Nec Corporation

Nippon Telegraph and Telephone Corporation

Takayuki Suyama

Yuzo Shimada

Shinichi Hasegawa

Yoshimasa Tanaka

Yoshinari Shirai

Shin Mizutani

Yasue Kishino

Futoshi Naya

Hironobu Ikeda

Hiroshi Sawada

Yutaka Yanagisawa

Takuma Otsuka

Kazuya Ohara

A heat trace region extraction device includes: a difference actual object image generation unitthat generates a difference actual object image which is an image of a difference between an actual object image which is an image of an actual object obtained by photographing a certain range with an actual object camera for photographing the actual object and a background actual object image which is an actual object image of a background of the certain range; a difference thermal image generation unitthat generates a difference thermal image which is an image of a difference between a thermal image which is an image of heat emitted by the actual object obtained by photographing the certain range with a thermal camera for photographing the heat emitted by the actual object and a background thermal image which is a thermal image of the background; and a heat trace region extraction unitthat extracts a heat trace region by removing a region of the actual object from the thermal image based on the difference actual object image and the difference thermal image.

Heat trace area extraction apparatus, heat trace area extraction method and program

A sensor node connected to a server device through a communication network includes an acquisition unit configured to acquire sensor data from a sensor included in the sensor node, an identification unit configured to classify the sensor data into a plurality of classes to identify occurrence of a predetermined event based on the sensor data and an identification model created by the server device in advance, a certainty degree calculation unit configured to calculate a degree of certainty of the sensor data as an indicator representing uncertainty of a result of the identification based on the result of the identification, and a transmission unit configured to select sensor data having a minimum degree of certainty from a transmission buffer in which the sensor data and the degree of certainty of the sensor data are stored in association with each other, and transmit the selected sensor data to the server device.

Sensor node, server apparatus, identification system, method and program

A computer executes a display procedure of displaying a list of character strings registered in advance in response to a predetermined operation for data forming a part of a web page; and a storage procedure of storing a character string selected by a user from the list into a storage device in association with the data, to thereby achieve more efficient labeling of data.

Labeling support method, labeling support apparatus and program

Provided is a sensor network capable of acquiring, from a data center, learning data composed of a pair of sensor data (input) and a classification label (output) necessary for adding/changing a classification label for updating a classifier while reducing the volume of communication between a sensor and the center. One aspect of the present invention relates to a sensor network, including one or more sensor nodes and a data center. The sensor node includes: an encoding unit for encoding sensor data by an encoder part of an autoencoder; and a transmission unit for transmitting the encoded data. The data center includes: a reception unit for receiving data encoded from sensor data by the encoder part of the autoencoder; a decoding unit for decoding the encoded data by a decoder part of the autoencoder; and a storage unit for storing the decoded data therein.

Apparatus for functioning as sensor node and data center, sensor network, communication method and program

A multichip module of the present invention includes a substrate having an upper surface, a hole provided on the upper surface of the substrate and a chip provided in the hole. The upper surface of the chip and the upper surface of the substrate forms an even, or substantially even, surface. A first insulating layer is formed on the upper surface of the chip and the upper surface of the substrate and a first wiring layer is formed on the first dielectric layer. A method for manufacturing a multichip module, which includes a substrate having a cavity provided thereon, and a chip, includes providing the chip in the cavity so that the upper surface of the chip and the upper surface of the substrate becomes even, or substantially even. The method also includes forming a first insulating layer on the upper surface of the chip and the upper surface of the substrate, and forming a first wiring layer on the first insulating layer.

Multichip module

Method for fabricating a multichip module to improve signal transmission

A PCB is fixed to a PCB stiffener to be held thereby, while an LSI is fixed to an LSI stiffener to be held thereby. The distal ends of four supporting bars provided in the LSI stiffener are screwed on the PCB stiffener, whereby the two stiffeners are firmly integrated with each other to be prevented from being warped. Since a heat sink can be mounted through tapped holes provided in the LSI stiffener, even if the PCB is a thin board such as a build-up substrate, it is possible to mount the heat sink without any difficulties.

Mounting structure for an LSI

An electronic device assembly (and method for forming the same) including a first substrate having a first surface, a second surface, and a first pad on the first surface thereof; a second substrate having a first surface, a second surface, and a second pad on the second surface thereof, the first pad facing the second pad; a rigid spherical core interposed between the first and second pads; and solder connecting the first and second pads. The first substrate has a through-hole which is provided through the first substrate at a position of the first pad, at least a part of the solder is positioned in the through-hole and at least a part of the spherical core is received in the through-hole. The through-hole has an inner wall which is continuously tapered from the first surface of the first substrate to the second surface of the first substrate.

Connecting member and a connecting method with ball and tapered via

An electronic device assembly includes a rigid, first substrate and a second substrate. The first substrate has a first pad on the upper surface, and a through-hole at a position of the first pad. The second substrate has a second pad on the upper surface thereof. The first and second pads are connected via solder. At least a part of the solder is positioned in the through-hole of the first substrate. The first substrate may include a flexible substrate and a rigid plate. The through-hole is provided in the flexible substrate. The first pad is provided on the lower surface of the flexible substrate. The rigid plate is attached to the flexible substrate. The plate has a hole at a position of the through-hole to make the first pad reachable.

Electronic device assembly

An electronic package includes a supporting member, an electronic device, a carrier, a substrate a cooling means. The supporting member includes a plate and a bottom leg for supporting the plate. A first end of the bottom leg is joined to the lower surface of the plate. The carrier has a hole for receiving the bottom leg. The electronic device is connected to the carrier and is attached to the lower surface of the plate. A second end of the bottom leg is inserted into the hole of the carrier. The second end of the bottom leg is joined to the upper surface of the substrate. The electronic device is positioned between the plate of the supporting member and the substrate. The cooling is attached onto and supported by the upper surface of the plate.

Supporting member for cooling means and electronic package using the same

An electronic package according to the present invention comprises a supporting member, an electronic device, a carrier, a substrate and cooling means. The supporting member includes a plate and a bottom leg for supporting the plate. A first end of the bottom leg is joined to the lower surface of the plate. The carrier has a hole for receiving the bottom leg. The electronic device is connected to the carrier and is attached to the lower surface of the plate. A second end of the bottom leg is inserted into the hole of the carrier. The second end of the bottom leg is joined to the upper surface of the substrate. The electronic device is positioned between the plate of the supporting member and the substrate. The cooling means is attached onto and supported by the upper surface of the plate.

Supporting member for cooling means, electronic package and method of

A tape carrier for increasing the number of terminals between the tape carrier and a substrate includes a film, a lead, a terminal and a connection. The film has first and second surfaces and includes first and second regions. The first region of the film is covered with a device when the device is received by the first surface of the film. The film has an opening between the first and second regions. The lead is provided on the first surface of the film and extends above the opening of the film. The lead is coupled to the device at the opening of the film when the device is received by the first surface of the film. The terminal is provided on the second surface in the first region of the film. The connection connects the lead to the terminal. The lead and the device are connected together by thermocompression bonding with a thermode inserted into the opening of the film.

Tape carrier for increasing the number of terminals between the tape

In a first step, a first substrate is prepared. The first substrate has a first surface, a second surface, and a through-hole therebetween. In a second step, a second substrate is prepared. The second substrate has a first surface, a second surface, and a pad on the first surface of the second substrate. In a third step, a solder is provided on the pad of the second substrate. In a fourth step, the through-hole of the first substrate is positioned on the solder. The second surface of the first substrate and the first surface of the second substrate face each other. In a fifth step, the solder is heated to flow the solder into the through-hole of the first substrate. In the sixth step, an appearance of the solder on the first surface of the first substrate may be confirmed for detection of a connection of the solder.

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Tokyo, Japan

Takayuki Suyama