Hitachi, Ltd.

Takehide Yokozuka

Masahide Harada

Hiroshi Hozoji

Eiji Matsuzaki

Nobuyuki Ushifusa

Masahiko Asano

Takehiko Hasebe

Koji Sato

Shuji Eguchi

Isamu Yoshida

Kaoru Uchiyama

Michiaki Hiyoshi

Shiro Yamashita

Yujiro Kaneko

Nobutake Tsuyuno

Atsuo Nishihara

Keisuke Horiuchi

Hideto Yoshinari

Akihiro Muramoto

A power module includes a substrate having a surface on which a plurality of wiring patterns are formed, a semiconductor device mounted on the substrate and electrically connected to a part of the plurality of wiring patterns, and a terminal portion with a lead electrically connected to the other part of the plurality of wiring patterns, and is configured that the lead of the terminal portion is formed by laminating a plurality of metal members which contain a material substantially the same as or softer than the material for forming the other part of wiring patterns, and the material of the plurality of metal members, which is the same as or softer than the material for forming the other part of wiring patterns is electrically connected to the other part of wiring patterns through ultrasonic bonding.

Power module and manufacturing method thereof

A semiconductor power module includes an insulated substrate with a plurality of power semiconductor devices mounted thereon and a heat sink for radiating heat generated from the plurality of power semiconductor devices, wherein the heat sink is integrally molded with a plurality of radiation fins on one surface of a planate base by forging work such that a metallic material filled into a female die of a predetermined shape is pressed by a male die of a predetermined shape, and the insulated substrate is bonded by metallic bonding to another surface of the base of the heat sink opposite the one surface of the base of the heat sink on which the radiation fins are formed.

Semiconductor power module, inverter, and method of manufacturing a power module

An engine control unit for controlling an automobile engine, which is equipped with a booster circuit for boosting the voltage of battery power source, an injector driving circuit for driving an injector by making use of a boosted high voltage, and a microcomputer for controlling the engine; wherein the engine control unit is featured in that an LC module mounted with a booster coil constituting the booster circuit and with an electrolytic capacitor, a power module mounted with a rectifying device constituting the booster circuit and the injector driving circuit and with a switching device, and a control circuit board mounted with the microcomputer and with a connector acting as an interface for an external member of the engine control unit are laminated each other. The power module is partitioned into at least two portions and fixedly contacted, through a heat radiation part, with a housing cover, and heat radiation fins are arranged on an outer surface of the housing cover where the power module is disposed.

Engine control unit

In an electronic device having an interposer substrate as an MCM structure, heat dissipation properties are enhanced while the reliability of joint between the interposer substrate and a motherboard is maintained. In the invention, a metal core base material of great heat capacity and high thermal conductivity is used for both the interposer substrate and the motherboard. Furthermore, a part where a core metal is exposed is provided on at least one of the interposer substrate and the motherboard. A solder joint pad is directly formed on the core metal exposed part, and the interposer substrate is solder-joined to the motherboard.

Electronic device

An electronic device includes a pair of members which are connected to each other by a connecting portion layer interposed between connecting portions respectively formed thereon and which have thermal expansion coefficients different from each other. The connection layer is formed by diffusion reaction between the metal layers by which the metal layers are melted only in the vicinity of a contact interface between the layers, the metal layers being formed on the connecting portions with materials different from each other. At least one of the metal layers is formed by plating, thereby the connection layer is formed in a thickness sufficient to absorb differences in thermal expansion coefficients between the pair of members. Since melting temperature of the connection layer after the pair of members have been connected to each other is increased compared with melting temperature of each of the members in the diffusion reaction, the connection layer is prevented from being damaged due to heating treatment performed after the connection has been made, consequently excellent reliability of the electronic device is secured.

Si power device mounted on a substrate including arrangements to prevent damage to connection layers due to heat treatment

An electronic device comprises a circuit board which has a through hole and uses a resin with a glass transition temperature exceeding 150&#xb0; C. as a base member, a metal casing which has an opening, and a connector which is fitted to the opening of the metal casing in which a pin of the connector is inserted into the through hole, the pin and the through hole are connected with a conductive member, and a reinforcement member for securing the connector and the board is further provided on the conductive member, thereby improving the reliability of the electronic device.

The invention provides an electronic apparatus having a metal core substrate including a metal plate, an insulating layer formed on the metal plate and a conductive layer formed on the insulating layer, and an electronic part, and to which the conductive layer and a terminal of the electronic part are connected. In the electronic apparatus, a member having a high thermal conductivity is arranged so as to be in contact with both of the metal plate and the electronic part. Accordingly, a heat radiating property of the electronic apparatus is increased.

Growing community of inventors

Yokohama, Japan

Takehide Yokozuka