Hitachi Chemical Company, Ltd.

Takayuki Sueyoshi

Kenji Takai

Hiroshi Shimizu

Yasuyuki Mizuno

Kazuhito Kobayashi

Daisuke Fujimoto

The present invention provides a metal clad laminate or a resin coated metal foil having a metal foil whose both surfaces are not substantially roughening-treated and an insulating resin composition layer using generally used insulating resin, and a printed wiring board and a manufacturing method thereof, in which the metal clad laminate or the resin coated metal foil is used, the reliability and circuit formability are high, and the conductor loss is extremely low.

Resin coated metal foil, metal clad laminate, printed wiring board using them, and manufacturing method thereof

The present invention provides a resin composition for printed wiring board to be used for electronic devices in which operating frequency exceeds 1 GHz, and a varnish, a prepreg and a metal clad laminated board using the same. One invention of the present invention is a resin composition for printed wiring board containing a cyanate ester compound having 2 or more cyanate groups in the molecule and/or a prepolymer thereof, an epoxy resin containing at least one kind of an epoxy resin having a biphenyl structure in the molecule, and a varnish, a prepreg and a metal clad laminated board using the same.

Composition of polycyanate ester and biphenyl epoxy resin

Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof

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Kodaira, Japan

Takayuki Sueyoshi