Shin-Etsu Chemical Co., Ltd.

Takayuki Kusunoki

Tsutomu Kashiwagi

Tomoyuki Mizunashi

Toshio Shiobara

Hideo Nakagawa

Yoshihiro Tsutsumi

Nobuhiro Ichiroku

Yuusuke Takamizawa

Hiroyuki Iguchi

Yoshihira Hamamoto

Kinya Kodama

Masao Ando

Atsushi Wakamiya

Yuko Matsushige

Addition-curable silicone composition providing cured product having good performance at low temperature and excellent resistance to a temperature change. Also, semiconductor device having high reliability, whose semiconductor element is encapsulated with a cured addition-curable silicone resin composition comprising (A) a branched organopolysiloxane of formula (1): wherein a is an integer of 2-100, b is an integer of 5-100, c is an integer of 5-100, 0.03&#x2264;a/(a+b)&#x3c;1.0, and a ratio of (RRSiO) units to (RSiO) units is &#x2264;2; (B) an organopolysiloxane of formula (2):(RSiO)(RSiO)(RSiO)(SiO)&#x2003;&#x2003;(2)in an amount of 5-900 parts by mass, relative to 100 parts by mass of (A); (C) an organopolysiloxane having at least two hydrosilyl groups, in an amount such that a ratio of the number of the hydrosilyl groups in (C) to the number of the alkenyl groups in (A) and (B) is 0.4-4.0; and (D) a hydrosilylation catalyst in an amount sufficient to accelerate hydrosilylation.

Addition-curable silicone resin composition and a semiconductor device

One of the purposes of the present invention is to provide a condensation-curable silicone resin composition which show a less increase of the viscosity during handling and cures quickly to provide a cured product which has a very small amount of a remaining catalyst and which has high heat resistance and high light resistance. Thus, the present invention is to provide a condensation-curable silicone composition comprising the following components (A) to (C): (A) 100 parts by mass of an organopolysiloxane which has a branched or network structure and has two or more hydrolyzable groups each bonded to a silicon atom and at least one of (RSiO) and (SiO) units, wherein Ris, independently of each other, a hydrogen atom or a substituted or unsubstituted, monovalent hydrocarbon group having 1 to 12 carbon atoms, (B) 5 to 500 parts by mass of a linear organopolysiloxane having at least one hydrolyzable group bonded to a silicon atom at each of both terminals, and (C) at least one silazane compound represented by the following general formula (3) or (5) or comprising the following units (6) in an amount of 0.02 to 30 parts by mass, relative to total 100 parts by mass of components (A) and (B): 

Condensation-curable silicone resin composition

One of the purposes of the present invention is to provide a curable resin composition which has good curability and provides a cured product having a sufficient hardness, in particular an addition-curable organic silicon resin composition. The present invention provides a curable resin composition comprising the following components (A) to (C): (A) an organic-silicon compound having at least two alkenyl groups in a molecule, (B) an organic silicon compound which is represented by the formula (I) and has at least three hydrosilyl groups each bonded to the carbon atom of the benzene ring in an amount such that a ratio of the number of the hydrosilyl group in component (B) to the number of the alkenyl group in component (A) is 0.4 to 4, 

Curable resin composition

The present invention provides methods of manufacturing a condensation-curable silicone resin composition sheet that is in a plastic solid state or a semi-solid state at ordinary temperature, including: (A) organopolysiloxane having a weight average molecular weight of 5,000 or more and 1,000,000 or less in terms of polystyrene shown by the following formula (1):(RSiO)(RSiO)(RSiO)(SiO)(OR)&#x2003;&#x2003;();together with (B) organopolysiloxane having a molecular weight of 10,000 or more and 1,000,000 or less in terms of polystyrene shown by the following formula (2):(RSiO)(RSiO)(RSiO)(SiO)(OR)(HSi(OR)O)&#x2003;&#x2003;(2)in an amount of 5 to 100 parts by mass based on 100 parts by mass of the component (A). This condensation-curable silicone resin composition sheet is easy to be handled and has high heat resistance and ultraviolet light resistance while being excel in curing characteristics.

Method of manufacturing condensation-curable silicone resin composition sheet, and method of manufacturing light-emitting apparatus

An addition curable resin composition comprising a silphenylene oligomer skeleton-bearing organosilicon compound having at least two alkenyl groups per molecule cures into a product having both a satisfactory hardness and crack resistance.

Addition curable resin composition and semiconductor package

One of the purposes of the present invention is to provide an addition-curable silicone composition which provides a cured product having good performance at a low temperature and excellent resistance to a temperature change, and to provide a semiconductor device having a high reliability, whose semiconductor element is encapsulated with a product obtained by curing the addition-curable silicone composition. Thus, an addition-curable silicone resin composition comprising (A) a branched organopolysiloxane represented by the following formula (1): wherein a is an integer of from 2 to 100, b is an integer of from 5 to 100, c is an integer of from 5 to 100, 0.03&#x2264;a/(a+b)&#x3c;1.0, and a ratio of the number of (RRSiO) unit to the number of (RSiO) unit is 2 or less; (B) an organopolysiloxane represented by the following formula (2): (RSiO)(RSiO)(RSiO)(SiO)(2) in an amount of 5 to 900 parts by mass, relative to 100 parts by mass of component (A); (C) an organopolysiloxane having at least two hydrosilyl groups, in an amount such that a ratio of the number of the hydrosilyl groups in component (C) to the number of the alkenyl groups in components (A) and (B) is 0.4 to 4.0; and (D) a hydrosilylation catalyst in an amount sufficient to accelerate hydrosilylation.

A resin composition comprising (A) a silphenylene skeleton-bearing organosilicon compound containing at least two hydroxyl and/or alkoxy groups per molecule and (B) an organosilicon compound having a hydrogen atom and a hydroxyl and/or alkoxy group on a common silicon atom, or comprising (C) a silphenylene skeleton-bearing organosilicon compound having a hydrogen atom and a hydroxyl and/or alkoxy group on a common silicon atom is condensation curable without a need for catalysts. The cured product has satisfactory hardness, crack resistance, heat resistance and light resistance.

Condensation curable resin composition and semiconductor package

The present invention provides a condensation-curable silicone resin composition sheet that is in a plastic solid state or a semi-solid state at ordinary temperature, including: (A) organopolysiloxane having a weight average molecular weight of 5,000 or more and 1,000,000 or less in terms of polystyrene shown by the following formula (1):(RSiO)(RSiO)(RSiO)(SiO)(OR)&#x2003;&#x2003;(1);together with (B) organopolysiloxane having a molecular weight of 10,000 or more and 1,000,000 or less in terms of polystyrene shown by the following formula (2):(RSiO)(RSiO)(RSiO)(SiO)(OR)(HSi(OR)O)&#x2003;&#x2003;(2)in an amount of 5 to 100 parts by mass based on 100 parts by mass of the component (A). This condensation-curable silicone resin composition sheet is easy to be handled and has high heat resistance and ultraviolet light resistance while being excel in curing characteristics.

Condensation-curable silicone resin composition sheet, method of manufacturing condensation-curable silicone resin composition sheet, and method of manufacturing light-emitting apparatus

A curable silicone resin composition including: (A) an organopolysiloxane having at least two alkenyl groups per molecule, each bonded to a silicone atom and showing a viscosity of 10 to 1,000,000 mPa&#xb7;s at 25 degrees C., and (B) an organopolysiloxane having a resin structure composed of 10 to 80 mol % of SiOunit, 0.1 to 80 mol % of (R)SiOunit and 1 to 60 mol % of (R)SiOunit and having a weight average molecular weight of 1,000 to 10,000. Rrepresents an alkenyl group having 2 to 8 carbon atoms, or a substituted or unsubstituted, monovalent hydrocarbon group having no aliphatic unsaturated group, and Rrepresents, independently of each other, an alkenyl group having 2 to 8 carbon atoms, or a substituted or unsubstituted, monovalent hydrocarbon group having no aliphatic unsaturated group, provided that at least one among all of Ris an alkenyl group.

Curable silicone resin composition

A condensation-curable silicone composition provides a cured product having good performance at a low temperature, excellent resistance to a temperature change, and a crack resistance, and a semiconductor device has a high reliability, whose semiconductor element is encapsulated with the cured product. A condensation-curable silicone composition has (A) a branched organopolysiloxane represented by formula (1-1) or (1-2) with a short branch made of 1 to 4 siloxane units and (C) a condensation catalyst in a catalytic amount. Further, a condensation-curable silicone composition also has (B) an organopolysiloxane having a network structure and represented by formula (2). Further, a semiconductor device is provided with a cured product obtained by curing the condensation-curable silicone composition.

Condensation-curable silicone composition and a semiconductor device

An addition/condensation curable silicone resin sheet comprising (A) an organopolysiloxane containing at least two silicon-bonded alkenyl groups and at least two silicon-bonded alkoxy or hydroxyl groups, (B) an organopolysiloxane containing at least two silicon-bonded hydrogen atoms and at least two silicon-bonded alkoxy or hydroxyl groups, (C) an organopolysiloxane containing at least two silicon atoms having two alkoxy or hydroxyl groups and one hydrogen atom on a common silicon atom, and (D) a hydrosilylation catalyst is plastic and solid or semisolid at normal temperature. The silicone resin sheet is easy to work, effective to cure, and likely to form a cured layer around an LED chip.

Addition/condensation curable silicone resin sheet, wavelength conversion sheet, and manufacture of light-emitting package

An organopolysiloxane having at least 4 terminal hydrosilyl groups per molecule is novel. Also provided is an addition curable silicone composition comprising (A) a linear organopolysiloxane having at least two alkenyl groups per molecule, (B) an organopolysiloxane having at least 4 terminal hydrosilyl groups per molecule, and (C) a hydrosilylation catalyst.

Hydrosilyl-containing organopolysiloxane, making method, addition curable silicone composition, and semiconductor package

One of the purposes of the present invention is to provide a method for preparing an organopolysiloxane having a short branch chain. In particular, the purposes of the present invention is to provide a method for preparing an organopolysiloxane having a shorter side chain than a main chain, such as a siloxane side chain having 1 to 5 siloxane units. The present preparation methods are characterized in that the starting material is an organosiloxane which is represented by the formula (1) and has two hydrolyzable groups bonded to a silicon atom at one terminal. The present invention provides a method wherein an organo(poly)siloxane represented by the formula (1) is condensation reacted to prepare an organopolysiloxane represented by formula (2) which is then used as starting materials for introducing a branch, whereby a short siloxane side chain is efficiently introduced in the organopolysiloxane, while controlling a structure of the main chain.

Branched organopolysiloxane and a method for preparing the same

An addition curable organopolysiloxane composition comprising (A) an organopolysiloxane having at least two alkenyl groups per molecule, (B) a silphenylene oligomer having at least two silicon-bonded hydrogen atoms per molecule, and (C) a hydrosilylation catalyst cures into a product having both a satisfactory hardness and crack resistance.

Addition curable organopolysiloxane composition, and semiconductor package

The present invention provides a condensation-curable silicone resin composition containing (A) 100 parts by mass of one or more polyorganosiloxanes represented by the following average composition formula (1): (RSiO)(RSiO)(RSiO)(SiO)(1), and (B) 0.1 to 500 parts by mass of a polyorganosiloxane having one or more silicon-bonded hydrogen atoms and two or more silicon-bonded &#x2014;OX groups per molecule, wherein at least one silicon atom is bonded to both of one or more hydrogen atoms and one or more &#x2014;OX groups. There can be provided a condensation-curable silicone resin composition that can quickly provide a cured product having high heat resistance and light resistance.

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Annaka, Japan

Takayuki Kusunoki