Toshiba Lighting & Technology Corporation

Kabushiki Kaisha Toshiba

Hirata Corporation

Takayoshi Moriyama

Kazunari Higuchi

Sumio Hashimoto

Shinichi Kumashiro

Kazuo Egawa

Masami Iwamoto

Masayuki Yoshinobu

Masahiro Toda

Kozo Ogawa

Yumi Hanyuda

Ryotaro Matsuda

Shigetoshi Komiyama

Jun Sasaki

Masataka Shiratsuchi

Katsumi Hisano

Hiroshi Amano

Kenji Nezu

Yutaka Honda

Makoto Yamazaki

Mitsuaki Kato

Yuichiro Yamamoto

Katsuyoshi Tachibana

Hiroyuki Kuramochi

Yoshio Kikukawa

Naoto Mori

Yoshiro Oka

Junya Murata

Naoto Tokuhara

Yoshiji Kamata

A lighting apparatus including a plurality of light-emitting elements mounted on a first surface of a substrate, a heat conducting layer disposed on a second surface of the substrate opposite the first surface, and one or more holes extending from the first surface to the second surface of the substrate. A heat conductive and electrically non-conducting material covers an inner surface of the one or more holes, and is thermally connected to the heat conductive layer.

Light emitting module having heat conductive substrate

A lighting apparatus including at least one light-emitting element mounted on a first surface of a substrate, a heat conducting layer disposed on a second surface of the substrate opposite the first surface, and one or more holes extending from the first surface to the second surface of the substrate. A heat conductive and electrically non-conducting material covers an inner surface of the one or more holes, and is thermally connected to the heat conductive layer.

A substrate having a plurality of light-emitting elements mounted thereon is described. The substrate may be mounted in a lighting apparatus and may include a surface on which the plurality of light-emitting elements are mounted and one or more holes through which heat may be conducted from the first surface to another surface of the substrate. For example, a heat conductive and electrically non-conductive material may cover a surface of the one or more holes. According to some arrangements, the surface of the substrate may include an electrically non-conductive layer and an electrically conductive layer such that the electrically non-conductive layer is electrically isolated or separated from the electrically conductive layer.

A lighting unit according to one embodiment includes a board, a support member, and a plurality of heat radiation fins. A light emitting element is disposed on a first surface of the board. The support member has an interior surface on which a second surface of the board that is opposite to the first surface is disposed to be in contact therewith to enable heat conduction from the board to the support member. The heat radiation fins are disposed on an exterior surface of the support member substantially parallel with each other and with a clearance between each other, and each having a flat shape that extends outwardly from the exterior surface.

Lighting unit and lighting device

According to one embodiment, a light-emitting unit includes a light-emitting section, a diffusion cover, and a reflector. The light-emitting section includes an LED element. The diffusion cover diffuses light emitted from the light-emitting section. The reflector controls the light diffused by the diffusion cover.

Light-emitting unit and luminaire

According to one embodiment, a floodlight includes at least one light-emitting part, a thermal radiator, a reflector, and an adapter part attachable to and detachable from the thermal radiator. The light-emitting part includes an LED element. The thermal radiator is thermally connected to the light-emitting part. The reflector is provided on the thermal radiator, and controls luminous intensity distribution from the light-emitting part. The adapter part includes an extension reflector. The extension reflector is continuous with the reflector in a state where the adapter part is attached to the thermal radiator and, together with the reflector, controls the luminous intensity distribution from the light-emitting part to provide a luminous intensity distribution angle narrower than the reflector.

Luminaire

A lighting apparatus includes a substrate having a plurality of light-emitting elements mounted thereto. The substrate includes a surface on which a plurality of light-emitting elements are mounted and stress absorbing elements arranged on imaginary straight lines connecting portions for mounting the substrate with each other. The lighting apparatus includes a main body in contact with and fixed to a back surface of the substrate. The lighting apparatus also includes a light directing member in contact with a front surface of the substrate, a plurality of openings into which the plurality of light-emitting elements of the substrate are inserted, and a plurality of reflective surfaces.

Lighting apparatus and light-emitting element mounting substrate having stress absorbing means

According to one embodiment, a power source unit includes a substrate and a reflective body. The substrate includes a plurality of light-emitting elements mounted thereon. The reflective body includes a plurality of incident openings each corresponding to one of the plurality of light-emitting elements, an output opening to which light that has passed through the incident opening is output, and a plurality of reflective surfaces that expand from the incident opening toward the output opening. Reflective surfaces included in the plurality of reflective surfaces and positioned on an outermost side are provided to be adjacent to one another, and an angle is set so as to prevent reflective light of light emitted from the light-emitting elements from traveling toward an outer side in a reflective surface formed on the outer side.

Power source unit and illumination device

A substrate for a lighting apparatus includes one or more light-emitting elements mounted thereon. The substrate includes a surface on which the plurality of light-emitting elements are mounted. Additionally, the substrate includes heat conductive elements for conducting heat from the one or more light-emitting elements, the heat conductive elements including heat conductive holes extending through a non-electrically conducting layer formed on a first surface of the substrate and an entirety of the substrate and a heat conductive layer formed on a surface of the substrate opposite the first surface.

Lighting apparatus with heat conductive substrate

According to one embodiment, a lighting fixture includes a fixture body and a plurality of light-emitting modules. A plurality of light-emitting module arrangement portions are formed on the surface of the fixture body. The light-emitting modules are arranged on the light-emitting module arrangement portions of the fixture body and annularly arranged so that a space is formed at the center area of the fixture body. Semiconductor light-emitting elements are disposed on the surface of the light-emitting module, and a wiring connector is arranged at the space side of the substrate.

Lighting fixture

According to one embodiment, a lighting apparatus includes a main body including a flat thermal conduction surface. The thermal conduction surface contacts a back surface of a board. Light-emitting devices are mounted on a front surface of the board. An optical member is opposed to a peripheral part of the board on the front surface side of the board. The optical member is fastened to the main body by fastening members, to push the peripheral part of the board against the heat conduction surface of the main body.

Lighting apparatus

A lighting apparatus is provided with a plurality of light-emitting devices, a substrate, a blind member, and a reflector. The reflector is formed with a plurality of reflective surfaces corresponding to the light-emitting devices, individually. The shielding angle at which light emitted from that one of the light-emitting devices which is located on the outermost periphery is intercepted by the reflective surface corresponding to the outermost light-emitting device is greater than shielding angles at which light emitted from the light-emitting devices located inside the outermost light-emitting device is intercepted by the reflective surfaces corresponding to the inside light-emitting devices.

Growing community of inventors

Miura, Japan

Takayoshi Moriyama