Nissin Ion Equipment Co., Ltd.

Takayuki Murayama

Weijiang Zhao

Yuya Hirai

Shigeki Sakai

Masakazu Adachi

Tomoya Taniguchi

A semiconductor manufacturing apparatus includes a wafer clamp including a mechanical clamp and an electrostatic chuck, and a controller that controls the wafer clamp to selective clamp a wafer using only the mechanical clamp based on a processing temperature of a wafer.

Wafer clamping method and semiconductor manufacturing apparatus

An ion source is provided. The ion source includes a plasma generation chamber, a plate member, and an extraction electrode. The plasma generation chamber is supplied with a halogen-containing material. The plate member is provided on an end of the plasma generation chamber located on a side toward which an ion beam is extracted. The extraction electrode is disposed downstream of the plate member. The plate member is formed with a gas supply passage via which hydrogen gas is supplied to the extraction electrode.

Growing community of inventors

Koka-city, Japan

Takayuki Murayama