Dexerials Corporation

Sony Chemicals Corporation

Takayuki Matsushima

Daisuke Masuko

A method for producing a flexible mounting substrate. The method comprises preparing a flexible substrate having a mounting region for mounting an electronic component on an arrangement surface of the flexible substrate, the electronic component including at least one bump, arranging a thermosetting anisotropic conductive film having conductive particles on the mounting region, arranging the electronic component on the anisotropic conductive film, and pressing the electronic component while heating to electrically connect the at least one bump of the electronic component to the mounting region of the flexible substrate, and adhering an adhesion film having an adhesive layer including an adhesive and a base film laminated together on a support surface that is opposite to the arrangement surface of the flexible substrate at least at a portion located on a back surface side of the mounting region before electrically connecting the electronic component and the mounting region.

Method for producing flexible mounting module body

An adhesive film including a substrate film and an adhesive agent layer formed thereon is adhered to the back surface side of a mounting region of a flexible substrate, and an electronic component is mounted on the front surface side. An adhesive agent in the adhesive agent layer contains silica fine particles having a primary particle diameter of less than 100 nm, and the adhesive agent layer has a shear storage elastic modulus at 160&#xb0; C. of 0.15 MPa or more. When the anisotropic conductive film is disposed on the mounting region and the electronic component is mounted on the anisotropic conductive film by heating and pressing, the adhesive agent is not pushed out to a large extent, and conductive particles sandwiched between a bump on the electronic component and the electrode are pressed and squashed, improving an electrical connection between the electronic component and the electrode.

Method for manufacturing flexible mounting module body

The invention provides a resin composition capable of achieving excellent chromaticity and a sufficient degree of cure, an adhesive tape, and a method for producing an adhesive tape. The adhesive tape has at least one layer formed by making a resin composition undergo a polymerization reaction, the adhesive composition including: an acrylic monomer; a photopolymerization initiator; and a coloring agent which has a mean volume particle diameter of not less than 1 &#x3bc;m and not more than 20 &#x3bc;m and in which a pigment is encapsulated in a resin, in which the coloring agent is contained so that the pigment content is not less than 0.25 wt % and not more than 1.0 wt %. This allows aggregation of the coloring agent to be prevented and inhibition of the polymerization reaction to be prevented, and therefore, excellent chromaticity and a sufficient degree of cure can be achieved.

Resin composition, adhesive tape, and method for producing adhesive tape

A novel adhesive cures quickly at a lower temperature and ensures reliable connection of objects the adhesive connects with each other. The adhesive includes a metal chelate, a silane coupling agent and a thermosetting resin. The silane coupling agent in the adhesive is hydrolyzed at its alkoxy groups to form silanol groups, which in turn react with the metal chelate to produce cations in the adhesive. The resulting cations cause the epoxy resin as a thermosetting resin, to undergo cationic polymerization. The adhesive of the present invention cures at a lower temperature by taking advantage of the cationic polymerization.

Adhesive and electric device

With the hardener particle of the present invention, because siloxane or an alkoxy group is bonded to a central metal located on a surface, an adhesive prepared by dispersing the hardener particles in an epoxy resin together with a silane coupling agent hardly causes reaction between the hardener particles and the silane coupling agent at ambient temperature whereby the preserving property of the adhesive is high. Because no siloxane is bonded to metal chelate or metal alcoholate at the part other than the surface of the hardener particles, the hardener particles are broken when the adhesive is heated, and the metal chelate and the metal alcoholate on the part other than the surface of the hardener particles reacts with the silane coupling agent to form cation, thereby polymerizing the epoxy resin with the cation to harden the adhesive even at low temperature within shorter time.

Hardener particle, manufacturing method for hardener particle and adhesive

There is provided an adhesive which hardens under the condition of low temperature within short time and has a high preserving property. The latent hardener of the present invention has hardener particles mainly comprising metal chelate and capsules covering the surface of the hardener particles where, in the surface part of the hardener particles, substituent of the resin component constituting the capsule is bonded to the metal chelate. Accordingly, mechanical strength of the capsule is high whereby the capsule is not broken in a step of kneading the latent hardener with an epoxy resin.

Growing community of inventors

Kanuma, Japan

Takayuki Matsushima