Ricoh Company, Ltd.

Ricoh Elemex Corporation

Other

Ricoh Seiki Company, Ltd.

Takayuki Yamaguchi

Morimasa Kaminishi

Junichi Azumi

Yukito Sato

Hiroyoshi Shoji

Takuro Sekiya

Takashi Kimura

Yoshio Watanabe

Kazuhiko Adachi

Masami Kadonaga

Eiko Suzuki

Mitsuru Shingyouchi

Shuji Motomura

Masanori Horike

Makoto Obu

Satoru Sugawara

Tetsuro Hirota

Michio Umezawa

Yukito Satoh

Masaki Hiroi

Toshihiro Takesue

Takesada Hirose

Yasuhiko Takamatsu

Hideki Ohtsuki

Eiji Nakamura

Masatoshi Ohta

Yoshiro Yabuki

Shuro Abe

Disclosed is a surface emitting laser module including a surface emitting laser element formed in a semiconductor substrate and having a surface emitting laser array that emits light in a direction perpendicular to a surface of the semiconductor substrate; a package having a region in which the semiconductor substrate is provided; and a metal cap having a cylindrical part formed of metal, the cylindrical part having a transparent substrate on one side thereof and a bottom part on the other side thereof bonded to the package. The transparent substrate is provided in the metal cap in such a manner as to be inclined with respect to the semiconductor substrate, the package has a metal part at a bonding part thereof bonded to the metal cap, and the metal part and the metal cap are bonded together by welding.

Surface emitting laser module, optical scanner, and image forming apparatus

An optical device including an optical element; a package member in which the optical element is held on a bottom surface of the package member in an area surrounded by walls; and a plate member that seals the area surrounded by the walls and the bottom surface in an airtight manner, the plate member being translucent and joined to the package member with a resin material. The walls have a structure including steps, the plate member is joined onto one of the steps of the walls, and at least a part of the walls facing side surfaces of the plate member includes a positioning part for positioning the plate member and a retaining part for retaining the resin material, in a direction perpendicular to the bottom surface.

Optical device, optical scanning device, image forming apparatus, and manufacturing method of optical device

A light emitting apparatus includes a surface emitting laser and a ceramic package. The surface emitting laser has a common electrode on the back surface thereof and is mounted on the ceramic package via the common electrode. The common electrode of the surface emitting laser is electrically connected to a mount portion of the ceramic package. The mount portion is electrically connected to a back-surface electrode on the back surface of the ceramic package. The mount portion is also thermally connected to a back-surface heat-dissipating electrode on the back surface of the ceramic package via a penetrating electrode that penetrates the ceramic package. The surface emitting laser is spaced apart from the penetrating electrode in order to prevent inclination in light-emitted direction. The back-surface heat-dissipating electrode prevents destruction of a soldered portion when the light emitting apparatus is mounted on a substrate by soldering.

Light emitting apparatus, optical scanning apparatus, and image forming apparatus

A thin-film microstructure sensor includes a substrate having an insulation layer. A thin-film platinum temperature-sensitive resistor is provided on the insulation layer of the substrate, the thin-film platinum temperature-sensitive resistor comprising a platinum layer, the platinum layer having a maximum crystal grain size above a reference grain size of 800 &angst;. The thin-film platinum temperature-sensitive resistor is formed by a sputtering process to provide a temperature coefficient of resistance TCR above a reference TCR level of 3200 ppm.

Method of producing a thin-film platinum temperature-sensitive resistor for a thin-film microstructure sensor

A thin-film microstructure sensor includes a substrate having an insulation layer. A thin-film platinum temperature-sensitive resistor is provided on the insulation layer of the substrate, the thin-film platinum temperature-sensitive resistor comprising a platinum layer, the platinum layer having a maximum crystal grain size above a reference grain size of 800 .ANG.. The thin-film platinum temperature-sensitive resistor is formed by a sputtering process to provide a temperature coefficient of resistance TCR above a reference TCR level of 3200 ppm.

Thin-film microstructure sensor having a temperature-sensitive resistor

A method of calibrating a zero point of a flow sensor includes the steps of detecting a transition of output of the flow sensor caused in response to a shut down of a fluid, and adjusting the zero point of a characteristic curve representing the output of the flow sensor and a flow rate, such that the indicated flow rate is zero immediately after the transition of the flow sensor output.

Calibration method of a flow sensor output

A novel flow sensor which includes a wall in a fluid path, a substrate installed on the wall, a flow sensor constructed with at least one electric resistor formed on the substrate, and a construction for reducing turbulence caused by an existence of the flow sensor. The construction for reducing turbulence may be that an upstream side edge of the substrate is formed into a slope shape, a stair shape or a streamline. The construction for reducing turbulence may also be that the substrate is embedded into the wall. In a case that the substrate of the sensor is installed on a support board set in the fluid path, at least an upstream side edge of the support board may be formed into an acute angle or a streamline. Using the apparatus, the turbulence caused by the existence of a vertical wall is reduced because a size of vertical wall portions is small.

Flow sensor apparatus installed in a fluid path

A flow sensor includes a first heating portion, provided at a first position in a flow of a fluid, which heats the fluid and outputs a voltage in response to a temperature of the first position. A second heating portion, provided at a second, downstream position in the flow of the fluid, heats the fluid and outputs a voltage in response to a temperature of the second position, the first position and the second position being spaced from each other in a direction parallel to the flow of the fluid. An intermediate heater, provided between the first heating portion and the second heating portion, heats the fluid at an intermediate position between the first position and the second position.

Flow sensor having an intermediate heater between two

A semiconductor thin film sensor device including a semiconductor body formed of silicon having a (110) plane; a depression formed by an anisotropic etch applied to a first surface of the semiconductor body, wherein the first surface is substantially parallel to the (110) plane; and a thin film insulation member having a predetermined configuration suspended over the depression, and having substantially opposing ends connected to the first surface of the semiconductor body so that the thin film insulation member is bridged across the depression. Preferably, the depth of the depression is over 200 .mu.m. In one embodiment, the predetermined configuration of the thin film insulation member is oriented substantially parallel to a &lt;100&gt; direction of the semiconductor body.

Semiconductor thin film sensor device with (110) plane

An ink jet recording apparatus includes a recording head for ejecting droplets of ink and a driving circuit for driving the recording head. The recording head includes a base, a plate on which a plurality of openings are formed; an ink chamber to be filled with ink being formed between the base and the plate; and heater elements, provided in the ink chamber so as to face the openings of the plate, each of which heater elements supplies heat energy to ink adjacent thereto so that the air bubble is generated on each of the heater elements and so that the air bubble grows toward a corresponding one of the openings. An area of each of the openings of the plate is greater than an area each of the heater elements. When the driving circuit activates each of the heater elements, a droplet of ink is ejected due to the air bubble from the corresponding one of the openings of the plate.

Ink jet recording apparatus

A liquid jet recording head includes a base member, a liquid layer maintained on the base member and a plurality of heater elements, arranged in a line on the base member, for supplying energy to liquid adjacent thereto, the energy operation portions being put under the liquid layer. A method for making a liquid drop fly from the liquid jet recording head onto a recording sheet so that a dot image is formed on the recording sheet includes steps of (a) generating a bubble in the liquid to which the energy is supplied by each of energy operation portions in accordance with image data; (b) making the bubble grow up until a predetermined size of the bubble is obtained; (c) contracting the bubble under a condition where each of the energy portions supplies no energy to the liquid in which the bubble is formed; and (d) making the bubble disappear into the liquid.

Method and apparatus for making liquid drop fly to form image by

An ink jet recording head assembly includes: a base member having a plurality of enclosures, a top of each of the enclosures having an opening; a mechanism for supplying ink to each of the enclosures via the opening at the top thereof and for maintaining the ink at a predetermined depth; and a heater element which is provided in each of the enclosures under the ink supplied via the opening, the heater element heating the ink in each of the enclosures so that a bubble is generated in the ink; wherein an ink drop is jetted from a surface of the ink due to the bubble generated in the ink.

Ink jet recording head assembly

A thermal printhead for use in a thermal recording machine includes a substrate on which a plurality of heat-producing elements are formed in the form of a linear array and a plurality of I.C. driver chips provided along one side of the linear array, and the I.C. driver chip includes output pads formed in a line spaced apart from one another on its surface along one side thereof. Using such an I.C. driver chip, the linear array density of 8 elements/mm and thus recording density of 8 dots/mm is obtained.

Growing community of inventors

Miyagi, Japan

Takayuki Yamaguchi