Hitachi, Ltd.

Hitachi Chemical Company, Ltd.

Hitachi Construction Machinery Co., Ltd.

Hitachi Plant Technologies, Ltd.

Takayuki Atarashi

Takahiro Daikoku

Toshio Hatada

Tetsuya Tanaka

Hiroshi Fukuda

Hitoshi Matsushima

Fumiyuki Kobayashi

Shizuo Zushi

Kenichi Kasai

Tamotsu Tsukaguchi

Toshiki Iino

Shuichi Terakado

Kenji Fujita

Shunsuke Yamana

Junichi Kobayashi

Yutaka Watanabe

Tadakatsu Nakajima

Yoshihiro Kondo

Yoshihiro Takada

Akio Idei

Mitsuo Miyamoto

Masato Nakanishi

Yasunori Ota

Akihiro Takanashi

Shigeyasu Tsubaki

Hiroyuki Toyoda

Susumu Iwai

Shigekazu Kieda

Yasuhiro Kashirajima

Takumi Sugiura

Tomoo Hayashi

Shinya Okumura

Nobuo Kawasaki

Michihito Watarai

Yutaka Hayashi

Hiroshi Akai

Shigehisa Funabashi

Yoshito Hayashi

Naoki Yotsumoto

Satomi Kobayashi

Yasumasa Nagawa

The construction machine including an engine room having an engine, a radiator ii for cooling the engine, and a hydraulic pump which are arranged therein, and a counterweight area which is located adjacent to the engine room and in which batteries are installed, a ventilation passage for cooling the engine room and a ventilation passage for cooling the batteries are formed separately and independently in the substantially same direction, and a flowing direction of cooling air flowing in the ventilation passage for cooling the engine room and a flowing direction of cooling air flowing in the ventilation passage for cooling the batteries are substantially parallel to each other.

Cooling structure for construction machine

An electronic apparatus, such as a blade server or the like, has a cooling system for efficiently cooling a plurality of heat generating semiconductor devices, such as a CPU, mounted on blades which is freely put on and taken off. The cooling system includes a thermosiphon which transfers heat from devices having relatively high heat generation, such as CPU or the like, to the outside of the apparatus, heat pipes which transfer heat of devices having relatively low heat generation to the thermosiphon, a thermal highway which is thermally coupled to the thermosiphon by the mounting of blades into a housing and collects and transfers the heat from the thermosiphon and the heat pipes, and a condenser which transfers the heat collected and transferred by the thermal highway outside a housing.

Electronic apparatus

A cooling jacket for cooling a heat-generating element through transmitting heat-generation into a coolant flowing within an inside of the cooling jacket, which is mounted within an electronic apparatus, and includes a base portion, and a cover portion. The base portion includes a heat-transfer surface in proximity to a surface of the heat-generating element, and a plurality of wall portions. Each wall portion is defined to extend into a direction perpendicular to the heat-transfer surface, thereby defining flow passages for the fluid coolant between the wall portions. The cover portion is attached on the base portion surrounding a periphery of the base portion, thereby defining a passage for guiding the fluid coolant into the base portion. The base portion builds up the sector-shaped flow passages and a summit portion at a central portion of the base, and has a configuration that is thermally isotropic to the heat-generating element.

Cooling jacket

A disk array apparatus includes a plurality of disk drives arranged in at least one disk drive line in a direction of an airflow, at least one shield plate, a housing containing the disk drives and the at least one shield plate therein, and flow passages arranged between an upper surface of the disk drives and an inner wall of the housing for enabling the airflow to pass through. The at least one shield plate is arranged between at least two of the disk drives of the at least one disk drive line for controlling the airflow on a downstream side of the flow passages.

Disk array apparatus for providing equalized cooling

A disk array system includes a plurality of disk drives and at least one unit box including the plurality of disk drives aligned in the thickness direction of the disk drive, each disk drive including a thin case accommodating a recording disk, a read/write head, and a driving mechanism for driving the recording disk and the read/write head, and a control board for controlling the driving mechanism, the control board being mounted on the thin case. In the disk array system, the thin case and the unit box are composed of a thermally-conductive material, the unit box includes surfaces parallel to the thickness direction of the plurality of disk drives, and at least one of the surfaces has a cold plate filled with a refrigerant. Heat generated at the disk drives is transferred to the cold plate, thereby improving cooling performance.

Disk array system

In a disc array apparatus having a plurality of disc units, and a plurality of first connectors, each of which disc units includes a disc casing surrounding at least one recording disc rotatable therein on a rotatable axis, a casing holder on which the disk casing is mounted, and a second connector (detachably) connectable to corresponding one of the first connectors so that at least an electric connection between the disc casing and the corresponding one of the first connectors is capable of being formed through the second connector, the disk casing is connected to the casing holder in such a manner that a heat energy generated for at least one of recording an information onto the recording disc and reading out the information from the recording disk is capable of transferring from the disk casing to the casing holder.

Dish array apparatus with improved heat energy transfer

An edge light display unit includes light generating sources, a substrate mounting the light generating sources, a lens, a diffusion plate expanding light input in a side surface of the diffusion plate as to irradiate a front surface of the diffusion plate, and a heat sink thermally contacted with the substrate. A base portion of the heat sink has a substrate mounting surface and a fin constituting surface substantially perpendicular to the substrate mounting surface. At least one fin extends from the fin constituting surface in a direction substantially perpendicular thereto and along the plurality of light generating sources in a direction parallel to substrate. An air supply and exhaust surface of a cooling air are formed in a back surface side of the display unit.

Display unit

In this invention, the CPU of a NAS board, which is liable to become hot, is cooled by concentrating a larger amount of air onto a heat sink. A plurality of logic circuit boardsare mounted on a control sectionD of a disc array device. The circuit componentA for realizing the NAS function, liable to become hot, is provided with a heat sink. The aperture of the main air inlet section (Wb) is covered with a top plate. Airflow guidance sections (Wa, Wc) are respectively provided on both sides of the main air inlet section. Since the fin pitch of the airflow guidance sections is set narrow, the air inflow resistance (airflow resistance) of these is higher than that of the main air inlet section. Due to this difference in airflow resistance, the air in the vicinity of the airflow guidance sections is guided into the main air inlet section. The top plateprevents outflow of air that has flowed into the main air inlet section to outside the heat sink

Storage device system and cooling structure for logic circuit board for storage device system

A highly reliable electronic apparatus free from condensation in the cabinet of the apparatus. The electronic apparatus has printed circuit boards on which heat emitting semiconductor devices are mounted and a fan. The electronic apparatus further comprises a hygrometer for measuring the relative humidity and dew-point temperature of the cooling air that is introduced into the cabinet through an opening, a surface temperature sensor for sensing the temperature of the surface of the semiconductor devices, an internal temperature sensor for sensing the internal temperature of the semiconductor device, dehumidifier and heater means made up of a heat pump and an outdoor unit, and a controller for controlling the dehumidifier means and the heater means so that the relative humidity is less than 100% and the dew-point temperature is less than the surface temperature of the semiconductor devices.

Air-cooled electronic apparatus with condensation prevention

A cooling apparatus for electronic devices which is capable of reducing the flow resistance in an exhaust air flow passage to lessen noises and to improve the cooling performance of heat sinks when heat-generating semiconductor parts are very tightly mounted in a plane or when the calorific value of the heat-generating semiconductor parts is extremely large. In addition, the cooling apparatus realizes uniform air quantity distribution and uniform temperature distribution to the heat-generating semiconductor parts. Heat sinks 13 are respectively attached onto a plurality of heat-generating semiconductor parts 12a, 12b and 12c on a board 11. Further, nozzles 14 are respectively provided on the opposite side surfaces of heat-generating semiconductor part fitted surfaces of the heat sinks 13. The nozzles 14 have a substantially rectangular cross section parallel to the board, and are designed such that, when the ratio of the distance between the adjacent heat sinks to the pitch of the plurality of mounted heat sinks is not less than 0.00 but below 0.02, the ratio of the width of the nozzles 14 in the direction (X direction) that a refrigerant flows within the heat sinks 13 to the width of the heat sinks 13 is not less than 0.16 and not more than 0.35.

Cooling apparatus for electronic device

An electronic apparatus having a plurality of semiconductor devices which produce heat during operation, with a heat sink having a plurality of tabular or pin-type fins is provided on each semiconductor device. Nozzles are associated with the heat sinks so as to supply a cooling fluid into the heat sinks. The heat sinks are so arranged that all these heat sinks guide and discharge the cooling fluid in the same direction. A breadth of the respective nozzles, as measured in the direction (x-direction) of the flow and discharge of the cooling fluid determined by the heat sink is less than that of the associated heat sink. A width of the nozzle, as measured in the direction (y-direction) perpendicular to the x-direction is smaller than that of the associated heat sink. A space between adjacent nozzles provide a discharge passage of an ample cross-section which reduces resistance encountered by the heated cooling medium to be discharged therethrough.

A forced air cooling apparatus having a blower for blowing air taken in from an intake surface or inlet of the blower to be blown against an electronic device in an installation wherein the blower is mounted for operation on a casing or a rack, and in which the apparatus has a flow regulating plate vertically intersecting the intake surface that is installed immediately before the intake surface. With this construction, eddy air current flow in the vicinity of the intake surface is prevented and the cooling ability obtained from the blower is optimized to thereby attain the effect that the electronic devices can be efficiently cooled without requiring the same separation distance between an intake surface of the blower and a wall surface of the frame or casing in which the blower is installed, as compared with a conventional installation of the same equipment in the same casing without the flow regulating plate.

Forced air cooling apparatus having blower and air current regulating

An electronic equipment has a cooling structure in which air discharged from heat sinks can be recovered without any leakage and compact blow ducts and discharge ducts are disposed in a narrow space. A supply opening and a discharge opening for cooling air are independently formed in a heat sink. A plurality of supply branched ducts and discharge branched ducts are combined in a comb-like shape along the axis of the ducts. Ejection openings for cooling air are formed on each of the supply branched ducts in positions corresponding to each of the heat sinks. Such ejection openings are closely connected to the supply openings for cooling air of the heat sinks. On the other hand, recovery openings for cooling air are formed on each of the refrigerant discharge ducts in a position corresponding to each of the heat sinks. Such recovery openings are closely connected to the discharge openings for gas refrigerant of the heat sinks.

Cooling apparatus for electronic equipment

A cooling system for cooling an electronic device by allowing a cooling fluid to flow in contact with heat generating components such as LSI chips of the electronic device arranged in series along the major flow of the cooling fluid. The cooling system has heat radiation fins attached to the heat-generating components, and a cooling duct defining a cooling fluid flow passage in which assemblies composed of the heat-generating components and the heat radiation fins are disposed. The flow passage has, at the upstream end of the upstream end assembly, a cross-sectional area greater than that of the assembly when taken in a plane perpendicular to the direction of the major flow of the cooling fluid. The cross-sectional area of the flow passage progressively decreases towards the downstream end, whereby the flow passage is divided into a main passage through which a main flow component of the cooling fluid directly flows into the series of assemblies and an auxiliary passage through which an auxiliary component of the cooling fluid flows substantially vertically towards the heat-generating component to impinge upon the heat generating component.

Cooling system for cooling an electronic device and heat radiation fin

Growing community of inventors

Tsuchiura, Japan

Takayuki Atarashi