Canon Kabushiki Kaisha

Hitachi, Ltd.

Ricoh Company, Ltd.

Hitachi-high-technologies Corporation

Toshiba Lighting & Technology Corporation

Ddk Ltd.

Hitachi Instrument Engineering Co., Ltd.

Takayuki Ono

Tsuyoshi Orikasa

Kimiyuki Hayasaki

Toshio Kashino

Yutaka Koizumi

Akira Goto

Haruhiko Terai

Masaki Inaba

Shimpei Otaka

Hiroyuki Kigami

Seiichiro Karita

Kiyomitsu Kudo

Shuji Koyama

Kouichi Omata

Masashi Ishikawa

Hisashi Fukai

Jun Hinami

Kiyotoshi Mori

Masao Furukawa

Kiyoshi Matsui

Morio Suzuki

Takeshi Shibata

Ryo Shimamura

Kenichi Kasai

Koji Yamakawa

Tomohiro Takahashi

Takanori Enomoto

Masami Ikeda

Yutaka Uematsu

Satoru Watanabe

Hideki Osaka

Yoshie Asakawa

Satoshi Shimazu

Masaru Iketani

Mitugu Shirai

Hitoshi Ueno

Akio Idei

Masabumi Shibata

Satoshi Muraoka

Tsutomu Imai

Michinori Naito

Yuichi Fukuda

Hideyuki Fukasawa

Takashi Miyagawa

Toshitaka Murakawa

Hiroshi Kakita

Hiroyuki Ishinaga

Takashi Nakamura

Yoshiyuki Imanaka

Hiroshi Goto

Keiichiro Tsukuda

Hiroshi Sugitani

Shigeru Matsui

Hiroki Tajima

Kyosuke Toda

Aya Yoshihira

Tatsuo Furukawa

Hideo Saikawa

Tomoyuki Hiroki

Masaaki Izumida

Yuji Kamiyama

Shin Ishimatsu

Hiroyuki Maru

Hideaki Kishida

Hitoshi Kawano

Shigehisa Kawatsuru

Tadashi Suzuki

Yuusuke Fukumura

Masami Iizuka

Shuichi Katao

Makoto Kawagoe

Hajime Yamamoto

Masahiko Kubota

Teruo Ozaki

Eiichiro Shimizu

Kazuaki Masuda

Masahiko Higuma

Tetsuya Ohashi

Keisuke Matsuo

Yohei Sato

Torachika Osada

Norio Ohkuma

Makiko Kimura

Yukio Okamoto

Hiroyuki Doi

Masami Kasamoto

Yoshihiro Kondo

Mitsuru Kurata

Itaru Watanabe

Satoshi Kudo

Masaki Ohsumi

Hiroaki Shirakawa

Kiyomi Aono

Hikaru Ueda

Kazunori Nakajima

Maki Hatta

Chiko Yorita

Tomonari Otsuki

Masatoshi Kitagawa

Hiroyuki Koshi

A memory module having different types of memory mounted together on a double-sided substrate has a first edge and opposite second edge and includes a plurality of memory controllers, a plurality of flash memories, and a plurality of second memories having a higher signal transmission rate than the flash memories. A socket terminal for connecting the double-sided substrate to a motherboard is formed on the front surface and the back surface of the double-sided substrate on the first edge side; the memory controllers are disposed on the second edge side; the second memories are disposed on the second edge side at positions opposite the positions at which the memory controllers are disposed; and the flash memories are disposed on at least the back surface thereof at positions that are closer to the first edge than are the positions at which the memory controllers and the second memories are disposed.

Memory module having different types of memory mounted together thereon, and information processing device having memory module mounted therein

A method of manufacturing a liquid discharge head in which a device substrate having an energy generating element and a supply port and a supporting member having a supply passage are bonded with each other an adhesive agent includes:

Method of manufacturing liquid discharge head

In methods connecting a memory module configured from DRAM, which is high-speed memory, and a memory module configured from flash memory which is slower than DRAM but is high-capacity memory, to a CPU memory bus, in the case of sequential reading, the busy rate of the CPU memory bus increases, and performance degradation occurs easily. In the present invention, an information processing device has a CPU, a CPU memory bus, and a primary storage device. The primary storage device has a first memory module and a second memory module. The first memory module has high-speed memory. The second memory module has memory having the same memory interface as that of the high-speed memory, high-capacity memory having a different memory interface from that of the high-speed memory, and a controller that controls same. The first memory module and second memory module are caused to be accessed by the memory interface of the high-speed memory.

DRAM having SDRAM interface and flash memory consolidated memory module

When DRAMs that are high-speed memories and flash memories that are lower in speed but can be larger in capacity than the DRAM are to be mounted on a DIMM, what matters in maximizing CPU memory bus throughput is the arrangement of the mounted components. The present disclosure provides a memory module (DIMM) that includes memory controllers arranged on the module surface closer to a socket terminal and DRAMs serving as high-speed memories arranged on the back surface. Nonvolatile memories as large-capacity memories are arranged on the side farther from the socket terminal.

DRAM with SDRAM interface, and hybrid flash memory module

A sheet processing apparatus includes a processing table to which a printed sheet is transported, a positioning member that positions the sheet, a cutter that cuts the positioned sheet into a binding margin portion and an image portion, and a taping unit that joins the binding margin portion and the image portion together with a tape in a state in which a gap is formed therebetween.

Bookbinding with cutting and re-attaching sheets

A device management system includes a determining unit that acquires from a storage unit information relating to a setting of a first device and information relating to a setting of a second device, compares the acquired information, and determines whether the setting of the second device satisfies the setting of the first device; a selecting unit that is used when the determining unit determines that the setting of the second device does not satisfy the setting of the first device and is configured to select at least one device that is capable of satisfying the setting of the first device based on information relating to a setting of the at least one device stored in the storage unit; and an applying unit that applies to the at least one device selected by the selecting unit a setting value set up for the setting of the first device.

Device management apparatus and device management method for managing device settings

An electric connection method for connection between a semiconductor substrate and an electric wiring substrate includes a first process for providing the semiconductor substrate having a heating member and a pad and the electric wiring substrate having first wiring and second wiring, a second process for electrically connecting the first wiring and the heating member, a third process for causing the heating member to generate heat by supplying power to the heating member through the first wiring, and a fourth process for electrically connecting the pad and the second wiring at a temperature higher than a temperature for electrically connecting the first wiring and the heating member.

Electric connection method

An electrode connected to a TH pad requiring electric conduction is formed on a bonded surface of a first multilayer substrate having piercing TH to form a solder bump on the electrode. An electrode connected to the TH pad is formed on a bonded surface of a second multilayer substrate to be bonded having a piercing TH at a position opposite the electrode formed on the first multilayer substrate to form a solder bump on the electrode. A three-layered sheet is formed by applying an adhesive as a resin material that is not completely cured to both surfaces of a core material as the cured resin, and has holes at positions corresponding to the TH and the solder bump, respectively. The first and the second multilayer substrates are then laminated having the bonded surfaces facing each other while having the three-layered sheet positioned and interposed therebetween, and batch thermocompression bonded.

Method of manufacturing an interlayer connection substrate

An information processing apparatus may include an acquiring unit to periodically acquire, from an apparatus, information indicating an amount of power consumption stored for each of power supply states of the apparatus, a computation unit to compute a ratio of the amount of power consumption for each of the power supply states included in the information, for each information acquired by the acquiring unit, and an output unit to output information indicating a change in the ratio, based on an order of the information acquired.

Information processing apparatus, information processing system, and computer-readable recording medium

A support substrate and a liquid ejecting element substrate are bonded to each other with an adhesive agent to manufacture a liquid ejection head. The support substrate is provided with a liquid supply port and a recess or through-hole in its main surface. The adhesive agent is applied onto the main surface of the support substrate by means of a roller holding the adhesive agent on its peripheral surface by moving the support substrate and the roller relative to each other such that the recess or through-hole faces the roller before the liquid supply port faces the roller.

Method of manufacturing liquid ejection head

Device management apparatus, information processing system, and information processing method for replacement device

There is provided a method of manufacturing a liquid ejection head that includes a supporting member having a major surface provided with a plurality of supply paths, and a recording element substrate having a bonding surface bonded to the major surface and provided with a plurality of supply ports arranged side by side in an arranging direction in which the supply paths are arranged side by side, the supply ports having smaller widths than the respective supply paths in the arranging direction. The method includes applying a bonding agent on the major surface around each of the supply paths, spreading the bonding agent to inner side surfaces of the supply ports by pressing boundary portions between the bonding surface and the supply ports into the bonding agent applied, and bonding the bonding surface to the major surface at a bonding position where the supply ports face the respective supply paths.

Method of manufacturing liquid ejection head, and liquid ejection head

A liquid adhesive is applied onto a surface of a base plate having flow channels formed as recesses or through-grooves, by transferring the liquid adhesive from a rotating cylinder coated with it to the surface of the base plate. The base plate is then bonded to a cover plate having ejection energy generating elements via the applied adhesive to be made into a liquid ejection head. For evenly applying the liquid adhesive onto the surface having the recesses or through-grooves as flow channels, the surface is additionally provided with dummy recesses for compensating for variance of contact length orthogonal to the transfer direction due to uneven or asymmetrical arrangement of the recesses or through-grooves.

A liquid ejection head includes two or more substrates disposed side by side, each having energy generating elements and primary terminals electrically connected to the respective energy generating elements, and an electrical wiring member having primary flying leads electrically connected to the respective primary terminals by means of gang bonding. Each of the substrates has an auxiliary terminal located adjacent to the primary terminals and the auxiliary terminals of the two or more substrates are disposed adjacent to each other. The electrical wiring member has an auxiliary flying lead connected to the auxiliary terminals of the substrates by means of a gang bonding system.

Liquid ejection head and method of manufacturing the same

According to one embodiment, a lighting control system includes a plurality of luminaire, a sensor device, a luminance sensor, and a lighting control unit. The luminaires are set in a lighting space. The sensor device detects presence of a person in the lighting space. The luminance sensor detects indirect luminance in a predetermined position in the lighting space by the luminaire. The lighting control unit subjects the luminaire to lighting control such that the indirect luminance detected by the luminance sensor does not fall below a predetermined value in a position where the sensor device detects presence of the person.

Lighting control system and lighting control method

Growing community of inventors

Kawasaki, Japan

Takayuki Ono