Ebara Corporation

Mitsubishi Denki Kabushiki Kaisha

Dexerials Corporation

Other

Renesas Electronics Corporation

Fuji Xerox Co., Ltd.

Renesas Technology Corp.

The Yokohama Rubber Co., Ltd.

Bridgestone Corporation

Fujifilm Business Innovation Corp.

Ebara Research Co., Ltd.

Zeon Corporation

Japan Atomic Energy Research Institute

Ikeda Bussan Co. Ltd.

Digital Vision Laboratories Corporation

Takayuki Saito

Yasushi Toma

Itsuki Kobata

Mitsuhiko Shirakashi

Tsukuru Suzuki

Kaoru Yamada

Yuji Makita

Hozumi Yasuda

Yuzo Mori

Masayuki Kumekawa

Osamu Nabeya

Akira Fukunaga

Takeo Ishibashi

Syu Nakanishi

Kenya Ito

Atsushi Hachisuka

Nobuyuki Yoshioka

Shuji Nakao

Kunio Fujiwara

Koji Taniguchi

Yuki Miyamoto

Hiroshi Horibe

Koichiro Narimatsu

Shinya Soeda

Taichi Koyama

Shigenori Yamashita

Ayumi Minamide

Nobuyuki Kuto

Ken Nakajima

Shiko Shin

Tadashi Miyagi

Maya Itoh

Yukio Ikeda

Makoto Ito

Kazuto Hirokawa

Takanobu Sugo

Isao Ishigaki

Hideo Kawazu

Hironobu Moriyama

Hiroyuki Shima

Hideaki Sekiguchi

Hiroyuki Tojo

Tomoya Imai

Kenichi Sasaki

Kanroku Chounan

Masato Nakatsu

Masaki Kaneko

Ikuo Mitsushima

Masahiro Nishimoto

Akira Onodera

Masayuki Kamezawa

Shinya Watanabe

Hiroshi Nagai

Hirokuni Hiyama

Yutaka Wada

Yoshiaki Yamada

Masaya Seki

Kenji Yamaguchi

Takashi Matsumura

Hirotoshi Maegawa

Yuki Inoue

Minoru Harada

Naoki Yasuda

Takashi Tsutsumi

Nobuyuki Takada

Ikutaro Noji

Koichi Fukaya

Eiichi Ishikawa

Ryoichi Shinjo

Mitsuru Imai

Makoto Fujimura

Suguru Ozawa

Toshiyuki Toyoshima

Qingquan Su

Takayoshi Kawamoto

Takeshi Iizumi

Ichiro Katakabe

Masaji Akahori

Akihiko Harada

Hidenobu Arimitsu

Satoshi Konishi

Kanji Sugino

Sachiko Hattori

Hiroshi Kouda

Masahiro Ebisawa

Takuya Matsushita

Yuichi Kobayakawa

Kenji Kubota

Toru Akiyama

Akira Kodera

Keiichi Murakawa

Kazuhide Shimamura

Tatsuji Igarashi

Shinzi Miura

Tetsuhiro Chiba

Yoki Iwase

Yoko Iwase

Marie Amaki

Kenji Ueda

Sumio Yabe

A method for supplying a sliding process material to or removing it from a surface of an object to be slid using a sliding part including a plurality of sliding bodies each having a flat working surface, the sliding part is regularly moved, preferably by a second driving mechanism, in parallel with the working surfaces of the sliding bodies and in a direction different from a moving direction of the sliding bodies while the sliding bodies are regularly moved, preferably by a first driving mechanism, in parallel with the working surfaces. This configuration uniformly supplies the sliding process material to the surface of the object to be slid.

Method for supplying or removing sliding process material to/from surface of object to be slid

A sliding device configured to perform a sliding process on a surface of an object to be slid includes a sliding part including sliding bodies each having a flat working surface; a first driving mechanism configured to regularly move the sliding bodies in parallel with the working surfaces of the sliding bodies; and a second driving mechanism configured to regularly move the sliding part in parallel with the working surfaces in a direction different from a moving direction by the first driving mechanism while the first driving mechanism moves the sliding bodies. This enables uniform supply of the sliding process material onto the surface of the object to be slid or clean the surface of the object to be slid.

Sliding device for supplying or removing a sliding process material to or from a surface of an object to be conveyed

An image forming apparatus includes a recording medium accommodation portion that accommodates a recording medium, a storage portion that stores information about the recording medium that is accommodated in the recording medium accommodation portion and previously printed, a sensing portion that senses opening and closing of the recording medium accommodation portion, a comparison portion that compares currently set setting information about the recording medium with the information about the recording medium stored in the storage portion on a condition that the sensing portion senses that the recording medium accommodation portion is not open between previous printing and current printing, and an output portion that outputs a comparison result of the comparison portion.

Image forming apparatus, image forming method, and non-transitory computer readable medium storing image forming program for reducing inconvenience of printing with inconsistent setting of recording medium

An image forming apparatus includes a processor configured to: receive paper information on a type of paper on which an image is formed; acquire assist information about assistance to supply the paper by supplying gas to the paper and adjustment information about positioning of the paper after assistance to supply the paper is performed, the assist information and the adjustment information corresponding to the received paper information and relating to transport of the paper; and perform control for storing the paper information, the assist information, and the adjustment information in association with one another into a memory.

Image forming apparatus, image forming method, and non-transitory computer readable medium that reduce workload for adjustments related to transport of paper

In an adjustment device for a frictional force adjustment portion in a section, an inner circumferential portion of the section includes: a support hole formed from rolling bearings at both ends; a frictional force generation portion configured of a brake shoe, a coil spring, and a hexagon socket set screw and generates a frictional force against a rotary shaft inserted into the support hole; and a frictional force adjustment portion configured of the hexagon socket set screw and adjusts the frictional force in the frictional force generation portion. The adjustment member driving actuator adjusts the frictional force of the frictional force adjustment portion by rotating normally and reversely the adjustment member such that the frictional force in the frictional force generation portion of the section falls within a predetermined range.

Adjustment device for friction adjustment portion of section

In a hose connector fitting, an outer circumferential surface of a socket is crimped toward a radially inner side thereof within a crimping range along an axis direction of the socket in the state where a hose is inserted into an annular space between an outer circumferential portion of a nipple and an inner circumferential portion of the socket. A shape measuring device includes: a sensor and a rotational moving unit that detect distance data from a reference position to the surface of the socket over a zone including at least the entire crimping range; a shape data generating unit that generates shape data representative the three-dimensional shape of the socket surface based on the detected distance data; and a measurement data calculating unit that calculates measurement data about the crimping state of the socket based on the shape data.

Shape measuring device for hose connector fitting, shape measuring method for hose connector fitting and shape measuring program for hose connector fitting

Provided is a shape measuring device for a hose connector fitting. Two-dimensional shape detection units detect radial position data of a surface of a socket in radial direction with respect to an axial center of a hose connector fitting along a direction parallel with the axial center of the hose connector fitting completely across a circumference of the socket. The measurement data relates to the surface of the socket, including outer diameters, crimping positions, crimping claw remaining widths, roundness, and cylindricity of the socket.

Shape measuring device for hose connector fitting

Provided are a metal wire rod drawing die that has a longer life than conventional dies and that can prevent damage to a metal wire rod surface and a method for manufacturing the die. In a metal wire rod drawing die (), a die hole () for inserting a metal wire rod is formed. Where Rarepresents a surface roughness of an inner surface of the die hole from a bearing section () to an approach section () corresponding to an area reduction rate of 30% in an axial direction of the die hole, Rarepresents a surface roughness of the inner surface of the die hole from the bearing section to the approach section corresponding to the area reduction rate of 30% in a direction orthogonal to the axial direction of the die hole, and Rarepresents a surface roughness of an inner surface of the bearing section of the die hole in the axial direction of the die hole, the Ra, the Ra, and the Rasatisfy a relationship represented by 0.14 &#x3bc;m&#x3e;Ra&#x3e;Ra&#x3e;Ra

Die for drawing metal wire rod, and method for manufacturing same

An image forming apparatus includes an image forming device that forms an image on a recording material. The apparatus further includes an adjuster that sequentially executes adjustment operations corresponding to plural adjustment items which are selected in advance. The apparatus further includes a display that displays information indicating that a setting in which an adjustment result is to be reflected is newly generated when the setting is newly generated during execution of the adjustment operations.

Image forming apparatus that sequentially executes adjustment operations corresponding to a plurality of adjustment items

A method for manufacturing a semiconductor device and an underfill film which can achieve voidless mounting and excellent solder bonding properties even in the case of collectively bonding a plurality of semiconductor chips are provided. The method includes a mounting step of mounting a plurality of semiconductor chips having a solder-tipped electrode onto an electronic component having a counter electrode opposing the solder-tipped electrode via an underfill film; and a compression bonding step of collectively bonding the plurality of semiconductor chips to the electronic component via the underfill film. The underfill film contains an epoxy resin, an acid anhydride, an acrylic resin, and an organic peroxide and has a minimum melt viscosity of 1,000 to 2,000 Pa*s and a melt viscosity gradient of 900 to 3,100 Pa*s/&#xb0; C. from a temperature 10&#xb0; C. higher than a minimum melt viscosity attainment temperature to a temperature 10&#xb0; C. higher than the temperature.

Semiconductor device manufacturing method and underfill film

An image formation control apparatus includes a setting reception section that collectively receives settings of a plurality of adjustment factors with respect to image formation, an instruction section that instructs an image forming apparatus main body to perform adjustments with respect to the settings of the adjustment factors, which are received by the setting reception section, an adjustment result reception section that receives results of the adjustments of the respective adjustment factors, which are instructed by the instruction section, in the image forming apparatus main body, and a controller that performs control such that the results of the adjustments of the respective adjustment factors, which are received by the adjustment result reception section, are stored in company with a recording medium accommodation unit that accommodates a recording medium.

Image formation control apparatus and image forming apparatus

A resin composition comprising a binder resin (A), a phenoxy resin having a hydroxyl equivalent of 300 or more, and a cross-linking agent (C). The resin composition of the present invention preferably further comprises a photoacid generator (D). The photoacid generator (D) is more preferably a quinone diazide compound.

Resin composition

Image forming apparatus, information processing apparatus, and non-transitory computer readable medium

An underfill material achieving a wide margin for mounting and a method for manufacturing a semiconductor device using the same are provided. The underfill material contains an epoxy resin, an acid anhydride, an acrylic resin, and an organic peroxide, wherein a minimum melt viscosity attainment temperature and a minimum melt viscosity obtained when melt viscosity of the underfill material is measured under a temperature increase rate condition in a range of 5 to 50&#xb0; C./min are in a range of 100&#xb0; C. to 150&#xb0; C. and in a range of 100 to 5000 Pa&#xb7;s, respectively. Since variation in the minimum melt viscosity attainment temperature measured under different temperature increase conditions is small, voidless mounting and good solder bonding properties can be achieved without strict control on the temperature profile during thermocompression bonding, and a wide margin for mounting can be achieved.

Underfill material and method for manufacturing semiconductor device using the same

Technique capable of achieving reliability improvement of a semiconductor device even if temperature rising of an operation guarantee temperature of the semiconductor device is performed is provided. Gap portions are provided among a plurality of pads, and a glass coat composed of, for example, a silicon oxide film or a silicon nitride film is embedded in the gap portions. The glass coat is provided in order to secure electrical insulation among the pads, and coats outer edge portions of the pads. Trenches are formed so as to be adjacent to regions, which are coated with the glass coat, of the outer edge portions of the pads.

Semiconductor device

Growing community of inventors

Kanagawa, Japan

Takayuki Saito