Nagano Keiki Co., Ltd.

Asahi Kasei Kogyo Kabushiki Kaisha

Kabushiki Kaisha Sega Enterprises

Nec Corporation

Takayuki Yokoyama

Shuji Tohyama

Ikuya Miyahara

Toshiaki Okumura

Toshiyuki Maeda

Masayoshi Yamada

Taishi Yasuda

Nobuaki Yamada

Mitsuru Kawamura

Kouzou Yamagishi

Yukinobu Iimori

Ichiro Kawaoka

Hiroshi Wakabayashi

Kenji Kobayashi

Yoji Serizawa

Nobuatsu Watanabe

Yoshikazu Kaneko

Kazuo Toyomoto

Yasuo Watanabe

Yoshiaki Nakayama

Haruhiko Sekiya

Hayato Kobayashi

Kazuo Ichinokawa

Yasutaka Ide

Fumio Ando

Kunihiro Yamaura

Shuzi Tohyama

Yasuo Yasuda

Takashi Ogawa

A cap is provided on a diaphragm, and a first end of a flexible board is connected to the cap. A cover is attached to the cap. The cover directs a second end of the flexible board in a direction away from the diaphragm held by a joint so that the flexible board is supported while being curved. Since the flexible board is not locally bent at an acute angle, a crack is not generated on a copper pattern provided on the flexible board.

Flexible board sensor and manufacturing method of sensor

A method of manufacturing a pressure sensor is provided whereby the pressure sensor includes a joint, a diaphragm, and an adapter disposed between the joint and the diaphragm. The adapter includes an axis portion and a flange projecting in a radial direction from the axis portion. The axis portion is disposed such that one end does not interfere with the joint and the other end is welded to the diaphragm. The diaphragm is welded to the adapter and the welded portion the welded portion is positioned on an inner side of an end face of the joint. The joint is caulked to a peripheral edge of the flange of the adapter.

Method of manufacturing a pressure sensor

A pressure sensor is provided with a cap on a measuring portion of a diaphragm to which a first end of a flexible board is connected while a second end of the flexible board is connected to a circuit board spaced apart from the diaphragm. The flexible board is provided with the first end, a belt portion that is bent at an angle of ninety degrees or more relative to the first end in a direction to be away from the circuit board and is curved along the outer circumference of the diaphragm, and the second end that is bent at an angle of ninety degrees or more relative to the belt portion to be connected to the circuit board.

Sensor and manufacturing method of sensor

An adapter () disposed between joint () and diaphragm () includes an axis portion () and a flange () projecting radially from the axis portion (). The axis portion () is arranged so that one end thereof does not interfere with the joint () and the other end is welded to the diaphragm (), and the joint () is caulked to a peripheral edge of the flange (). Since the diaphragm () is not directly joined to the joint (), welding is not performed near the joint (), but can be performed in a wide space where equipment is suitably arranged. In addition, caulking operation of the joint () to the adapter () can be performed by pressing a caulking portion (C) formed in advance in the joint () against the outer peripheral edge of the flange (), so that a wide space is unnecessary for caulking.

Pressure sensor

A pressure sensor () includes a diaphragm () with a bottom formed of a thin-wall portion () and a pressure introducing joint (), in which an austenitic precipitation hardening Fe&#x2014;Ni heat resisting steel having high mechanical strength is used for the diaphragm (), while an austenitic stainless steel that is relatively inexpensive is used for the pressure introducing joint (). The diaphragm () and the pressure introducing joint () are integrated by welding, and Ni content of a weld portion is appropriately adjusted. Thereby, the pressure sensor () achieves high accuracy and reliability, and usage amount of the expensive austenitic precipitation hardening Fe&#x2014;Ni heat resisting steel can be minimized in manufacturing the pressure sensor (). Also, since the austenitic stainless steel has an excellent corrosion resistance, the pressure sensor () can be used in measurement of a fluid with high corrosiveness.

Image processing device, image processing method, game device, and craft simulator

A pipe having a through-hole of smaller diameter than a pressure port is disposed in the pressure port. Therefore, a volume of the pressure port can be reduced by the thickness of the pipe, thereby improving response of a pressure sensor. Furthermore, there is no need for the pressure port having smaller diameter to be provided by drill processing, so that a volume in the pressure port can be easily adjusted. Accordingly, the volume in the pressure port can be reduced with a simple structure to improve response of the pressure sensor.

A pressure sensor (,) having a first terminal (,), the first terminal (,) including a horizontal portion (,) and a vertical portion (,) at an intermediate portion thereof and being elastically deformable. A portion of the first terminal (,) being inserted and soldered to a circuit substrate (,) has a collar portion (,) being abutted around a through-hole (,) of the circuit substrate (,). The first terminal (,) is fixed at a state being pressed to the circuit substrate (,) by the collar portion (,) and being slightly compressed between a base member (,). When the circuit substrate (,) and the base member (,) are spaced apart by circumambient heat, the first terminal (,) can follow by the compressed margin. When the first terminal (,) itself is thermally expanded, the first terminal (,) can follow by an elastic deformation of the horizontal portion (,) and the vertical portion (,). Accordingly, stress caused to the soldered portion by a thermal deformation and the like can be relaxed so that the pressure sensor (,) can be applied to a wider temperature range.

In an audiovisual communication, a first high fram rate video signal is derived from a motion image and converted to a low fram rate low resolution multiframe signal. A second high frame rate video signal is derived from an still image and converted to a single frame high resolution signal. Because of the low frame rates, the frequencies of the low and high resolution signals are within the range of frequencies of a telephone exchange line. A switching matrix is provided to sequentially couple both the low and high resolution signals to a transmission line in response to a mode select signal. The single frame high resolution signal is stored into a memory at the receiving end and repeatedly retrieved out of the memory into a display through the switching matrix.

Videotelephone apparatus for transmitting high and low resolution video

There is disclosed a hollow fiber semipermeable membrane element comprising hollow fiber semipermeable membranes having their respective one end portions or both end portions bonded together by means of a vulcanized rubber, so that the semipermeable membrane element has a high resistance to chemicals. The incorporation of a graphite fluoride in the rubber serves to further increase not only the hardness of the bonding rubber portions but also the resistance of the bonding rubber portions to chemicals. Such a semipermeable element can be easily, efficiently produced on a commercial scale.

Hollow fiber semipermeable membrane element and a method of producing

Polymers of ethylene having incorporated therein (1) 5-50 weight parts of a rubber and/or an elastomer based on 100 weight parts of the ethylene polymers, (2) a crosslinking agent selected from bis(tert. alkylperoxy)-alkane or bis(tert. alkylperoxy)benzene, and (3) 0.5-5 times by weight the amount of the crosslinking agent, of at least one cross-linking aid selected from 1,2-polybutadiene, triallyl cyanurate and triallyl isocyanurate, are rotationally molded to produce molded articles possessing good release characteristics as well as high impact strength and enhanced surface luster.

Polyethylene composition for rotational molding

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Tokyo, Japan

Takayuki Yokoyama