second area is located outside the first area.

Optical element and method for manufacturing optical element

A prism () is configured from a dielectric medium and is used in analysis using surface plasmons. The prism () is provided with an incidence surface () on which excitation light from outside is incident, a reflection surface () on which excitation light having entered the incidence surface () is reflected, an emission surface () from which excitation light reflected by the reflection surface () is emitted, and an opposing surface () opposing the reflection surface (). A gold film () is formed on the reflection surface (). The opposing surface () has a sink-mark surface (), and the sink-mark surface () is a transparent surface.

Prism, prism production method, mold, and sensor chip

There is provided a forming moldmade on the basis of a standard more reliable than an average roughness of a surface of a metal film that generates surface plasmon resonance, the forming mold being capable of improving an S/N ratio of an optical element. A forming moldfor a substrateof an optical elementused for measurements utilizing surface plasmon, wherein an Spc value of a molding surfacefor transferring a shape onto a surfaceof the substrateon a side facing an object to be measured is equal to or less than 100 [1/mm].

Forming mold, optical element, and method for producing optical element

A prism used in analysis utilizing surface plasmons is prism of a dielectric medium with a predetermined reflective index. Trapezoidal prism comprises an incident surface on which excitation light is incident from outside, a reflective surface at which the excitation light incident on the incident surface is reflected, an emission surface from which the excitation light reflected by the reflective surface is emitted; and an opposite surface which opposes the reflective surface. The opposite surface is a recessed sink mark surface.

Prism and sensor chip

A prism used in analysis utilizing surface plasmons is prism of a dielectric medium with a predetermined reflective index. Trapezoidal prism comprises an incident surface on which excitation light is incident from outside, a reflective surface at which the excitation light incident on the incident surface is reflected, an emission surface from which the excitation light reflected by the reflective surface is emitted; and an opposite surface which opposes the reflective surface. The opposite surface is a recessed sink-mark surface.

A microchip having a substrate, a cover member joined to one surface of the substrate, and a flow path formed on at least one of joined surfaces of the substrate and the cover member, wherein the microchip includes: a well which is an first opening for communicating into the flow path with a surface opposite to the joined surface of the substrate and is arranged on the substrate; and a chimney which is a member arranged so as to project from the surface opposite to the joined surface of the substrate and has an second opening which communicating into the well, wherein a liquid rise prevention section is formed in the chimney to prevent the liquid from rising to a top portion of the chimney.

Microchip

A method for producing a resin molding die () for molding a first substrate () having a flow path () and a through-hole (), wherein a base die () having a concave part () corresponding to the flow path () and a through-hole () corresponding to through-hole () and deeper than the concave part () is prepared, the base die () is subjected to electroforming with a first material and is then subjected to electroforming with a second material which is different from the first material, and a protruding part for forming through-hole () by removing the first material that was electrodeposited on through-hole () is formed. The first material has a smaller electroforming stress than the second material, the first material exerts a higher adhesiveness with regard to the base die than the second material, and the second material is harder than the first material.

Manufacturing method of resin molding mold, resin molding mold, resin molding mold set, manufacturing method of microchip substrate, and manufacturing method of microchip using said mold

A microchip which comprises: a resinous base having a plurality of fine channels formed on one side thereof, one or more cylindrical parts disposed so as to protrude from the other side, and a through-hole which pierces each cylindrical part along the axis thereof and communicates with the fine channel so that the diameter of the inner wall of the through-hole gradually decreases from the tip end of the cylindrical part toward the fine channel at a first inclination angle; and a resinous covering member bonded to that side of the resinous base on which the fine channels have been formed. The microchip has been configured so that a liquid sample can be introduced from the tip end of each cylindrical part through the through-hole. The wall thickness of the cylindrical part on the end side where a liquid sample is to be introduced has been made smaller than the wall thickness thereof on the base side where the cylindrical part has been formed, by forming a step therebetween.

Microchip and process for producing microchip

A die () is provided with: a cavity which can contain a molten resin; a micro-structure () provided on a molding transfer surface () forming the cavity such that the fine structure protrudes to the cavity side from the molding transfer surface (); and a anti-shrinkage convex section () protruding higher than the micro-structure () to the cavity side from one surface. A molten resin is applied to the die () and the surface of the die is relatively removed in the order of the micro-structure () and the anti-shrinkage convex section () from a resin substrate () formed by solidifying the resin.

Growing community of inventors

Kunitachi, Japan

Takehiko Goshima