Kabushiki Kaisha Toshiba

Toshiba Silicone Co., Ltd.

Tokyo Shibaura Denki Kabushiki Kaisha

Takayuki Oguni

Noriaki Yagi

Akitsugu Kurita

Minoru Inada

Yasutaka Imajo

Nobuhiro Saitoh

Kimiaki Kabuki

Yoshiaki Takezawa

Shuichi Suzuki

Cao Minh Thai

Kazutaka Matsumoto

Hirotoshi Ikeya

Tsuguo Kato

Kazuhiko Kurematsu

Akiko Hatanaka

A cleaning composition comprising at least one low molecular weight polyorganosiloxane selected from the group consisting of straight chain polydiorganosiloxane represented by a general formula: ##STR1## (wherein R.sup.1 is an organic group of single valence substituted by the same or different group or unsubstituted, and l is an integer from 0 to 5), and cyclic polydiorganosiloxane represented by a general formula: ##STR2## (wherein R.sup.1 is an organic group of single valence substituted by the same or different group or unsubstituted, and m is an integer from 3 to 7). To use it as a water system cleaning agent, polyoxyalkylene group containing polyorganosiloxane, a surfactant, and water are additionally mixed. Accordingly, a cleaning effect free from environmental destruction and contamination, equivalent to flon containing cleaning agents, and satisfactorily stable in terms of dispersion as a water system cleaning agent can be obtained. In addition, to use as a dewatering cleaning agent, the low molecular weight polyorganosiloxane is additionally mixed alone or with a surfactant and/or a hydrophilic solvent. Accordingly, cleaning and water substituting properties equivalent to flon containing dewatering cleaning agents and environmental safety can be obtained.

Cleaning compositions

A cleaning composition comprising at least one low molecular weight polyorganosiloxane selected from the group consisting of straight chain polydiorganosiloxane represented by a general formula: ##STR1## (wherein R.sup.1 is an organic group of single valence substituted by the same or different group or unsubstituted, and 1 is an integer from 0 to 5), and cyclic polydiorganosiloxane represented by a general formula: ##STR2## (wherein R.sup.1 is an organic group of single valence substituted by the same or different group or unsubstituted, and m is an integer from 3 to 7). To use it as a water system cleaning agent, polyoxyalkylene group containing polyorganosiloxane, a surfactant, and water are additionally mixed. Accordingly, a cleaning effect free from environmental destruction and contamination, equivalent to flon containing cleaning agents, and satisfactorily stable in terms of dispersion as a water system cleaning agent can be obtained. In addition, to use as a dewatering cleaning agent, the low molecular weight polyorganosiloxane is additionally mixed alone or with a surfactant and/or a hydrophilic solvent. Accordingly, cleaning and water substituting properties equivalent to flon containing dewatering cleaning agents and environmental safety can be obtained.

A continuous method for cleaning and/or removing liquid from industrial parts that includes contacting the part with a cleaning or rinsing composition that contains a straight chain or cyclic polyorganosiloxane.

Continuous method for cleaning industrial parts using a

A method for drying parts that includes contacting the part with a liquid removing composition that contains a straight chain or cyclic polyorganosiloxane.

Method for drying parts using a polyorganosiloxane

A method for removing liquid from parts that includes contacting the part with a cleaning or rinsing composition that contains a straight chain or cyclic polyorganosiloxane.

Method for removing residual liquid from parts using a polyorganosiloxane

A method for cleaning an industrial object by use of an aqueous agent that includes a polyorganosiloxane. The method uses a plurality of vessels and the agent is recovered and resupplied to the method.

Method for cleaning an object with an agent including water and a

An epoxy resin composition for cast molding which comprises:

Epoxy resin composition for cast molding

There is presented a highly reliable resin encapsulation type semiconductor device excellent in humidity resistance as well as high temperature electrical characteristics. The specific feature consists in the epoxy resin composition employed for encapsulation. This composition comprises an epoxy resin, a novolac resin as curing agent and an organic tertiary phosphine compound as curing accelerator. The resin encapsulation type semiconductor device is markedly small in leak current under hot and humid conditions and has a prolonged life due to difficult deterioration through corrosion of electrodes and aluminum wiring, as compared with those of prior art.

Growing community of inventors

Yokohama, Japan

Takayuki Oguni