Kabushiki Kaisha Toshiba

Takayuki Okutomo

Morihiko Ikemizu

Yutaka Fukuoka

Masafumi Takeuchi

In a TAB tape, dummy copper foil patterns are provided on the portions of an adhesive on which neither pads nor leads are provided, thereby flattening the upper surface of solder resist coated on the resultant structure.

Tab tape and semiconductor device using the tab tape

A wiring pattern having a plurality of leads is formed on the under surface of an insulating film. The inner lead portion of each of the leads is bonded to a corresponding one of bump electrodes formed on pads of a semiconductor chip and the outer lead portion thereof is connected to a corresponding lead wire formed on a printed circuit board. The outer lead portion of one of the leads which acts as a ground line is connected to a grounded lead wire which is formed on the printed circuit board. A shield plate is bonded to the under surface of the leads via insulating adhesive agent. The shield plate is electrically connected to the grounded lead wire. The semiconductor chip and the inner lead portions are hermetically sealed by use of potting resin.

TCP type semiconductor device capable of preventing crosstalk

In a semiconductor device and a method for manufacturing the same according to the present invention, each of electrode pads on a semiconductor chip is bonded to an inner lead section of each of leads of a carrier tape by a connecting electrode. An insulating film of the carrier tape is then adhered to the surface of the semiconductor chip by interposing an adhesive layer between them. Thus, the electrode pads and inner lead sections are stably bonded, and the flatness of the carrier tape is maintained by the flatness of the surface of the semiconductor chip. It is thus possible to prevent the flatness of the outer lead sections of the leads from being degraded when the number of leads is small, and to improve in mounting the semiconductor chip by reflow soldering.

Growing community of inventors

Kawasaki, Japan

Takayuki Okutomo