Matsushita Electric Industrial Co., Ltd.

Takayoshi Kado

Shigetoshi Negishi

Kunio Tanaka

Hiroyuki Fujiwara

Manabu Morioka

Takayuki Fujita

Takeshi Nishiguchi

Takashi Munezane

Mikio Yasuda

Noboru Furuta

Hidekazu Nakamura

Takaharu Fuji

Hiroaki Terazawa

A compact and high-speed automatic electronic parts mounting apparatus is provided which includes first and second parts feeders, first and second mounting heads, a printed board-holding table, and a controller. Each of the first and second parts feeders includes a plurality of cassettes storing therein electronic parts and having pick-up stations. The second parts feeder is arranged at a preselected interval away from the first parts feeder in a first direction. Each of the first and second mounting heads is movable in the first direction and includes a plurality of pick-up nozzles movable in a vertical direction for picking up the electronic parts from the pick-up stations of the cassettes. The printed board-holding table is disposed within the preselected interval between the first and second parts feeders so as to move in a second direction perpendicular to the first direction. The controller controls the movement of the table and the first and second mounting heads so that the first and second mounting heads pick up the electronic parts from the cassettes of the first and second parts feeders, respectively, and mount them on a printed board held on the table in sequential mounting operations.

High speed electronic parts mounting apparatus having mounting heads which alternately mount components on a printed circuit board

Chip-type electronic elements are applied in line on the surface of a carrier tape before they are supplied to an automatic electronic-element supply apparatus so as to be automatically mounted on a printed circuit board. Side plates are disposed at an end portion of the body frame of the automatic electronic element supply apparatus for a chip-type electronic element mounting apparatus in such a manner that a plurality of carrier tape reels can be fastened to the side plates and the carrier tapes are discharged from the tape reels in a ratchet manner while moving adjacently in parallel to one another through another end portion of the body frame. Thus, a multiplicity of different kinds of electronic elements can be supplied from one supply apparatus.

Chip-type electronic element supplying apparatus

Growing community of inventors

Osaka, Japan

Takayoshi Kado