Ntt Docomo, Inc.

Nippon Steel Corporation

Mitsumi Electric Company Ltd.

Takayuki Otsuka

Ryuichi Wada

Tooru Akashi

Makoto Kitazume

Kazuki Shiokawa

Toshiki Komiyama

Yuki Takeuchi

Hiroki Matsubara

Toshiyasu Yoshimi

Fujio Furukawa

A coil skid on which a hot-rolled coilobtained by coiling a hot-rolled steel sheet is placed includes: at least two or more layers of a metal plateand at least two or more layers of a heat insulating materialeach stacked alternately, in which the metal plateis in contact with the hot-rolled coil. The uneven cooling of an outer peripheral portion of the hot-rolled coil caused by the coil skid is prevented while ensuring the strength of the coil skid, to thereby inhibit the uneven hardness in the longitudinal direction of the hot-rolled coil resulting from this uneven cooling.

Coil skid and steel sheet manufacturing method

A mobile terminal guides a user to a destination by a navigation application and outputs destination information indicative of a destination upon arrival at the destination to information providing application and executes the information providing application. The mobile terminal on which the information providing application is running, determines whether the mobile terminal is staying at the destination by a motion sensor and starts counting a staying time. When the counted staying time reaches a predetermined length of time, the mobile terminal send to the user an inquiry to confirm that the present location is the destination. Upon confirmation that the user has been staying at the destination for a predetermined length of time, the mobile terminal transmits destination information to a server, obtains facility information corresponding to destination information, and outputs the obtained facility information.

Information processing device, information providing method, and program

An electronic component module includes a double-sided mounting board having a front surface and a back surface; components mounted on the front surface and the back surface of the double-sided mounting board; an insulating resin sealing the components mounted on the front surface and the back surface; and a lead frame bonded to the back surface of the double-sided mounting board. The back surface of the double-sided mounting board is sealed with the insulating resin such that the lead frame is not covered by the insulating resin, and the thickness of the insulating resin sealing the components mounted on the back surface of the double-sided mounting board is less than or equal to the thickness of the lead frame.

Electronic component module including a lead frame and an insulating resin having a thickness less than or equal to a thickness of the lead frame and method for producing same

Growing community of inventors

Tokyo, Japan

Takayuki Otsuka