Screen Holdings Co., Ltd.

Takayuki Nishida

Nobuaki Okita

Ryo Muramoto

Akio Hashizume

Junichi Ishii

Nobuyasu Hiraoka

Shotaro Tsuda

Wataru Yano

Disclosed is a substrate treating method for performing cleaning treatment to a substrate by contacting a brush against the substrate. The method includes a rotating step of rotating a spin holder, holding the substrate, around a vertical shaft axis, an outer periphery edge contacting step of contacting the brush against the substrate at an outer periphery edge contacting position closer to an outer periphery edge of the substrate than to the shaft axis while the substrate is rotated in a horizontal plane, a first moving step of moving the brush from the outer periphery edge contacting position to a side adjacent to the shaft axis while the brush is brought into contact against the substrate, and a second moving step of moving the brush from the side adjacent to the shaft axis toward the outer periphery edge after the first moving step.

Substrate treating method and substrate treating apparatus

A substrate processing apparatus includes a substrate holding portion which holds a substrate W. The substrate holding portion includes two movable holding pins and two fixed holding pins which sandwich the substrate. The substrate processing apparatus includes two support pins which support the substrate W held by the substrate holding portion from below. Each of the support pins has an inner portion which overlaps the substrate held by the substrate holding portion in a vertical direction. An upper end of the support pin is on a side below an overlapping portion of the substrate which overlaps the inner portion in the vertical direction.

Substrate processing apparatus and substrate processing method

A substrate processing apparatus includes an upper cup part including a first tubular portion and a second tubular portion that are formed each in a tubular shape capable of surrounding a substrate held by a substrate holder, the second tubular portion being connected to an upper side of the first tubular portion. The substrate processing apparatus also includes a cup moving unit that moves the upper cup part in a vertical direction with respect to the substrate holder to stop the upper cup part at each of a position where the first tubular portion surrounds the substrate, and a position where the second tubular portion surrounds the substrate.

A protective disk is disposed between a spin base and a substrate W and is capable of being raised and lowered between a separated position which is separated downward from the substrate W and a near position which is nearer to the substrate than the separated position. An upper surface of the protective disk has an inner surface which is provided on an inner side of a plurality of holding pins in a radial direction and a flat surface which is provided on an outer side of the inner surface in the radial direction and is provided above the inner surface. The flat surface faces a lower surface of a part on an inner side of an outer circumferential end in the radial direction, in a circumferential edge portion of the substrate.

Substrate processing apparatus

It is an object to prevent adhesion of a processing liquid to a non-processing region of a substrate. In order to achieve the object, a substrate processing apparatus includes a substrate rotating mechanism, a discharging portion for discharging a processing liquid to a substrate, a moving portion for moving a discharging portion, and a controller. The discharging portion starts to discharge the processing liquid at a first position and is moved to a second position. The first position is a position of the discharging portion where a section of a passage of the discharging portion is projected onto a first region, and the second position is a position of the discharging portion where the section of the passage is projected onto a second region. The first region is a region on the peripheral edge side of the substrate from the second region.

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Kyoto, Japan

Takayuki Nishida