Mitsubishi Chemical Corporation

Resolution Performance Products LLC

Takayoshi Hirai

Makoto Takahashi

Yoshinobu Ohnuma

Tetsuro Imura

Takao Fukuzawa

Yasuhiro Kawase

Makoto Ikemoto

Tomohide Murase

Iho Kamimura

Tetsurou Imura

To provide an interlayer filler composition which, in 3D lamination of semiconductor device chips, forms a highly thermally conductive filling interlayer simultaneously with the bonding of solder bumps or the like and lands between semiconductor device chips, a coating fluid and a process for producing a three-dimensional integrated circuit. An interlayer filler composition for a three-dimensional integrated circuit, which comprises a resin (A) having a melt viscosity at 120&#xb0; C. of at most 100 Pa&#xb7;s and a flux (B), the content of the flux (B) being at least 0.1 part by weight and at most 10 parts by weight per 100 parts by weight of the resin (A).

Interlayer filler composition for three-dimensional integrated circuit

An imide skeleton resin represented by the following general formula (1) has a coefficient of linear expansion as low as that of polyimide resin and excellent processability like epoxy resin, and is useful as a resin composition for electrical laminates. Five percent by mole or more of the entirety of the A component is a linking group having an imide skeleton represented by the following general formula (4-1). B denotes a hydrogen atom or a group represented by the following structural formula (5). n denotes an integer in the range of 0 to 200. If both of the B's are hydrogen atoms, then n denotes an integer of 1 or more. 

Soluble imide skeleton resin, soluble imide skeleton resin solution composition, curable resin composition, and cured product thereof

Composition of epoxy resin and triazine-formaldehyde-phenol resin

A high molecular weight epoxy resin obtained by polymerization reaction of a difunctional epoxy resin (X) with a dihydric phenol compound (Y) containing 70-100% by weight of bisphenol S in the presence of a catalyst, the high molecular weight epoxy resin being characterized in that a weight average molecular weight thereof is 10,000-200,000. A resinous composition for a printed circuit board, comprising the high molecular weight epoxy resin, an epoxy resin other than the above-mentioned resin and a curing agent as essential components.

High molecular weight epoxy resin and resinous composition for printed circuit board

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Yokkaichi, Japan

Takayoshi Hirai