Nichia Corporation

Takayoshi Wakaki

Yoshiki Sato

Naoki Musashi

Takaaki Tada

Hiroto Tamaki

Tadao Hayashi

Daisuke Oyamatsu

Takafumi Sugiyama

Takao Kosugi

Toshiyuki Okazaki

Yukiko Oshima

Masahiko Sano

Junya Narita

Yohei Wakai

Shoichi Yamada

Hiroyuki Tanaka

A light emitting device includes: a light emitting element having a top surface; and a light-transmissive member covering at least the top surface of the light emitting element, the light-transmissive member having a principal surface located above the top surface of the light emitting element. The principal surface of the light-transmissive member comprises a plurality of concave portions.

Light emitting device including light transmissive member with concave portions

A light-emitting module includes: a light-transmitting lightguide plate; light sources disposed on the lightguide plate, each light source including a light-emitting element and a cover member including a first resin and provided beside a lateral surface of the light-emitting element, with first and second electrodes exposed through the cover member; a light-reflecting member provided on the lightguide plate and provided around the light sources, with the cover members of exposed through the light-reflecting member, wherein the light-reflecting member includes a second resin having a higher hardness than the first resin; a support layer covering the light-reflecting member and the cover members, with the first electrodes and the second electrodes exposed through the support layer, wherein the support layer includes a third resin having a higher hardness than the first resin; and a wiring layer provided on the support layer and connected to the first electrodes and the second electrodes.

Light-emitting module and method of manufacturing light-emitting module

A method for forming a light-transmissive member includes: a step (A) including locating a cured resin body having a principal surface and containing a silicone resin, and a die including a plurality of convex portions, such that the principal surface and the plurality of convex portions face each other, and pressing the die onto the principal surface of the resin body in a heated state to form a plurality of concave portions at the principal surface; and a step (B) including, after the step (A), irradiating the principal surface of the resin body with ultraviolet rays.

Method for forming light-transmissive member including pressing die into resin body and irradiating resin body with ultraviolet rays

A method for forming a light-transmissive member includes irradiating a principal surface of a cured resin body containing a silicone resin with ultraviolet rays through a photomask comprising one or more light-blocking regions and one or more light-transmissive regions, so as to cause a height of one or more first regions of the principal surface, which correspond to the one or more light-blocking regions of the photomask, to be different than a height of one or more second regions of the principal surface, which correspond to the one or more light-transmissive regions of the photomask.

Method for forming light-transmissive member, method for producing light emitting device, and light emitting device

A light emitting device includes: a light emitting element including: a semiconductor structure including an n-type semiconductor layer, an active layer, and a p-type semiconductor layer, each containing a nitride semiconductor, a p-electrode disposed on a portion of a surface of the p-type semiconductor layer on a side opposite to a surface provided with the active layer, and an n-electrode disposed on a surface of the n-type semiconductor layer on a side opposite to a surface provided with the active layer in a region other than a region facing the p-electrode; and a protective film continuously covering a surface of the n-electrode and a surface of the n-type semiconductor layer. The protective film includes a first metal oxide film and a second metal oxide film that are alternately layered, the first metal oxide film containing a first metal, and the second metal oxide film containing a second metal.

Light emitting device

A method of manufacturing a fluorescent-material-containing member includes: providing a fluorescent member including a fluorescent material, the fluorescent member having a first main surface side including a plurality of projections; disposing a powder of a light-reflective member between the projections of the fluorescent member; obtaining a sintered body by sintering the powder of the light-reflective member, and removing part of the sintered body from at least one of a first main surface side and a second main surface side of the fluorescent member to obtain the fluorescent-material-containing member including a first surface arranged on the first main surface side has and defined by the fluorescent member and the light-reflective member, and a second surface arranged on the second main surface side has and defined by the fluorescent member and the light-reflective member or defined solely by the fluorescent member.

Method of manufacturing fluorescent-material-containing member

A method for manufacturing a light emitting device includes: integrally molding a package and a lead, the package arranged to form at least part of an inner peripheral face of a recess portion in which the light emitting element is housed, the package including a base material and a plurality of particles, the base material including a resin, a coefficient of thermal expansion of the particles being different from a coefficient of thermal expansion of the base material; and covering the inner peripheral face of the recess portion with a cover film, the cover film having light transmissive and electrical insulation.

Method for manufacturing light emitting device

Method of manufacturing light emitting device

A method of manufacturing a light emitting device includes providing a light emitting element; and forming a protective film on a surface of the light emitting element, wherein the step of forming the protective film includes: (i) providing first quantity of oxygen at the surface of the light emitting element, (ii) combining a first quantity of a first metal with the first quantity of oxygen, (iii) combining a second quantity of oxygen with the first quantity of metal, (iv) combining a first quantity of a second metal, different from the first metal, with the second quantity of oxygen and first quantity of the first metal, and (v) combining a third quantity of oxygen with the first quantity of the second metal.

A light emitting device has a light emitting element, a package, a lead, and a cover film. The package is arranged to form at least part of an inner peripheral face of a recess portion. The light emitting element is housed in the recess portion. The lead is disposed on a bottom face of the recess portion. The lead is electrically connected to the light emitting element. The cover film is arranged to cover the inner peripheral face of the recess portion. The cover film has light transmissive and electrical insulation. The package includes a base material and a plurality of particles. The base material includes a resin. A coefficient of thermal expansion of the particles is different from a coefficient of thermal expansion of the base material. The particles are disposed at least near the inner peripheral face of the recess portion.

Light emitting device and method for manufacturing same

A wave-length conversion inorganic member can includes a base body and an inorganic particle layer on the base body. The inorganic particle layer can include particles of an inorganic wave-length conversion substance which is configured to absorb light of a first wave-length and to emit light of a second wave-length different from the first wave-length. The inorganic particle layer can include an agglomerate of a plurality of the particles. Each of the plurality of the particles are in contact with at least one of the other particles or the base body. A cover layer comprises an inorganic material, and the cover layer continuously covers a surface of the base body and surfaces of the particles. The inorganic particle layer has an interstice enclosed by the particles, or by the particles and one of the base body and the cover layer.

Wave-length conversion inorganic member, and method for manufacturing the same

A light emitting device includes an electrically conductive member provided with a reflective film; a light emitting element mounted on the reflective film; and a protective film continuously covering a surface of the light emitting element and a surface of the reflective film. A thickness of the protective film on the reflective film in a vicinity of the light emitting element is substantially equal to a thickness of the protective film on the reflective film in the region except for the vicinity of the light emitting element.

Light emitting device that includes protective film having uniform thickness

Light emitting device that includes reflective film surface covered with protective film having uniform thickness

A package for a light emitting device includes: a resin portion having a sidewall thereof; a first lead having a reflective layer containing silver, the first lead being embedded in the resin portion such that the reflective layer is exposed inside the sidewall; and a second lead having at least a part of a surface thereof exposed inside the sidewall, the second lead being embedded in the resin portion while being isolated from the first lead, wherein in the first lead, the reflective layer is provided spaced inward apart from a boundary between the first lead and the resin portion, and wherein a separating surface exposed between the boundary and the reflective layer is formed of a surface of metal containing silver in a smaller amount than that of the reflective layer.

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Anan, Japan

Takayoshi Wakaki