Nitto-denko Corporation

William Marsh Rice University

Japan Synthetic Rubber Co., Ltd.

Nitto Electric Industrial Co., Ltd.

Takayuki Yamamoto

Mitsuhiro Kanada

Tomohiro Taruno

Amane Mochizuki

Takahiro Fukuoka

Yoshihiro Minamizaki

Vincent Daniel McGinniss

Bhima Rao Vijayendran

Kazuhiko Shibata

Kevin B Spahr

Tomohide Bamba

Takeshi Matsumura

Masayuki Yamamoto

Koichi Hashimoto

Takami Hikita

Akira Iio

Matteo Pasquali

Tomohide Banba

Toshinori Sakagami

Yasuo Kihara

Yuji Okawa

Chiaki Harada

Tatsuya Kubozono

Yoshio Miki

Francesca Mirri

Keisuke Watanabe

Ryuta Kibe

Laurent Maillaud

Robert James Headrick

Tatsuya Sekido

The present invention relates to a composition comprising carbon nanotubes and a surfactant for forming a thin film on a substrate, and a method of manufacturing a thin film on a substrate by using an aqueous dispersion of the composition comprising carbon nanotubes and a surfactant.

Carbon nanotube coating composition

The present photosensitive resin compositioncomprises a polyamic acid resin, a photosensitive agent, a dispersible compounddispersible in the polyamic acid resin, and a solvent. The porous resin is obtained by removing the solvent from the photosensitive resin compositionto form a composition in which the dispersible compoundis dispersed in the polyamic acid resin, removing the dispersible compound to make the composition porous, and curing the porous photosensitive resin composition. The porous resin enables forming a fine circuit pattern and has a low dielectric constant and, when used as an insulating layer of a circuit board, brings about improved high frequency characteristics.

Photosensitive resin composition, porous resin, circuit board, and wireless suspension board

A removable pressure-sensitive adhesive sheet is disclosed which, when used for fixing adherends thereto in work processing or the like, has such a degree of tackiness as not to peel off the adherends and which, after the work processing or the like, can be easily removed from the adherends without fouling them. The removable pressure-sensitive adhesive sheet comprises a pressure-sensitive adhesive layer constituted of a pressure-sensitive adhesive comprising a polymer in which the content of low-molecular components having a molecular weight of 10or lower is 10% by weight or lower. The polymer constituting the pressure-sensitive adhesive may be an acrylic polymer obtained by polymerizing one or more monomers in liquid or supercritical carbon dioxide. The removable pressure-sensitive adhesive sheet can be used, e.g., as a pressure-sensitive adhesive sheet for semiconductor wafer processing.

Removable pressure-sensitive adhesive sheet

The present photosensitive resin composition comprises a polyamic acid resin , a photosensitive agent, a dispersible compound dispersible in the polyamic acid resin , and a solvent. The porous resin is obtained by removing the solvent from the photosensitive resin composition to form a composition in which the dispersible compound is dispersed in the polyamic acid resin , removing the dispersible compound to make the composition porous, and curing the porous photosensitive resin composition. The porous resin enables forming a fine circuit pattern and has a low dielectric constant and, when used as an insulating layer of a circuit board, brings about improved high frequency characteristics.

Pressure sensitive adhesive (PSA) polymers, especially low T , high tack, nonpolar and polar polymers useful in formulating PSA can be solubilized or dispersed in a supercritical fluid (SCF), such as liquid CO or supercritical CO , using an organic cosolvent such as toluene. PSA polymers can be polymerized in SCF fluids to make unique adhesive products. Inclusion of a fluorinated reactant in the SCF polymerization process yields a PSA with improved resistance to mineral oil.

Supercritical fluid pressure sensitive adhesive polymers and their preparation

A heat-resistant polymer foam is disclosed which has excellent heat resistance, a fine cellular structure, and a low apparent density. The heat-resistant polymer foam comprises a heat-resistant polymer having a glass transition point of 120&deg; C. or higher, e.g., a polyimide or polyether imide, and has an average cell diameter of from 0.01 &mgr;m to less than 10 &mgr;m. This heat-resistant polymer foam can be produced by, for example, impregnating a heat-resistant polymer under pressure with an non-reactive gas such as carbon dioxide, which is in, e.g., a supercritical state, reducing the pressure, and then heating the polymer at a temperature exceeding 120&deg; C. to foam the polymer.

Heat-resistant polymer foam, process for producing the same, and foam substrate

A finely foamed pressure-sensitive adhesive tape or sheet possessing a pressure-sensitive adhesive layer having a fine cell size and cell wall thickness is disclosed. The tape or sheet is obtained by impregnating the pressure-sensitive adhesive tape or sheet with carbon dioxide in a liquid state or a supercritical state, and reducing the pressure to foam the pressure-sensitive adhesive layer. The main component of the pressure-sensitive adhesive layer is, for example, an acrylic resin or a rubber-based resin. The method provides a finely foamed pressure-sensitive adhesive tape or resin possessing a pressure-sensitive adhesive layer having a fine cell structure such that an average cell size d is from 0.01 to 1000 &mgr;m, an average cell wall thickness t is from 0.01 to 2000 &mgr;m, and the ratio t/d is in the range of from 0.5 to 3.5.

Finely foamed pressure-sensitive adhesive tape or sheet and method for producing the same

A method of efficiently removing a low molecular weight substance from a polyimide precursor or polyimide in which the low molecular weight substance is dispersed as micro-domains, without using a large amount of an organic solvent. The method of removing a low molecular weight substance comprises subjecting either a polymer composition having a micro-domain structure made up of a continuous phase comprising a polyimide precursor and, dispersed therein, a discontinuous phase comprising a low molecular weight substance or a polyimide composition obtained from the polymer composition by converting the polyimide precursor into a polyimide to extraction with a combination of supercritical carbon dioxide and a co-solvent to thereby remove the low molecular weight substance. The co-solvent is preferably an aprotic polar solvent, more preferably a nitrogen compound solvent or a sulfur compound solvent.

Method of removing low molecular weight substance from polyimide precursor or polyimide containing low molecular weight substance

A porous article having excellent heat resistance, a finely cellular structure, and a low dielectric constant; and a process for producing the porous article which comprises subjecting a polymer composition having a micro-domain structure comprising a continuous polymer phase and dispersed therein a discontinuous phase having an average diameter smaller than 10 &mgr;m to a treatment for removing the ingredient constituting the discontinuous phase by at least one operation selected from vaporization and decomposition and by an extraction operation to thereby make the polymer porous. The ingredient constituting the discontinuous phase has a weight average molecular weight of, e.g., 10,000 or lower. Liquefied carbon dioxide, supercritical carbon dioxide, or the like can be used as an extraction solvent for the ingredient constituting the discontinuous phase.

Porous article and process for producing porous article

Acrylic pressure-sensitive adhesive composition and process for producing the same

A porous polyimide having a finely cellular structure and having a low dielectric constant and heat resistance. The porous polyimide can be produced by a process comprising adding a dispersible compound to a polyimide precursor to form a micro-domain structure in which the dispersible compound is dispersed in the polymer so as to have a size smaller than 10 &mgr;m and then removing the dispersible compound by extraction with supercritical carbon dioxide to thereby make the precursor porous, wherein the interaction parameter &khgr; between the polyimide precursor A and the dispersible compound B is larger than 3. This porous polyimide has an average cell diameter smaller than 5 &mgr;m and a dielectric constant of 3 or lower.

Process for producing porous polyimide and porous polyimide

Method for producing foamed pressure-sensitive adhesive tape or sheet

Method for resist removal, and adhesive or adhesive sheet for use in the

Growing community of inventors

Osaka, Japan

Takayuki Yamamoto