Murata Manufacturing Co., Ltd.

Takayuki Tange

Lee Francis

William Jarvis

Yoshimitsu Ushimi

Shouhei Hirose

A DC-DC conversion circuit includes an input voltage; a half-bridge circuit connected to the input voltage and including a first leg with first, second, third, and fourth switching elements connected in series and including a second leg with first and second capacitors connected in series with each other and connected in parallel with the first leg; and a flying capacitor connected to a node between the first switching element and the second switching element and a node between the third switching element and the fourth switching element; a transformer including a primary winding connected to the half-bridge circuit; and a controller that controls the first to fourth switching elements. The controller selectively controls the half-bridge circuit in a half-bridge operation in which ±Vin/2 is applied to the primary winding, where Vin is the input voltage and a 3-level half-bridge operation in which ±Vin/4 is applied to the primary winding.

Selectable three-level, half-bridge circuit

A device includes a substrate; a magnetic core in the substrate and including a hole; a first winding extending through the hole and around the magnetic core; and a second winding extending through the hole, around the magnetic core, and around a portion of the first winding. The first and the second windings only extend around the same half of the magnetic core.

Embedded magnetic device including multilayer windings

A magnetic-component module includes a substrate, a core on a first surface of the substrate, a spacer on the core, a gap between a bottom surface of the core and the first surface of the substrate, a winding including wire bonds extending over the core and electrically connecting a first portion of the substrate and a second portion of the substrate, and traces on and/or in the substrate, and an overmold material encapsulating the core, the spacer, and the wire bonds and filling the gap.

Surface-mounted magnetic-component module

A module includes a substrate, metal layers and insulating layers laminated on the substrate, a bottom winding made of a metal directly contacting a first metal layer or a second metal layer, a first insulating layer on the bottom winding, a core on the first insulating layer, a second insulating layer on the core, a top winding made of the metal that is located on the core and a portion of the second insulating layer and that directly contacts the first metal layer or the second metal layer, and a third insulating layer on the top winding, electronic components that are located on the third insulating layer, where primary and secondary windings of the transformer are defined by portions of the bottom winding and the top winding and are located on opposite sides of the core from each other.

Integrated transformer module

A converter includes first and second input terminals; an integrated circuit (IC) that is a non-resonant, step-down, and point-of-load IC, that is connected to the first and second input terminals, and that includes a feedback terminal and switch-output terminal; a voltage-sense circuit connected to the feedback terminal and the switch-output terminal; a transformer that includes a primary winding connected to the switch-output terminal; a capacitor connected in series with the primary winding; a rectifier connected to a secondary winding of the transformer; and first and second output terminals connected to the rectifier. The converter is operated in a resonate mode.

Resonance operation of DC-DC converter using a point-of-load integrated circuit

A magnetic-component module includes a substrate; a core on a first surface of the substrate; a spacer on the core; a winding including wire bonds extending over the core and electrically connecting a first portion of the substrate and a second portion of the substrate, and traces on and/or in the substrate; and an overmold material encapsulating the core, the spacer, and the wire bonds.

A transformer includes a silicon substrate, a plurality of metal layers and a plurality of insulating layers laminated on the silicon substrate, a bottom winding of a metal contacting a first metal layer and a second metal layer of the plurality of metal layers, a first insulating layer on the bottom winding, a core on the first insulating layer, a second insulating layer on the core, a top winding of the metal that extends around the core and a portion of the second insulating layer, and a third insulating layer on the top winding. At least one of the top winding and the bottom winding is thicker than each of the plurality of metal layers.

Silicon transformer integrated chip

A magnetic-component module includes a substrate, a core on a first surface of the substrate, a spacer on the core, a winding including wire bonds extending over the core and electrically connecting a first portion of the substrate and a second portion of the substrate, and traces on and/or in the substrate, a lead frame that supports the core and that electrically connects the winding to the substrate, and an overmold material encapsulating the core, the spacer, the wire bonds, and a portion of the lead frame.

Growing community of inventors

Milton Keynes, United Kingdom

Takayuki Tange