Shin-etsu Chemical Co., Ltd.

Other

Renesas Electronics Corporation

Ciba-geigy Corporation

Riken Corporation

Gunma Prefecture

We Plan Company

Takayuki Aoki

Toshio Shiobara

Kazutoshi Tomiyoshi

Eiichi Asano

Shoichi Osada

Shigeki Ino

Yasuo Kimura

Takashi Tsuchiya

Satoshi Okuse

Hisashi Shimizu

Ichiro Takahashi

Koji Futatsumori

Hidenori Mizushima

Kazuhiro Arai

Kunio Miyauchi

Hideto Kato

Nobukazu Suzuki

Miyuki Wakao

Peter Flury

Wolfgang Scharf

Hatsuji Shiraishi

Takahito Ishino

Tarou Shimoda

Kenichi Tsuchiura

Kazuyuki Uchida

Masateru Matsumoto

Tatsurou Hirano

Tadashi Okada

An initial position determination process and a rotation driving process are both attained. A motor includes a rotor having a permanent magnet with a plurality of magnetic poles and a stator having coils with a plurality of phases. A voltage signal generation part generates a voltage signal corresponding to an electric current flowing through each of the coils with the phases of the stator. A filter part includes a first filter and a second filter. The voltage signal is inputted to a comparator through the filter part. A control part controls such that the first filter whose filter constant is larger is selected when performing the initial position determination process of the rotor and the second filter whose filter constant is smaller is selected when performing the rotation driving process.

Motor driving device, method, and program

An epoxy resin composition comprising (A) at least one epoxy resin comprising (a) a naphthalene ring-containing epoxy resin having at least one substituted or unsubstituted naphthalene ring in a molecule and having an epoxy equivalent of 175 to 210, (B) a phenolic resin having at least one substituted or unsubstituted naphthalene ring in a molecule, and (C) an inorganic filler, the substituted or unsubstituted naphthalene ring of the epoxy resin (a) being contained in an amount of 45 to 60% by weight in the total amount of the epoxy resin (A) is best suited for semiconductor encapsulation because it has good flow, a low coefficient of linear expansion, a high Tg, minimal moisture absorption, and crack resistance upon lead-free soldering.

Semiconductor encapsulating epoxy resin composition and semiconductor device

An epoxy resin composition comprising: (A) an epoxy resin having at least three epoxy groups per molecule and an epoxy equivalent of 170 or lower; (B) an epoxy resin having a phenolic nucleus and two epoxy groups in such an amount that a weight ratio of the epoxy resin (B) to the epoxy resin (A) ranges from 35/65 to 65/35; (C) a phenolic curing agent in such an amount that a molar ratio of phenolic hydroxyl groups to the whole epoxy groups in the composition ranges from 0.5 to 1.5; and (D) an inorganic filler in an amount of from 86 to 92 wt %, based on a total weight of the composition. The composition provides encapsulated semiconductor devices much less warped than those encapsulated with a conventional composition.

Epoxy resin composition for encapsulating semiconductor devices and semiconductor devices encapsulated therewith

A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copolymer obtained by reacting an epoxy resin or alkenyl group-bearing epoxy resin with an organohydrogenpolysiloxane, and (E) an inorganic filler. The composition has improved moldability and solder crack resistance while exhibiting high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.

A semiconductor encapsulating epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, and (D) 300-900 parts by weight per 100 parts by weight of components (A) and (B) combined of an inorganic filler contains nitrogen atoms in an amount of 1.5-20% by weight based on the weight of components (A) and (B) combined. Cured parts of the composition exhibit high-temperature capabilities and flame retardance despite the absence of halogenated epoxy resins and antimony trioxide.

In press forming including ironing, an elastically deformable material is used for a part of ironing die contacting to the work material under a higher pressure than designed, for taking the formed product out from the die easily in a case that the ironing die and the formed product are very close in size to each other, and thereby improving the efficiency of production.

Ironing dies

A simultaneous two-sided iron-deep drawing process for producing vessels such as metal cans. After being used, the cans can easily be squashed. A difference in height between the inner die and the outer die or the profile radii of the two dies are varied so as to change the longitudinal wall strength of the vessel. The work material is held between the two dies so that both sides are simultaneously ironed and thereby a tubular structure is obtained.

Ironing-deep drawing process

Epoxy resin compositions comprising (A) an epoxy resin having an epoxy equivalent of at least 185 and possessing a structure in which two benzene rings can be directly conjugated, carbon atoms having an sp type atomic orbital accounting for at least 50% of all the carbon atoms, (B) a &bgr;-naphthol type phenolic resin curing agent, (C) a curing accelerator, and (D) an inorganic filler cure into products having satisfactory solder crack resistance on use of lead-free solder and improved flame retardance despite the absence of halogenated epoxy resins and antimony compounds and are thus suited for semiconductor encapsulation.

An angle detecting head provided with an emitter and a pair of receivers is rocked, and a bent surface of a workpiece bent by a punch and a die of a bending machine is irradiated with a measurement light from the emitter, a reflected light is received by the pair of receivers, and a bending angle of the workpiece is obtained from a peak value of the light received by the respective receivers. The angle detecting head is movable parallel to the die, is movable in a direction close to and away from the workpiece, and is movable in a direction in which the die is raised/lowered. The angle detecting head is positioned in an optimum angle measurement position of the workpiece and the bending angle is measured. Moreover, the bending machine presses the workpiece to the vicinity of a target angle, measures the bending angle of the workpiece during final pressing, removes pressure to bring the workpiece to an unloaded state, measures the bending angle of the workpiece, and obtains and stores a difference between the final pressing angle measured value and the unloaded angle measured value as a spring-back amount.

Method and apparatus for measuring angle of bend, method of bending, and apparatus for controlling angle of bend

An epoxy resin composition comprising (A) a polyfunctional epoxy resin, (B) a phenolic resin, (C) an inorganic filler, and (D) curing catalyst-containing microcapsules having a mean particle size of 0.5-50 &mgr;m is suited for semiconductor package encapsulation since it minimizes the warpage of packages and has satisfactory catalyst latency, storage stability and cure.

An epoxy resin composition contains (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) catalyzed microcapsules containing an imidazole compound or organic phosphorus compound and having a mean particle size of 0.5-50 &mgr;m, the quantity of the catalyst leached out from the microcapsules in o-cresol at 30&deg; C. for 15 minutes being at least 70% by weight of the entire catalyst quantity. The composition is suited for semiconductor package encapsulation since it has satisfactory catalyst latency, storage stability and cure.

Epoxy resin composition and semiconductor device

An epoxy resin composition comprising (A) a biphenyl skeleton epoxy resin, (B) a biphenyl skeleton phenolic resin as a curing agent, (C) molybdenum compound, and (D) an inorganic filler is suited for semiconductor encapsulation since it is effectively moldable and cures into a part having improved reflow crack resistance, moisture resistance, and flame retardance. It does not pose a hazard to human health or the environment.

A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a microencapsulated flame retardant comprising a red phosphorus-base core coated with a thermoplastic resin and/or thermosetting resin, (D) a molybdenum compound, and (E) an inorganic filler. The composition and its cured product have moisture-proof reliability and high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.

In semiconductor encapsulating epoxy resin compositions comprising an epoxy resin, a curing agent and an inorganic filler, 1-90% by weight of the inorganic filler is spherical cristobalite. The compositions are able to achieve higher loadings of inorganic filler, allow easy control of the coefficient of thermal expansion, and provide high-quality cured products having improved thermal conductivity and low moisture absorption.

Growing community of inventors

Gunma-ken, Japan

Takayuki Aoki