Apple Inc.

Takayoshi Katahira

Lan H Hoang

Raghunandan Chaware

Chang Liu

Steven P Cardinali

Leilei Zhang

Dennis R Pyper

Meng Chi Lee

Amir Salehi

Kishore N Renjan

Manoj Vadeentavida

Bilal Mohamed Ibrahim Kani

Siddharth Nangia

Wyeman Chen

Vu Thanh Vo

Jing Tao

Stacked circuit board structures and methods of assembly are described. In an embodiment, a stacked circuit board structure includes first circuit board and a second circuit board including a plurality of pins mounted thereon, and the plurality of pins are secured in a plurality of receptacles that are coupled with the first circuit board to provide electrical connection between the first circuit board and the second circuit board.

Built-in connector for board-to-board and flex-to-rigid board connection

Frames and other structures for system-in-package modules that may allow components on boards in the modules to communicate with each other.

Interconnect frames for SIP modules

Readily manufactured structures for sealing or encapsulating devices in system-in-a-package modules, such that the modules are easily assembled, have a low-profile, and are space efficient. One example may provide readily manufactured covers for SIP modules. These modules may be easily assembled by attaching the cover to a top side of a substrate. These SIP modules may have a low-profile, for example when their height is reduced using one or more recesses in a bottom surface of a top of the recess, where the one or more recesses are arranged to accept one or more components. These SIP modules may be made space efficient by placing an edge of a cover near an edge of the substrate and connecting the plating of the cover using side plating on, or vias through, the substrate.

Low-profile space-efficient shielding for SIP module

Stacked circuit board structures are described. In an embodiment, a plurality of vertical devices serves as electrical interconnections between the first circuit board and the second circuit board. In an embodiment, a plurality of vertical interconnects or pins serve as electrical interconnections between the first circuit board and the second circuit board. The vertical interconnects or pins may be arranged side-by-side with a plurality of vertical or horizontal devices.

Vertical module and perpendicular pin array interconnect for stacked circuit board structure

Connectors that allow system-in-package modules to connect to other circuits in an electronic device in an area-efficient manner.

Area-efficient connections to SIP modules

Vertical shielding and interconnect structures for system-in-a-package modules, where the vertical shielding and interconnect structures are readily manufactured and are space efficient.

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San Jose, CA, United States of America

Takayoshi Katahira