Panasonic Corporation

Takayuki Higuchi

Atsushi Yamaguchi

Hidenori Miyakawa

Yoshihiro Tomura

Arata Kishi

Kentaro Kumazawa

Naomichi Ohashi

Shigeaki Sakatani

Kazuhiro Nobori

Koso Matsuno

Hirohisa Hino

Taro Fukui

Hideyuki Tsujimura

Koujiro Nakamura

Kumiko Sugiyama

The invention relates to a thermosetting resin composition which includes a metal filler component, a fluxing component and a thermosetting resin binder. The metal filler component includes at least one of bismuth (Bi) and indium (In), and tin (Sn). The fluxing component, which at least one of a compound of structural formula (1) below and a compound of structural formula (2) below, is used. In the above formulas, Rto Rare each a hydrogen or alkyl group, and X is an organic group which has a lone electron pair or double bond &#x3c0; electrons and is capable of coordinating with a metal.

Thermosetting resin composition, method of manufacturing the same and circuit board

Disclosed is an electrically conductive paste which enables to reduce the level of void growth in a conducting pathway formed in a joint part produced after curing the electrically conductive paste in the implementation of an electronic component on a circuit board by using the electrically conductive paste, and which contains a reduced amount of a viscosity-adjusting/thixotropy-imparting additive. Two Sn-containing low-melting-point alloy particles having different melting points and different average particle diameters are selected as electrically conductive filler components to be used in an electrically conductive paste, and the two alloy particles are mixed at a predetermined ratio for use.

Electrically conductive paste, and electrical and electronic device comprising the same

A mounting structure is provided which includes an electronic component; a circuit board; a first insulating resin and a second insulating resin which are placed between the electronic component and the circuit board, for sealing; a plurality of bumps are formed on the electronic component or the circuit board; a plurality of counter electrodes of the circuit board or the electronic component, connected to the plurality of bumps; and a plurality of joining regions. The plurality of joining regions are formed by the second insulating resin, a plurality of first insulating resin regions are disposed around the joining regions so that the joining regions are sandwiched by the plurality of first insulating resin regions, the first insulating resin and the second insulating resin each contain filler, and the second insulating resin has a higher curing temperature than the curing temperature of the first insulating resin.

Method of manufacturing mounting structure and mounting structure

A conductive paste includes a filler component and a flux component; the filler component including a first conductive filler and a second conductive filler having different melting points, and the melting point of the first conductive filler being higher than the melting point of the second conductive filler by 20&#xb0; C. or more; the flux component including a first flux and a second flux having different melting points, the melting point of the first flux being higher than the melting point of the second flux, and the melting point of the first flux being higher than the melting point of the second conductive filler by 15&#xb0; C. to 45&#xb0; C.; and the melting point of the second flux being equal to or less than the melting point of the second conductive filler.

Conductive paste and mounting structure using the same

A flip-chip mounting apparatus has a shield film () on the side of a pressurizing film () of a tool protection sheet (). When a semiconductor chip () is heated and pressurized via the tool protection sheet (), the pressurizing film () is released from a mold by a sheet fixing jig (), and is expanded by a pressurizing/heating tool () to abut against an insulating resin film () protruding from the periphery of the semiconductor chip () and cure the insulating resin film () with an external pressure being applied.

Flip-chip mounting method, flip-chip mounting apparatus and tool protection sheet used in flip-chip mounting apparatus

A conductive bonding material having an improved preservation stability, and hardens when desired, preferably immediately hardens at a low temperature is provided. In one invention, the conductive bonding material comprises a conductive particle ingredient, an epoxy resin ingredient, and a hardening agent ingredient for said epoxy resin and the hardening agent ingredient for said epoxy resin further comprise a reforming agent having a thiol group. In another invention, a conductive bonding material comprising an epoxy resin hardening ingredient, wherein said epoxy resin hardening ingredient contains a sulfur-containing compound having an end group which can coordinate with a surface of the metallic particles, and the sulfur-containing compound comes to perform as a hardening agent for the epoxy resin by dissociating from the surface of the metallic particles. The conductive bonding material may contain fragrance.

Electroconductive bonding material and electric/electronic device using the same

The present invention provides an electrically conductive adhesive which prevents migration and sulfuration of a metal component in electronic component mounting. The electrically conductive adhesive includes a thermosetting resin and metal filler particles dispersed in the thermosetting resin. It is possible to use, as the metal filler particles, metal filler particles having a composition including an alloy of Ag with at least one metal selected from the group consisting of Sn, Cu, In, Bi and Ni, a mixture of such metal filler particles and Ag filler particles, and metal filler particles including Ag filler particles and a coating layer formed on the surface of the Ag filler particles using a metal such as Sn.

Growing community of inventors

Osaka, Japan

Takayuki Higuchi