Sekisui Chemical Co., Ltd.

Takayuki Maeda

Kenji Yamauchi

Shiori Tateno

Yuki Hirose

Motokuni Ichitani

Jiro Miyai

Tasuku Yamada

Hiroaki Takehara

Kenichi Ootsuki

Yukio Ochitani

Yousuke Chiba

Shogo Naruwaki

Hideaki Tanaka

The present invention provides a polyvinyl acetal resin that has an excellent dispersing property and enables the production of a formed article having high mechanical strength. Provided is a polyvinyl acetal resin having a water absorption per unit area of 2 mg/cmor greater and 50 mg/cmor less when formed into a film having a thickness of 10 μm.

Polyvinyl acetal resin

The present invention provides a resin composition for a ceramic green sheet capable of providing a ceramic green sheet that has high mechanical strength even with small thickness and is less likely to have appearance defects after cutting or dimensional changes after drying, and a ceramic green sheet and a multilayer ceramic capacitor each produced using the resin composition for a ceramic green sheet. Provided is a resin composition for a ceramic green sheet, the resin composition containing a polyvinyl acetal resin, the resin composition having a tan δ peak top of 1.25 or more and a loss modulus E″ of 2.30×10Pa or more.

Resin composition for ceramic green sheet, ceramic green sheet, and layered ceramic capacitor

The present invention provides an epoxy adhesive composition capable of reducing re-aggregation of an adhesive layer modifier, maintaining favorable viscosity for a long period of time, exhibiting high adhesiveness, and reducing process failures during application of the adhesive. Provided is an epoxy adhesive composition containing: a modified polyvinyl acetal resin having a constitutional unit with an acid-modified group; an adhesive layer modifier; and an epoxy resin, the epoxy adhesive composition having a ratio of an acid-modified group equivalent of the modified polyvinyl acetal resin to an epoxy equivalent of the epoxy resin (acid-modified group equivalent/epoxy equivalent) of 5.0 to 150.0, the epoxy adhesive composition having a number ratio of the acid-modified group to an epoxy group (acid-modified group number/epoxy group number) of 0.0005 to 0.5.

Epoxy adhesive composition

The present invention provides an epoxy adhesive composition that is excellent in compatibility and storage stability, has high strength and excellent adhesiveness, is capable of reducing occurrence of warping or peeling when used for bonding different materials, and is also excellent in impact resistance after being cured. Provided is an epoxy adhesive composition including: a modified polyvinyl acetal resin having a constitutional unit with an acid-modified group; and an epoxy resin, the epoxy adhesive composition containing an organic solvent in an amount of 10.0% by weight or less.

The present invention aims to provide a modified polyvinyl acetal resin composition that is excellent in storage stability, has high strength and excellent adhesiveness, and is capable of reducing occurrence of warping or peeling when used for bonding different materials. The present invention relates to a modified polyvinyl acetal resin composition containing: a modified polyvinyl acetal resin having a constitutional unit with an imine structure, and an epoxy resin.

Modified polyvinyl acetal resin composition

A polyvinyl acetal resin for a heat-developable photosensitive material capable of preventing skinning in the coating process of the photosensitive layer of the heat-developable photosensitive material, preventing deterioration of image characteristics and coloration of the coating solution, and suppressing the occurrence of odor at the time of producing the heat-developable photosensitive material and heat development. The polyvinyl acetal resin for a heat-developable photosensitive material used for a photosensitive layer of the heat-developable photosensitive material has a residual acetyl group content of 25 mol % or less, residual hydroxyl group content of 17-35 mol %, and polymerization degree of 200 to 3,000, and is obtained by an acetalization of a polyvinyl alcohol mixture containing polyvinyl alcohol resins having different polymerization degrees, wherein the content of the polyvinyl alcohol having a polymerization degree of 600 or less is 50 wt % or higher in the polyvinyl alcohol mixture.

Polyvinylacetal resin for heat-developable photosensitive material and heat-developable photosensitive material

It is an object of the present invention to provide a polyvinyl acetal resin composition capable of giving a ceramic green sheet which has sufficient flexibility and is hardly damaged even when being formed into a thin film and comprises a polyvinyl acetal resin composition containing a polyvinyl acetal resin A and a polyvinyl acetal resin B incompatible with the polyvinyl acetal resin A, which is formed by acetalizing a mixed polyvinyl alcohol containing two or more kinds of polyvinyl alcohols wherein a phase composed of the polyvinyl acetal resin A and a phase composed of the polyvinyl acetal resin B form a sea-island structure.

Polyvinyl acetal resin composition

An object of the present invention is to provide a method for producing a cross-linked polyvinyl acetal resin, which can provide a cross-linked polyvinyl acetal resin having high mechanical strength and excellent solvent resistance by a simple method without a cross-linking agent, and can solve such problems as sheet attack, insufficient strength, and instability of viscosity for a long-time storage, and another object of the present invention is to provide a cross-linked polyvinyl acetal resin produced by the above method for producing a cross-linked polyvinyl acetal resin. The method for producing a cross-linked polyvinyl acetal resin comprises the step of irradiating a polyvinyl acetal resin at least having structural units represented by the following formulas (1) to (4) with ultraviolet light having a wavelength in a range of 200 to 365 nm, wherein Rrepresents a hydrogen atom or a C1-C20 hydrocarbon group; and Rrepresents a group having two or more functional groups, the two or more functional groups each selected from the group consisting of the functional groups represented by the following formulas (5), (6), and (7). 

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Shiga, Japan

Takayuki Maeda