Hitachi Cable, Inc.

Takayuki Sato

Hiroki Tanaka

Mamoru Mita

Norio Okabe

Hiroshi Ishikawa

Yasuharu Kameyama

Katsutoshi Taga

A method of manufacturing a double-sided circuit tape carrier comprising an insulating film like a polyimide tape, circuit wiring patterns on both sides thereof, and via holes through which at least a part of the circuit wiring patterns on both sides are electrically connected with each other. A copper thin film is patterned by photoetching. Via holes are formed through the insulating film by irradiating a laser beam by using the patterned copper thin film as a mask. Then, a conductive layer of a graphite conductive thin film and a copper plating layer is formed. The copper thin film is patterned by photoetching forming a chip hole and an outer lead hole through the insulating film by irradiating a laser beam. Finally, one of the copper thin films is patterned by photoetching to form circuit wiring pattern.

Growing community of inventors

Ibaraki, Japan

Takayuki Sato