Kyocera Corporation

Kyocera Circuit Solutions Inc.

Kyocera Slc Technologies Corporation

Takayuki Taguchi

Kenji Terada

Hidetoshi Yugawa

Yoshihiro Hosoi

A wiring board of the present disclosure includes a core substrate, insulating layers, signal wiring conductors, ground wiring conductors, power-supply wiring conductors, a first mounting portion on which a first semiconductor device is to be mounted, a second mounting portion on which a second semiconductor device is to be mounted, many first-semiconductor-device connection pads connectable to signal electrodes of the first semiconductor device, many second-semiconductor-device connection pads connectable to signal electrodes of the second semiconductor device, and many signal connection conductors that connect the first-semiconductor-device connection pads to the second-semiconductor-device connection pads. The signal connection conductors include signal connection conductors of a first wiring group that extend only through a region above the top surface of the core substrate, and signal connection conductors of a second wiring group that extend through a region below the bottom surface of the core substrate.

Wiring board

A wiring board according to the present invention includes an insulating board; a first pad provided inwardly from a surface of the insulating board and electrically connected to an electrode of an electronic component; a second pad provided on the surface of the insulating board and electrically connected to a lead terminal. The first pad and the second pad include a first layer region made of copper and a second layer region arranged on the first layer region and made of nickel, and a thickness of the second layer region of the second pad is larger than a thickness of the second layer region of the first pad.

Wiring board and electronic device using the same

A wiring boardaccording to the present invention includes a first resin layerformed of a thermoplastic resin; a conductive layerformed partially on the first resin layer; a through hole P for insertion of a screw formed in a region where the conductive layeris not formed and penetrating through the first resin layerin a thickness direction thereof; and a dummy via hole D formed in a region between the through hole P and the conductive layerand penetrating through the first resin layer

Wiring board and probe card using the same

A wiring board and a probe card using the wiring board which respond to a demand for improving electrical reliability.

Growing community of inventors

Hikone, Japan

Takayuki Taguchi