Dow Corning Toray Company, Ltd.

The Yokohama Rubber Co., Ltd.

Dow Corning Corporation

Sika Hamatite Co., Ltd.

Nippon Chemi-con Corporation

Takeaki Saiki

Yoshihito Takei

Kazunori Ishikawa

Makoto Iwai

Anil Kumar Tomar

Haruhiko Furukawa

Takahiro Okamatsu

Keiji Wakita

Yasushi Sugiura

Yoshinori Taniguchi

Tsubasa Ito

Emi Kim

Motoki Takuma

Hirotugu Ashino

Yuichiro Karasawa

A photocurable resin of the present technology contains: a main backbone chain having repeating units represented by Formulas (Ia) and (Ib), and a (meth)acryloyl group and a non-photoreactive group at terminals; the non-photoreactive group being at least one type selected from the group consisting of saturated hydrocarbon groups and aromatic hydrocarbon groups which optionally have a heteroatom; a hydroxy group, an amino group, &#x2014;CH&#x2550;NH, a carboxy group, or a mercapto group being not bonded to an end of the non-photoreactive group; a content of the repeating unit represented by Formula (Ia) being greater than 15 mol % of an amount of the main backbone chain; and contents of the (meth)acryloyl group and the non-photoreactive group each being 5 mol % or greater of an amount of the ends. 

Photocurable resin, mixture, and photocurable resin composition

The curable resin composition of the present technology includes: (A) a straight-chain organopolysiloxane having at least two silicon-bonded hydrogen atoms and at least one aryl group in one molecule and having an average degree of polymerization of greater than 10; (B) a branched-chain organopolysiloxane having at least three alkenyl groups and at least one aryl group in one molecule; and (C) a hydrosilylation reaction catalyst; wherein a proportion of diphenylsiloxane units relative to an amount of all siloxane units is 10 mol % or greater, and the all siloxane units containing siloxane units derived from the straight-chain organopolysiloxane (A) and the branched-chain organopolysiloxane (B).

Curable resin composition

A silanol condensation catalyst including at least the zirconium metal salt expressed by Formula (I) below (wherein n is an integer from 1 to 3; each Ris a hydrocarbon group having from 1 to 16 carbons; and each Ris a hydrocarbon group having from 1 to 18 carbons. A heat-curable silicone resin composition for sealing optical semiconductors includes 100 parts by mass of a polysiloxane containing two or more silanol groups in the molecule; from 0.1 to 2,000 parts by mass of a silane compound containing two or more alkoxy groups that are bonded to a silicon atom in the molecule; and a zirconium metal salt expressed by Formula (I). A sealed optical semiconductor is formed by sealing a LED chip by applying the heat-curable silicone resin composition to the LED chip, heating the LED chip, and curing the heat-curable silicone resin composition. 

Silanol condensation catalyst, heat-curable silicone resin composition for sealing photosemiconductors and sealed photosemiconductor using same

A silanol condensation catalyst including at least the zirconium metal salt expressed by Formula (I) below (wherein n is an integer from 1 to 3; each Ris a hydrocarbon group having from 1 to 16 carbons; and each Ris a hydrocarbon group having from 1 to 18 carbons.) A heat-curable silicone resin composition for sealing optical semiconductors includes 100 parts by mass of a polysiloxane containing two or more silanol groups in the molecule; from 0.1 to 2,000 parts by mass of a silane compound containing two or more alkoxy groups that are bonded to a silicon atom in the molecule; and a zirconium metal salt expressed by Formula (I). A sealed optical semiconductor is formed by sealing a LED chip by applying the heat-curable silicone resin composition to the LED chip, heating the LED chip, and curing the heat-curable silicone resin composition. 

A heat-curable silicone resin composition for sealing optical semiconductors including: component (A): 100 parts by mass of a silicon compound expressed by Formula (1) below; and component (B): from 0.001 to 10 parts by mass of a condensation catalyst.(RSiO)((R)SiO)((R)SiO)(SiO)(XO)&#x2003;&#x2003;(1) In this formula, R, R, and Rare identical or differing monovalent organic groups, 'X' is a hydrogen atom or a monovalent organic group, 'a' is a positive number, &#x201c;b&#x201d; is 0 or a positive number, &#x201c;c&#x201d; is 0 or a positive number, &#x201c;d&#x201d; is 0 or a positive number, and &#x201c;e&#x201d; is 0 or a positive number; however &#x201c;a&#x201d; to &#x201c;e&#x201d; satisfy the following conditions: b/a is a number from 0 to 10, c/a is a number from 0 to 0.5, d/(a+b+c+d) is a number from 0 to 0.3, and e/(a+b+c+d) is a number from 0.01 to 1.5.

Heat-curable silicone resin composition for sealing optical semiconductors, and a sealed optical semiconductor using the same

A bis[tri(hydroxypolyalkyleneoxy)silylalkyl] polysulfide, i.e., a polysulfide that contains bonded hydroxypolyalkyleneoxy groups instead of alkoxy groups in the bis(trialkoxysilylalkyl) polysulfide; a method of manufacturing of the aforementioned polysulfide by heating a bis(trialkoxysilylalkyl) polysulfide and a polyalkyleneglycol; a tire rubber additive to a tire rubber composition that comprises a bis[tri(hydroxypolyalkyleneoxy)silylalkyl] polysulfide alone or a mixture of bis[tri(hydroxypolyalkyleneoxy)silylalkyl] polysulfide and a polyalkyleneglycol; and a tire rubber composition that contains the aforementioned additive.

Bis [tri (hydroxypolyalkyleneoxy) silylalkyl] polysulfide, method of manufacturing bis [tri (hydroxypolyalkyleneoxy) silylalkyl] polysulfide, tire rubber additive, and tire rubber composition

The present invention relates to a compound represented by the following general formula (I): wherein in which

4-hydroxyphenylalkylamine derivative

A curable silicone resin composition has excellent closed-system curability, adhesiveness, heat-resistant coloration stability, and balance between transparency and adhesive strength. The curable silicone resin composition is a curable silicone resin composition comprising 100 parts by mass of a silicone A, the weight-average molecular weight of which is 20,000 to 200,000, and which has 2 or more (meth)acryloyl groups per molecule; 10 parts by mass or more of a silicone B, the weight-average molecular weight of which is 1,000 or greater but less than 20,000, and which has 2 or more (meth)acryloyl groups per molecule; 2 parts by mass or more of a silicone C, the weight-average molecular weight of which is 300 or more but less than 1,000, the (meth)acrylic equivalent of which is less than 450 g/mol, and which has 2 or more (meth)acryloyl groups per molecule; and a radical initiator.

Curable silicone resin composition

A method for manufacturing a bis(silatranylalkyl) polysulfide by heating a bis(trialkoxysilylalkyl) polysulfide and triethanolamine in the presence of a catalytic quantity of an alkali-metal alcoholate, thus substituting all Si-bonded alkoxy groups of the bis(trialkoxysilylalkyl) polysulfide with a (OCHCH)N group; a method for the preparation of a mixture of a bis(silatranylalkyl) polysulfide and a (silatranyalkyl)(trialkoxysilyl) disulfide or a mixture of a bis(silatranylalkyl) polysulfide, a (silatranylalkyl)(trialkoxysilyl) disulfide, and a bis(trialkoxysilylalkyl) polysulfide by heating a bis(trialkoxysilylalkyl) polysulfide and triethanolamine in the presence of a catalytic quantity of an alkali-metal alcoholate, thus substituting a part of Si-bonded alkoxy groups of the bis(trialkoxysilylalkyl) polysulfide with a (OCHCH)N group; a mixture of a bis(silatranylalkyl) polysulfide and a (silatranylalkyl)(trialkoxysilyl) disulfide; a mixture of a bis(silatranylalkyl) polysulfide, a (silatranylalkyl)(trialkoxysilyl) disulfide, and a bis(trialkoxysilylalkyl) polysulfide; and a rubber composition containing the aforementioned mixture.

Method for manufacturing a bis(silatranylalkyl) polysulfide, method for manufacturing a mixture of bis(silatranylalkyl) polysulfide etc., a mixture of bis(silatranylalkyl) polysulfide etc., and rubber composition

To provide a highly efficient and stable method for the preparation of a silicon-containing polysulfide-type polymer, in particular, a polysulfide-type polymer with organosilyl groups, the method being carried out without generation of by-products that could have high impact on the environment. A method for the preparation of a silicon-containing polysulfide-type polymer characterized by mixing (A) a silicon-containing compound having a silicon atom-bonded monovalent organic group having an aliphatic unsaturated bond; (B) a polysulfide polymer with at least two mercapto groups in one molecule; and (C) an organic base or ammonia; the mixing being carried out in the presence of (D) sulfur.

Method for the preparation of a silicon-containing polysulfide-type polymer

An organic silicon compound represented by the following general formula: ClCHCH(CF)COORSi(R)(R)(wherein, Rindependently designates the same or different substituted or unsubstituted hydrocarbon groups having 1 to 20 carbon atoms, Rindependently designates the same or different groups selected from halogen groups or hydrolysable groups having 1 to 20 carbon atoms, Rdesignates substituted or unsubstituted alkylene groups having 1 to 20 carbon atoms, and 'n' is an integer from 0 to 3). The organic silicon compound is suitable for use as a preferable precursor in the manufacture of silanes that contain (2-trifluoromethylacryloxy)alkyl groups.

Silahydrocarbyl esters of 3-chloro-2-trifluoromethylpropionic acid, their preparation and preparation of the corresponding acrylic acid esters

A method for the preparation of a chain hydrocarbon halosilylated at its terminal carbon atom or terminal carbon atoms by subjecting a diene-type compound and a hydrogenhalosilane to a hydrosilylation reaction in the presence of a hydrosilylation catalyst and an ether compound having no aliphatic triple bond. A method of conducting a hydrosilylation reaction between a diene-type compound that has vinyl groups on both terminals and a hydrogenhalosilane in the presence of a hydrosilylation catalyst and an ether compound having no aliphatic triple bond.

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Hiratsuka, Japan

Takeaki Saiki