Shinko Electric Industries Co., Ltd.

Takayuki Matsumoto

Tsukasa Nakanishi

Atsushi Nakamura

Tadaaki Katsuyama

Yukinori Hatori

Kiyokazu Sato

Osamu Hoshino

An inductor includes: a first conductor layer including: a pair of first metal pieces; and a first conductor, wherein the first conductor is wound in a spiral shape in the same plane; a second conductor layer including: a pair of second metal pieces, wherein each of the pair of second metal pieces is bonded to a corresponding one of the pair of first metal pieces; and a second conductor, wherein the second conductor is wound in a spiral shape in the same plane, and the second conductor includes an inner circumferential side end portion bonded to an inner circumferential side end portion of the first conductor; a pair of electrodes each of which is bonded to a corresponding one of the pair of second metal pieces; and a sealing resin that covers the first conductor layer, the second conductor layer and the pair of electrodes.

Inductor

An inductor includes a magnetic body, and a conductor embedded in the magnetic body. The conductor includes a first conductor, and a second conductor covering a periphery of the first conductor.

A wiring substrate includes a first metal plate and a second electrode. The first metal plate includes a first electrode, a wiring, and a mount portion for an electronic component. The mount portion includes an upper surface of the wiring. The second electrode is joined to an upper surface of the first electrode. The first electrode is solid. The second electrode is solid.

Wiring structure having stacked first and second electrodes

An inductor includes a first conductor, a second conductor, an insulation film, and a magnetic body. The first conductor spirally extends in a plane. The second conductor spirally extends in a plane. The second conductor is stacked on and joined to the first conductor. The insulation film covers a surface of the first conductor and a surface of the second conductor. The magnetic body covers a surface of the insulation film and embeds the first conductor and the second conductor. The first conductor and the second conductor are connected to form a helical coil.

An embodiment is a wiring substrate that includes a first metal plate. The first metal plate includes a first electrode and a wiring, and the wiring includes a mount portion for an electronic component. The wiring substrate further includes a second metal plate. The second metal plate includes a second electrode diffusion-bonded to an upper surface of the first electrode. The second metal plate includes a first opening that exposes the mount portion. The first opening is large enough to accommodate the electronic component.

Wiring substrate and electronic device

An electronic device includes a first metal plate including a first wiring and a second wiring, an electronic component mounted on a lower surface of the first wiring so as to overlap the second wiring in plan view, a second metal plate including an electrode electrically connected to the lower surface of the first wiring, and an insulation layer filling a space between the first metal plate, the second metal plate, and the electronic component and covering the electronic component. The upper surface of the second wiring is exposed from the insulation layer.

Electronic device

An inductor includes a magnetic material containing a magnetic powder and an insulating resin, a conductive line embedded in the magnetic material, a first electrode partially exposed from the magnetic material and connected to one end of the conductive line, and a second electrode partially exposed from the magnetic material and connected to another end of the conductive line.

Inductor having conductive line embedded in magnetic material

An electronic component includes a metal member, an inductor, and a encapsulating resin. The metal member has an outer lead, an inner lead provided at a position opposed to the outer lead, and a post connecting the outer lead with the inner lead. The inductor is provided between the outer lead and the inner lead and connected to the outer lead or the inner lead. The encapsulating resin encapsulates the metal member and the inductor.

Electronic component and method of manufacturing electronic component

An electronic apparatus includes: a first metal layer; an electronic component that is provided on the first metal layer; a second metal layer that is provided on the first metal layer and on the electronic component; and an insulating resin that fills a space between the first metal layer and the second metal layer so as to cover the electronic component. The second metal layer includes: a sheet-like electrode pad portion; and a connection portion that is disposed along a peripheral edge of the electrode pad portion, and that protrudes from the electrode pad portion toward the first metal layer so as to electrically connect the second metal layer to the first metal layer.

Electronic apparatus

A laminated circuit board includes a base having a first surface, and a second surface on an opposite side from the first surface, a first metal layer provided in the base and including a first electrode exposed from the first surface, and a second metal layer provided in the base and including a second electrode exposed from the second surface. The first metal layer includes an inductor electrically connected to the first electrode, and the first electrode and the second electrode are bonded and electrically connected to each other.

Laminated circuit board, and electronic component

A wiring substrate includes a resin substrate in which first and second through holes are formed, a metallic foil on one surface of the resin substrate coating the through holes and separated into first and second side metallic foils by a border, a first connecting portion formed by a plating film inside the first through hole, a second connecting portion formed by a plating film inside the second through hole, a first slit facing the border and penetrating through the metallic foil and the first connecting portion, a second slit facing the border and penetrating through the metallic foil and the second connecting portion, first and second plating layers on front surfaces of the first and second side metallic foils, bottom surfaces of the first and second connecting portions, and side surfaces inside the first and second slits of the first and second side metallic foils.

Wiring module including wiring substrate having border portion separating two side metallic foils and manufacturing method of wiring module

Wiring substrate having border portion separating two side metallic foils and manufacturing method of wiring substrate

A light-emitting element mounting package including a first wiring forming a first light-emitting element mounting portion, which is provided on one surface of a substrate to mount a light-emitting element, and a first through wiring having one end and another end, the one end being electrically connected to the first light-emitting element mounting portion so as to be thermally transferable, and the other end protruding from another surface of the substrate.

Light-emitting element mounting package having protruded wiring and recessed wiring, and light-emitting element package

A package for mounting a light emitting device thereon. The package includes a substrate, a light emitting device mounting part including a wiring formed on one surface of the substrate, the wiring including two areas that are arranged facing each other and being separated a predetermined interval apart from each other in a plan view, first and second through-wirings that penetrate the substrate and are provided on the two areas, respectively, each of the first and second through-wirings including one end electrically connected to the light emitting device mounting part and another end exposed from another surface of the substrate. A part of each of the first and second through-wirings includes a maximum part having a plan-view shape that is larger than a plan-view shape of the one end of each of the first and second through-wirings.

Growing community of inventors

Nagano, Japan

Takayuki Matsumoto