Murata Manufacturing Co., Ltd.

Takayuki Kayatani

Yasuo Fujii

Takashi Sawada

Akihiro Motoki

Makoto Ogawa

Takehisa Sasabayashi

Hidekiyo Takaoka

Shinichiro Kuroiwa

Toshiyuki Iwanaga

Shinichi Kobayashi

Kunihiko Hamada

Yoshikazu Sasaoka

Masahito Saruban

Akihiro Yoshida

Kotaro Shimizu

Yasunori Taseda

A multilayer ceramic electronic component includes a laminated body, a first external electrode, a pair of second external electrodes, and a pair of insulating coating portions. The pair of insulating coating portions extends in a laminating direction between each of the pair of second external electrodes and the first external electrode on a second principal surface, from the second principal surface to respective portions of a first side surface and a second side surface. As viewed from at least one direction in the laminating direction, an end of the first external electrode and pair of second external electrodes, which is located closest to a first principal surface, is located closer to the first principal surface than an end of the pair of insulating coating portions, which is located closest to the first principal surface.

Multilayer ceramic electronic component

A multilayer ceramic electronic component includes a laminated body, a first external electrode, a pair of second external electrodes, and a pair of insulating coating portions. The pair of insulating coating portions extends in a laminating direction between each of the pair of second external electrodes and the first external electrode on a second principal surface, from the second principal surface to respective portions of a first side surface and a second side surface. As viewed from at least one direction in the laminating direction, an end of the pair of insulating coating portions, which is located closest to a first principal surface, is located closer to the first principal surface than an end of the first external electrode and pair of second external electrodes, which is located closest to the first principal surface.

A multilayer ceramic electronic component includes a laminated body, a first external electrode, a pair of second external electrodes, and a pair of insulating coating portions. The pair of insulating coating portions extends in a laminating direction between each of the pair of second external electrodes and the first external electrode on a second principal surface, from the second principal surface to respective portions of a first side surface and a second side surface. A maximum thickness of the first external electrode on the second principal surface is larger than a maximum thickness of the pair of second external electrodes on the second principal surface. The maximum thickness of the pair of second external electrodes on the second principal surface is larger than a maximum thickness of the pair of insulating coating portions on the second principal surface.

An electronic component includes a laminated body including dielectric layers and internal electrode layers, a first external electrode, a pair of second external electrodes, and a pair of insulating coating portions. The internal electrode layers include first and second internal electrode layers, the second internal electrode layers each include first and second extended electrode portions. A relationship of L/L&#x3e;1.0 is satisfied when a length of a first contact portion with one second external electrode in contact with the first extended electrode portion in the length direction is L, and a length of a second contact portion with the other second external electrode in contact with the second extended electrode portion in the length direction is L

Electronic component

A multilayer ceramic electronic component includes a laminated body, a first external electrode, a pair of second external electrodes, and a pair of insulating coating portions. The insulating coating portions extend in a laminating direction between each of the second external electrodes and the first external electrode on a second principal surface, and from the second principal surface to respective portions of first and second side surfaces. A maximum thickness of the first external electrode on the second principal surface is larger than a maximum thickness for each of the second external electrodes on the second principal surface. A maximum thickness for each of the insulating coating portions on the second principal surface is larger than the maximum thickness of the first external electrode on the second principal surface.

Multilayer ceramic electronic component including external electrodes and insulating coating portions

An electronic component includes a multilayer body, first to fourth outer electrodes, a pair of first insulating coating portions, and a pair of second insulating coating portions. The pair of first insulating coating portions is in at least one of a state in which inner end portions are in contact with the third outer electrode and a state in which outer end portions are in contact with the first outer electrode and the second outer electrode. The pair of second insulating coating portions is in at least one of a state in which inner end portions are in contact with the fourth outer electrode and a state in which outer end portions are in contact with the first outer electrode and the second outer electrode.

An electronic component has dimensions (length&#xd7;width&#xd7;thickness) of about 0.6 mm to about 1.0 mm&#xd7;about 0.3 mm to about 0.5 mm&#xd7;about 0.07 mm to about 0.15 mm. An area of a triangle defined by a first hypothetical straight line being in contact with the top of a portion of an outer electrode positioned on a first main surface at a center in the width direction and extending in the length direction, a second hypothetical straight line being in contact with the top of a portion of the outer electrode positioned on the first end surface at the center in the width direction and extending in the thickness direction, and a third hypothetical straight line being in contact with the outer electrode at the center in the width direction and being inclined at about 45&#xb0; with respect to the first and second hypothetical straight lines is about 450 &#x3bc;mor larger.

A method is used to manufacture a multilayer electronic component including a multilayer composite including internal electrodes having ends that are exposed at a predetermined surface of the multilayer composite. In the method, the exposed ends of the internal electrodes are coated with a metal film primarily composed of at least one metal selected from the group consisting of Pd, Au, Pt and Ag and having a thickness of at least about 0.1 &#x3bc;m by immersing the multilayer composite in a liquid containing a metal ion or a metal complex. Then, a continuous plating layer is formed by depositing a plating metal on the ends of the internal electrodes exposed at the predetermined surface of the multilayer composite, and subsequently growing the deposits of the plating metal so as to be connected to each other. Thus, exposed ends of the internal electrodes are electrically connected to each other.

Multilayer electronic component

In a laminate type ceramic electronic component, when an external electrode for a laminated ceramic capacitor is formed directly by plating onto a surface of a component main body, the film that is directly plated may have a low fixing strength with respect to the component main body. As the external electrode, a first plating layer composed of a Ni&#x2014;P plating film with a P content rate of about 9 weight % or more is first formed such that a plating deposition deposited with the exposed ends of respective internal electrodes as starting points is grown on at least an end surface of a component main body. Then, a second plating layer composed of a Ni plating film containing substantially no P is formed on the first plating layer. Preferably, the first plating layer is formed by electroless plating, whereas the second plating layer is formed by electrolytic plating.

Laminate type ceramic electronic component and manufacturing method therefor

In a laminate type ceramic electronic component, when an external electrode is formed directly by plating onto a surface of a component main body, the plating film that is to serve as the external electrode may have a low fixing strength with respect to the component main body. In order to prevent this problem, an external electrode includes a first plating layer composed of a Ni&#x2014;B plating film and is first formed such that a plating deposition deposited with the exposed ends of respective internal electrodes as starting points is grown on at least an end surface of a component main body. Then, a second plating layer composed of a Ni plating film containing substantially no B is formed on the first plating layer. Preferably, the B content of the Ni&#x2014;B plating film constituting the first plating layer is about 0.1 wt % to about 6 wt %.

A multilayer ceramic electronic component includes a ceramic body including a plurality of ceramic layers, the ceramic body having a first main surface and a second main surface and a plurality of side surfaces that connect the first main surface to the second main surface, an internal conductor including nickel, the internal conductor being disposed in the ceramic body and having an exposed portion exposed at least one of the side surfaces, and an external terminal electrode disposed on at least one of the side surfaces of the ceramic body, the external terminal electrode being electrically connected to the internal conductor. The external terminal electrode includes a first conductive layer including a Sn&#x2014;Cu&#x2014;Ni intermetallic compound, the first conductive layer covering the exposed portion of the internal conductor at least one of the side surfaces of the ceramic body.

Multilayer ceramic electronic component and method for making the same

In a ceramic electronic component, an electrically conductive resin layer is arranged to cover a thick film layer and to extend beyond the end of the thick film layer by at least about 100 &#x3bc;m and a plating layer is arranged to cover the electrically conductive resin layer except a region having a dimension of at least about 50 &#x3bc;m and extending along the end of the electrically conductive resin layer. Consequently, the concentration of the stress is reduced.

Ceramic electronic component and method for manufacturing the same

A multilayer ceramic electronic component is prepared by covering a capacitor element with a thermoplastic resin layer that is mounted on a substrate by soldering. The thermoplastic resin layer is molten due to the heat required for soldering. The molten resin layer flows to expose external electrodes of the electronic component. The exposed external electrodes are soldered to electrodes of the substrate. In the resultant mounting structure, the thermoplastic resin layer covers substantially the entire surface except for the soldered portion of the electronic component and a portion of the solder.

Multilayer ceramic electronic component and mounting structure and method for the same

A ceramic electronic component includes a ceramic body; terminal electrodes formed on the ceramic body; and lead terminals joined to the terminal electrodes with solder containing Sn. Each terminal electrode includes a first electrode layer formed on the ceramic body and a second electrode layer formed on the first electrode layer. The second electrode layer contains a conductive constituent containing at least Zn, Ag and/or Cu, and Sn. The Zn content in the second electrode layer is about 4% by weight or more in relation to 100% by weight of the conductive constituent and is within the solubility limit not forming AgZn and/or CuZn intermetallic compounds.

Growing community of inventors

Nagaokakyo, Japan

Takayuki Kayatani