Murata Manufacturing Co., Ltd.

Takayuki Horibe

Nobumitsu Amachi

Masahiro Izawa

Masayuki Kobayashi

Toshihiro Hosokawa

Suguya Ibaraki

Takuya Kidera

Koudai Yokote

Hiroyuki Niwa

Ryuhei Nakai

A data sequence to be transmitted is constituted by a data body and preceding data. The amount of preceding data is smaller than that of data body. If it is determined as a result of executing carrier sensing that a frequency band of radio waves to be transmitted is not being used by another contending communication system, the preceding data is transmitted after the lapse of a predetermined time. If it is determined as a result of executing carrier sensing after completion of transmitting of the preceding data that the frequency band is not being used by another contending communication system, the data body is transmitted after the lapse of a predetermined time. If it is determined that the frequency band is being used, the contention for the frequency band is avoided.

Wireless communication device and wireless communication method using a carrier sensing technique

An antenna element includes an antenna board, a radiation conductor including radiation portions including a top surface portion and being divided at positions corresponding to frequency bands and provided with respect to a first feeding point in plan view of the antenna board, through-conductors penetrating the antenna board at respective positions of end portions of the top surface portion in a thickness direction, and bottom surface electrodes provided on a bottom surface of the antenna board opposite the end portions of the top surface portion, and connected to the top surface portion via the through-conductors.

Antenna element, antenna unit and communication module

In a high frequency module, electronic components are mounted on a mounting surface of a collective substrate including a plurality of unit substrates that include a via conductor electrically conducted to a ground potential in a peripheral portion thereof, and the mounting surface and the electronic components are encapsulated with an encapsulation layer. The collective substrate is cut on the encapsulation layer side, thereby forming a half-cut groove penetrating through the encapsulation layer and extending halfway along the collective substrate in a thickness direction such that the via conductor is exposed only at a bottom surface of the half-cut groove. A conductive shield layer is formed to cover the encapsulation layer and is electrically conducted to the exposed via conductor. The collective substrate is then cut into individual unit substrates each including the conductive shield layer electrically conducted to the ground potential through the via conductor.

Method of manufacturing high frequency module and high frequency module

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Nagaokakyo, Japan

Takayuki Horibe