Mitsubishi Denki Kabushiki Kaisha

Konica Corporation

The University of Tokyo

Takayuki Katoh

Yoshihiro Notani

Hiroyuki Honda

Akira Inoue

Miyo Miyashita

Teruyuki Shimura

Hiroaki Suga

Kazuhiko Nakahara

Satoshi Honda

Takayuki Matsuzuka

Kenji Negishi

Akira Ishisaka

Hiroto Matsubayashi

Kei Goto

Hiroya Kimoto

Nobuya Yamamoto

Takumi Suetsugu

Atsuko Ichikawa

Kei Gotoh

Naofumi Iwamoto

Takeshi Aso

The purpose of the present invention is to provide, for translation in a cell-free translation system, a novel translation system capable of synthesizing a peptide having therein consecutive non-proteinogenic amino acids. The present invention provides a tRNA containing the base sequence represented by SEQ ID NO: 1 and encoding a non-proteinogenic amino acid.

Modification of D- and T-arms of tRNA enhancing D-amino acid and β-amino acid uptake

An inspection method includes performing an inspection by applying a probe to pads of a contact check pattern located, together with a chip pattern, on a wafer, and performing an inspection by applying the probe to pads of the chip pattern if a result of the inspection using the contact check pattern is within a predetermined range. A pattern having the same size as that of the chip pattern, differing in external appearance from the chip pattern, and having the same pads as those of the chip pattern is used as the contact check pattern.

Method of inspecting semiconductor device chip patterns on a wafer

A textile printing apparatus is provided with an inputting device for inputting image data; a display to indicate an image based on the image data inputted by the inputting means; an image processing device for applying image processing to the image data so as to make colors of the image indicated on the display close to desired colors; and a printer to print the image on a fabric based on the image data applied with the image processing by the image processing means.

Inkjet type color image processing apparatus for textile printing

An image forming method comprising the steps of: forming an image by jetting an ink comprising a high-boiling point solvent onto a textile; and removing the high-boiling point solvent from the image-formed textile by drying the fabric under depressurized condition.

Image forming method and image forming system

An ink-jet printer comprises: a recording head to eject ink through a nozzle; a conveying element located so as to face the recording head and conveying a recording medium onto which an image is recorded employing the recording head; and a recording medium expansion and contraction-preventing means provided at a contacting portion where the conveying element contacts the recording medium.

Ink-jet printer

A probe whose characteristic impedance can be accurately adjusted to a desired value with the production of a small number of prototypes. The probe includes a first line with a signal terminal to be connected to a signal electrode of a circuit to be measured and at least one first region connected to the signal terminal and to which one end of a chip capacitor is connected, a second line connected to a terminal of the first line and a junction to be connected to a measuring instrument at the remaining terminal, and an impedance matched to a characteristic impedance of the measuring instrument, a ground connector with a ground terminal to be connected to the ground electrode of the circuit to be measured, and at least one second region connected to the ground terminal and on which the remaining terminal of the chip capacitor is mounted in one-to-one correspondence with the first region. The impedance of the probe viewed from the circuit to be measured is provided by the chip capacitor mounted at specified positions within the first region and the second region.

High frequency probe for examining electric characteristics of devices

An RF signal input terminal having an RF signal input pad connected to a switching element and grounding pads adjacent to the RF signal input pad, and RF signal output terminals, so that the directions of arrangements of signal pads and grounding pads adjacent thereto extend parallel to the direction of an arrangement of the RF signal input pad and grounding pads of the RF signal input terminal. The signal pads are connected to the switching element, and are disposed on a semiconductor substrate provided with the switching element.

High-frequency integrated circuit and high-frequency circuit device using the same

A compact high-frequency circuit device including a signal distribution circuit and a signal combining circuit. The high-frequency circuit device has a multilayer circuit, and the multilayer circuit includes a first conductor for transmitting a signal; a first dielectric layer in which the first conductor is embedded; a first ground conductor layer on one surface of the first dielectric layer and having a first opening; a second ground conductor layer on the other surface of the first dielectric layer and having another first opening, the first openings of the first and second ground conductor layers being mutually opposed; second dielectric layers, one being provided on the surface of the first ground conductor layer, and the other on the surface of the second ground conductors layer; and a pair of second conductors for transferring a signal, one being provided on the surface of one of the dielectric layers and the other on the surface of the other second dielectric layer, portions of the second conductors being mutually opposed at the first openings.

Compact high-frequency circuit device

A millimeter-wave device includes a pedestal having an upper surface; a microwave IC chip operating at a millimeter wave band, the chip being mounted on the upper surface of the pedestal; line substrates having respective transmission lines connected to the microwave IC chip, the line substrates being mounted on opposite sides of the microwave IC chip on the upper surface of the pedestal; a lid covering and sealing the microwave IC chip and the line substrates, the lid being disposed opposite the upper surface of the pedestal; and waveguides, each waveguide including a waveguide input/output part having an opening penetrating the pedestal transverse to the upper surface and a waveguide end portion connected to the waveguide input/output part, the waveguides being disposed in the vicinity of opposite ends of the pedestal. The transmission lines of the line substrates and the waveguides are connected to each other by E-plane probes, and the line substrates are mounted covering the openings at the upper surface of the pedestal. Consequently, hermetic sealing of the microwave IC chip can be secured, whereby a millimeter-wave device having low loss and high reliability is obtained.

Hermetically sealed millimeter-wave device

A semiconductor element evaluating apparatus for evaluating an electrical characteristic of a semiconductor element used in a microwave band includes a pedestal having first and second waveguide parts for exchanging signals with external devices and penetrating the pedestal, a mode converting carrier member placed on the pedestal and having first and second waveguide parts and first and second microstrip lines sandwiching a region where a semiconductor element is to be mounted, and waveguide terminal structures placed on the mode converting carrier member. The first and second waveguide parts of the pedestal, the mode converting carrier member, and the terminal parts form first and second waveguides. One semiconductor element can be exchanged for another semiconductor element merely by exchanging one mode converting carrier member for another, and the length of the transmission line is shortened whereby transmission loss is reduced.

Semiconductor element evaluating apparatus

In method of manufacturing a light transmitting plastic member having a desired optical characteristic distribution from a gelled base material having a rotation axis, the base material is places in a monomer having an optical characteristics different from that of the base material, and is rotated around the rotation axis thereof in the monomer so that the monomer is diffused into the base material while the base material is rotated. The light transmitting plastic member is made from the base material.

Plastic light transmitting body, its production methods and apparatus

A semiconductor device includes a substrate having a microwave semiconductor element, a microwave transmission line disposed on the substrate and electrically connected to the microwave semiconductor element, and a waveguide terminal structure disposed in the substrate and connected to an end of an external waveguide, wherein an end of a signal conductor of the microwave transmission line is included in the waveguide terminal structure. Input and output of microwave signals between the semiconductor device and an external device are carried out simply by applying an end of the external waveguide to the waveguide terminal structure. As a result, even when the substrate of the semiconductor device warps, an input-output characteristic evaluation of the semiconductor device is carried out with high stability. Further, the microwave signals are transmitted from the external waveguide directly to the microwave transmission line on the substrate or from the microwave transmission line directly to the external waveguide, thereby reducing transmission loss of the microwave signals.

Microwave semiconductor device and integrated circuit including

A high frequency IC package includes a dielectric package body having a surface, a high frequency signal transmission line and a power supply line disposed on the surface of the package body, a high frequency IC chip disposed on the surface of the package body and electrically connected to the high frequency signal transmission line and the power supply line by wires, and a lid hermetically sealing and shielding the IC chip. The lid includes a plane part parallel to the surface of the IC chip and side walls, perpendicular to the plane part, surrounding the IC chip. Since the side wall is not present on the surface of the package body but included in the lid, during the wire-bonding process of the IC chip, unfavorable contact between the cavity wall and bonding tool is avoided, reducing the lengths of bonding wires and signal transmission lines. As the result, reflection loss, conductor loss, and cavity resonance are reduced.

High frequency IC package

A high frequency wafer probe for measuring characteristics of a device operating in a high frequency range includes a waveguide serving as a grounding conductor of the probe, an end of which is open, having a tip and extending from an upper wall of the waveguide in the vicinity of the open end which gradually increases in extent as it approaches the open end and the tip; a signal contact part disposed on a tip of the ridge for contacting a signal input terminal of a device under test; and a plurality of grounding contact parts disposed on the same plane as the signal contact part opposite to each other with the signal contact part between two of the signal contact parts for contacting a plurality of grounding terminals of a device under test. In this structure, the contact parts of the probe can be accurately positioned on the terminals of an IC chip under test, and the contact conditions are easily visually confirmed. In addition, a high frequency wafer probe with low loss and low reflection is achieved.

High frequency wafer probe including open end waveguide

An optoelectronic integrated circuit includes a light responsive element for converting an optical signal into an electrical signal and an electronic circuit for processing the electrical signal. The light responsive element is disposed on a first surface of a substrate and includes p side electrodes and n side electrodes alternatingly arranged parallel to each other. The electronic circuit is disposed on a second surface of the substrate. The light responsive element is electrically connected to the electronic circuit by a via hole penetrating the substrate. In this structure, light incident on the first surface is almost completely absorbed by the substrate and hardly reaches the electronic circuit on the second surface. Therefore, variations in operation of the electronic circuit, such as an increase in drain current, are reduced. In addition, since the degree of freedom in arranging these elements on both surfaces of the substrate is increased, high-density integration is achieved, resulting in a small-sized IC chip.

Growing community of inventors

Tokyo, Japan

Takayuki Katoh