Taiyo Ink Mfg. Co., Ltd.

Takayuki Chujo

Arata Endo

An object of the present invention is to provide: a dry film comprising a resin layer which has excellent detachability from a carrier film and in which cracking and powdering are inhibited; and a printed wiring board comprising a cured article obtained by curing the dry film. The dry film comprises a resin layer containing a thermosetting resin component, a filler and at least two solvents, wherein the at least two solvents both have a boiling point of 100&#xb0; C. or higher and the boiling points of the at least two solvents are different by not less than 5&#xb0; C.

Dry film and printed wiring board

An object of the present invention is to provide: a heat-curable composition capable of yielding a cured article in which crack generation during a heating-cooling cycle can be inhibited; a dry film thereof; and a printed wiring board comprising the cured article. The heat-curable composition is characterized by comprising a semisolid or a solid epoxy compound and a curing accelerator that is made miscible with the epoxy compound when heated at 130 to 220&#xb0; C. The dry film comprises a resin layer formed from this heat-curable composition, and the printed wiring board comprises a cured article obtained from the heat-curable composition or the dry film.

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Hiki-gun, Japan

Takayuki Chujo