Jtekt Corporation

Toyoda Van Moppes Ltd.

Takayuki Moroto

Shinji Soma

Tomoyasu Imai

Tomohiro Inagaki

Kazuhiko Sugita

Kunihiko Unno

Masato Kitajima

Yasuji Kunihiro

Yasuhisa Sekiya

Hiroshi Takehara

Noboru Hiraiwa

Koji Morita

Toshiaki Sakurai

Hiroshi Imaike

A grinding wheel is manufactured such that (a) any one of particles for an abrasive grain layer and particles for a substrate layer are put into the press-mold die, and other particles are put onto the particles in the press-mold die, and then the substrate layer and the abrasive grain layer are integrally press-molded to form a non-baked grinding chip with an arcuate shape; (b) depressions are formed on the abrasive grain layer of the non-baked grinding chip; (c) the grinding chip on which the depressions are formed is baked; and (d) the plurality of baked-grinding chips are adhered to a core of the grinding wheel.

Method for manufacturing grinding wheel having depressions on grinding surface thereof

In a wheel spindle device wherein a plurality of grinding wheels are attached in a juxtaposed relation to a wheel spindle rotatably carried on a wheel head of a grinding machine, a reference position for specifying a position in the circumferential direction of the grinding wheel is provided on a core member of each of the grinding wheels, and a plurality of inclined grooves at predetermined angular intervals are formed on a grinding surface of each grinding wheel to be inclined relative to the circumferential direction of each grinding wheel. In order that the fluctuations in the dynamic pressure and the grinding resistance between respective grinding wheels and workpiece portions ground therewith do not grow as a combined or synergy effect, the inclined grooves on each grinding wheel are shifted in angular phase from those on another grinding wheel, so that grinding efficiency and accuracy can be enhanced.

Wheel spindle device for grinding machine

In a grinding wheel in which abrasive tips for rough grinding and abrasive tips for finish grinding are alternately bonded to a periphery of a disk type base rotating about a rotation axis, each abrasive tip includes the abrasive layer formed by bonding abrasive grains and a lower layer overlaid and integrally for led with the abrasive layer. The abrasive tip is attached to the periphery of the base at the lower layer. A Young's modulus of the lower layer of the abrasive tip for finish grinding relative to a load acting on the grinding surface of the abrasive tip in an inward direction of the grinding wheel is less than that of the abrasive tip for rough grinding. Thereby, the surface of a workpiece can be both rough-ground and finish-ground with superhigh-precision surface roughness with using one grinding wheel.

Grinding wheel

Growing community of inventors

Okazaki, Japan

Takayuki Moroto