Ebara Corporation

Mitsubishi Jidosha Kogyo Kabushiki Kaisha

Mitsubishi Jidosha Engineering Kabushiki Kaisha

Takayoshi Kawamoto

Norio Kimura

You Ishii

Hozumi Yasuda

Toyomi Nishi

Takeshi Sakurai

Hiroshi Yoshida

Takayuki Saito

Hirokuni Hiyama

Yutaka Wada

Manabu Tsujimura

Keisuke Namiki

Kunio Fujiwara

Katsuyuki Aoki

Makoto Kamachi

Kiyotaka Kawashima

Masaji Akahori

Syu Nakanishi

Hirofumi Yagura

Satoshi Konishi

Takashi Ue

Toru Akiyama

Kunio Tateishi

Hirotaka Sugimoto

Sumiaki Hazama

Tadao Ohwaki

Yusuke Nomura

Naoki Imakita

Jun Soeda

Shinzi Miura

A power source control device includes a charging state detector configured to detect a charging state of a drive battery mounted on an electric vehicle and a power source mode switch configured to switch a power source mode of the electric vehicle, wherein the power source mode switch configured to switch the power source mode to an OFF mode in a case that charging of the drive battery is stopped while the power source mode is set at an ON mode.

Power source control device and power source control method

An apparatus includes a first switch turned ON in response to depression of a pedal, and OFF in response to depression being released; a second switch that assumes a first state in response to depression of the pedal, and a second state in response to pedal release; and a control unit that determines whether the first switch is in the first state. The control unit starts the engine, if in the first state and if the engine start switch is operated.

Vehicle start control apparatus

A vehicle control unit includes an engine switch, an idling stop controller and a power supply controller. When the engine switch is depressed in a state where the engine is automatically stopped by the idling stop controller, the idling stop controller restarts the engine in a case where a relationship between an operating time during which the engine switch is depressed and a predetermined reference time satisfies a predetermined condition, and the power supply controller switches a power supply mode in a case where the relationship between the operating time and the reference time does not satisfy the predetermined condition.

Vehicle control unit

A polishing cloth mounted on a turntable is dressed by bringing a dresser in contact with the polishing cloth for restoring the polishing capability of the polishing cloth. The dressing is performed by measuring heights of a surface of the polishing cloth at radial positions of the polishing cloth in a radial direction thereof determining a rotational speed of the dresser with respect to a rotational speed of the turntable on the basis of the measured heights, and dressing the polishing cloth by pressing the dresser are rotating. The dresser has an annular diamond grain layer or an annular SiC layer.

Method and apparatus for dressing polishing cloth

The object of this invention is to provide an electrical deionization apparatus with which various feed water types ranging from water of high ion concentration to water of low ion concentration can be consistently deionized with high efficiency. At least part of cation-exchange membranes and anion-exchange membranes alternate between electrodes to form an alternating array of deionization and concentration compartments and the deionization compartment contains a woven or non-woven fabric made of cation-exchange fiber that is placed on the cation-exchange membrane side in a face-to-face relationship with a woven or non-woven fabric made of anion-exchange fiber that is placed on the anion-exchange membrane side, with the passageway of feed water between the two woven or non-woven fabrics containing an ion-conducting spacer provided with an ion-exchanging capability.

Electric deionization apparatus

A polishing apparatus can improve the uniformity of thickness within a workpiece or reduce thickness variation between serially polished workpieces. The polishing apparatus comprises a polishing unit having a polishing tool for providing a polishing surface and a workpiece holding device for holding the workpiece. A polishing solution or liquid supplying device is provided for supplying a polishing solution or liquid into a polishing interface between the surface of the workpiece and the polishing surface. A temperature of the polishing interface is controlled according to at least an ambient temperature of a polishing space surrounding the polishing unit, as a variable parameter.

Method and apparatus for polishing

The object of the present invention is to provide a polishing apparatus that can supply a polishing solution having a non-varying distribution of abrading particles sizes at a steady rate. An apparatus ( ) for delivering a polishing solution to a polishing apparatus ( ) is disclosed. The apparatus ( ) comprises: a solution passage for transporting the polishing solution; and an ultrasonic vibrator ( ) being provided in at least one location of the solution passage.

Polishing solution feeder

A polishing cloth mounted on a turntable is dressed by bringing a dresser in contact with the polishing cloth for restoring the polishing capability of the polishing cloth. The dressing is performed by measuring heights of a surface of the polishing cloth at radial positions of the polishing cloth in a radial direction thereof, determining a rotational speed of the dresser with respect to a rotational speed of the turntable on the basis of the measured heights, and dressing the polishing cloth by pressing the dresser against the polishing cloth while the turntable and the dresser are rotating. The dresser has an annular diamond grain layer or an annular SiC layer.

A predetermined amount of liquid such as water is supplied to a backside surface of a workpiece such as a semiconductor wafer. Such liquid is a workpiece retaining liquid and is attached to a concave workpiece holding surface of a top ring. The workpiece is positioned between a turntable and the top ring and is polished by an abrasive cloth on the turntable while the workpiece is being pressed against the turntable by the top ring. While polishing, the workpiece is deformed toward the concave workpiece holding surface of the top ring, and a curvature of the deformed workpiece is controlled by the amount of liquid between the workpiece holding surface and the backside surface of the workpiece.

Method and apparatus for polishing workpiece

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Tokyo, Japan

Takayoshi Kawamoto