Shin-etsu Chemical Co., Ltd.

Takita Patent & Engineering

Takehide Okami

Tokio Sekiya

Hironao Fujiki

Yoshio Inoue

Masayuki Ikeno

Takeshi Hashimoto

Masanobu Miyakoshi

Kaoru Michimata

Hiroyasu Hara

Hitoshi Kinami

Noboru Shimamoto

Koji Yokoo

Masaya Arakawa

Makoto Satoh

Yuji Hinoto

Yuuki Sakurai

Tomokazu Washio

Hajime Kiriki

Thermally conductive composite sheets which comprise a silicone rubber layer which contains thermally conductive fillers and has an Asker C hardness from 5 to 50, and a porous reinforcing material layer which has pores of at least 0.3 mm in diameter and is incorporated within the silicone rubber layer. The thermally conductive composite sheets of the present invention are superior in thermal conductivity and flexibility (for contact towards the electronic parts and so on) and are suitable for mass production and for the assembly process of electronic instruments. Therefore, utilization of the thermally conductive composite sheets enables the effective production of electronic instruments wherein performance degradation caused by heat hardly occurs.

Thermally conductive composite sheets and manufacturing method thereof

A heat conductive BN filler having a cohesive factor of 3-50% is provided. An electrically insulating/heat dissipating sheet is obtained by mixing the BN filler with an organopolysiloxane and a crosslinking agent, shaping the resulting silicone rubber composition into a sheet form, followed by vulcanization. Without special orienting means, the BN particles are oriented in the sheeting step such that their a-axis is perpendicular to the sheet surface.

Heat conductive BN filler and electrically insulating/heat dissipating

An adhesive sheet is obtained by sheeting a claylike silicone composition comprising an organopolysiloxane, a filler, and an adhesive aid to a gage of 0.1 to 5 mm. The adhesive sheet is easy to handle and bondable to such adherends as metals and plastics to exert a high bond strength.

Sheet-shaped adhesive composition

The composite silicone rubber sheet comprises a thermal conductive silicone rubber layer, both surfaces of which are tacky, containing a thermal conductive filler such as aluminum oxide and having a Asker C hardness of 5 to 50 and a thickness of 0.4 mm or less; at least one reinforcing sheet such as glass cloth arranged within said silicone rubber layer; and a releasable protective sheet such as a release paper covered on at least one tacky surface of said silicone rubber layer. Since the composite silicone rubber sheet is superior in thermal conductivity and has a good flexibility and tackiness, when used as a heat dissipating insulation sheet, the composite silicone rubber sheet has the advantages of being superior in adherence, free of oil-bleeding, suitable for mass-production, and capable of not lowering workability in assembling electronic parts and the like. The composite silicone rubber sheet is thin and lightweight and has a superior thermal conductivity, so that it can be used in the heat dissipation of a display panel for mounting on motor vehicles, railway vehicles or aircrafts.

Thermal conductive composite silicone rubber sheet

An anti-dust gel sheet characterized in being formed from layers of a silicone gel, having a penetration of 20-130 after curing, coated on both sides of a sheet like reinforcing material is disclosed. Since the sheet has a suitable penetration, damage of the sheet does not easily occur and it can therefore be used repeatedly.

Anti-dust gel sheet

Disclosed is a heat conductive silicone rubber composition comprising a cross-linkable organopolysiloxane composition and a filler, with the filler being magnesium oxide treated so as to have a hydrophobic surface and having a content of from 30 to 70% by volume in the composition.

Heat conductive silicone rubber composition

A fuser roll having a metal core shaft has a resilient layer placed around the metal core shaft with at least the surface layer of the resilient layer comprising a fluorosilicone rubber layer containing 5 to 50 wt. % polytetrafluoroethylene. Since this fuser roll is excellent in releasability and silicone oil resistance, the durability is excellent, and the image obtained by a copying machine wherein the roll is used becomes sharp.

Fuser roll

A gel-forming silicone composition comprising, compounded in a gel-forming base composition, a silane compound having the following general formula (1) or (2): ##STR1## wherein R.sup.1 is an alkyl or aryl group, R.sup.2 is an alkyl or alkoxyalkyl group, R.sup.3 and R.sup.4 are each a hydrogen atom, a methyl group or an ethyl group, R.sup.5 is an alkyl group or an ester linkage-containing group, and a, b and n are each an integer from 0 to 2. The composition is capable of forming, under mild conditions, a silicone gel which exhibits good adherence to a variety of substrates.

Gel-forming silicone composition

Heat curable organopolysiloxane compositions of this invention comprise (A) organopolysiloxanes with at least two alkenyl groups within the molecule, (B) capsules containing organo hydrogen polysiloxanes which comprise (B-1) organo hydrogen polysiloxanes with at least two hydrogen atoms which are bound to silicon atoms within the molecule and (B-2) a thermoplastic resin having a softening point or glass transition temperature in the range from 40.degree. to 200.degree. C., wherein the component (B-1) forms a single nucleus or multiple nuclei and the component (B-2) is a wall material, and (C) platinum group metallic catalysts. The said compositions contain a crosslinking agent which is encapsulated with thermoplastic resins, therefore they possess a superior stability during room temperature storage for a long time period, and the heating of the compositions forms a rapid and uniform crosslinking to prepare the cured products.

Heat curable organopolysiloxane compositions

An addition-curable type organopolysiloxane composition having a volume resistivity of 10.sup.7 .OMEGA.cm or below, comprising (A) an organopolysiloxane having at least two alkenyl group in its molecule and a viscosity at 25.degree. C. of from 100 to 200,000 cSt, (B) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in its molecule, (C) a platinum group metal catalyst, (D) an organosilicon compound which has at least one silicon-bonded hydrogen atom in its molecule and in which at least one member selected from the group consisting of epoxy group-containing organic groups and alkoxy groups is attached to a silicon atom, and (E) an electrically conductive filler. This composition can be cured by an ultra high frequency heating system to form an adhesive cured product. It is therefore possible to obtain cured products with stable physical properties under constantly fixed conditions irrespective of the heat capacity of adherends.

Organopolysiloxane composition and process for producing cured product

An addition-curable type silicone rubber composition comprising (A) an organopolysiloxane having an alkenyl group such as vinyl in its molecule, (B) an organohydrogenpolysiloxane having at least two SiH groups in its molecule, (C) a platinum catalyst such as platinum, chloroplatinic acid, etc., (D) an inorganic filler, (E) an organic titanium compound such as tetraethyl titanate, and (F) water. The composition exhibits good fluidity, and behaves like a Newtonian fluid, even where carbon black or a silica or alumina having an average particle diameter of 1 .mu.m or above is incorporated in the composition as an inorganic filler for improving such characteristics as heat resistance, thermal conductivity, etc.

Silicone rubber composition with improved fluidity

Adhesive composition

The adhesive organopolysiloxane composition contains a compound having two or more allyl ester groups in combination with an adhesion imparting agent of a silicon compound having at least one group selected from the group consisting of an alkoxy group and an epoxy containing hydrocarbon group and also having at least one silicon-bonded hydrogen atom. This composition is markedly improved in adhesion to various substrates and durability of the adhesion.

Adhesive organopolysiloxane composition

An addition-type silicone rubber composition comprising (a) an organopolysiloxane containing at least two alkenyl groups bonded to the silicon atoms in one molecule, (b) an organopolysiloxane containing one alkenyl group bonded to the silicon atom in one molecule on an average, (c) an organohydrogenpolysiloxane containing at least two hydrogen atoms bonded to the silicon atoms, (d) a platinum catalyst; and a product of curing the composition. This silicone rubber composition can give a low-modulus silicone rubber by curing which neither contaminates the material in contact therewith nor deforms owing to shrinkage, without hindering the adhesion of the composition during its curing stage.

Curable silicone rubber compositions and products of curing thereof

A curable silicon composition comprising:

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Annaka, Japan

Takehide Okami