Toray Engineering Company, Limited

Takayoshi Fujimoto

Masamichi Yamashita

Masaki Mori

Takashi Iwade

Toyoharu Terada

Toshiyuki Jinda

Katsuyoshi Miyashita

Yutaka Oka

A method for forming a sealing film, in which a buffer layer and a barrier layer whose density is higher than that of the buffer layer are alternately formed on a substrate, includes forming a first buffer layer on a surface of the substrate, forming a first barrier layer on a surface of the first buffer layer, and forming a second buffer layer on a surface of the first barrier layer. A ratio of a thickness of a portion of the first buffer layer in a thickness direction of the substrate relative to a thickness of a portion of the first buffer layer in an inclined direction that is inclined with respect to the thickness direction is closer to 1 than a ratio of a thickness of a portion of the second buffer layer in the thickness direction relative to a thickness of a portion of the second buffer layer in the inclined direction.

Method for forming sealing film, and sealing film

A thin-film forming device forms a thin film on a strip-shaped substrate by subjecting the strip-shaped substrate to a surface treatment while conveying the strip-shaped substrate in a state of being laid along an outer peripheral face of a main roll. The thin-film forming device comprises: a main roll chamber accommodating the main roll; a plurality of film formation chambers arranged in a peripheral direction of the main roll, the film formation chambers having partitions disposed radially outward of the main roll; and a main roll cover covering the outer peripheral face of the main roll over which the strip-shaped substrate travels, the main roll cover being provided to the partitions, the main roll cover having a film formation chamber communication component that communicates with the film formation chambers. A pressure in an interior of the main roll cover defined between the main roll cover and the outer peripheral face of the main roll is set to be higher than a pressure in the film formation chambers.

Thin-film forming device

In an LED module, modes to solve such a problem that a loss in the output of light discharged into the atmosphere occurs are embodied. Specifically, in an LED module in which an LED chip is sealed with a sealing resin, a surface of the sealing resin is covered with a thin film, the thin film is made of a material having a smaller linear expansion coefficient than the sealing resin, and an irregular surface is provided on a surface of the thin film such that light from the LED chip is multiply reflected.

LED module and method for manufacturing LED module

A chemical vapor deposited film includes silicon atoms, oxygen atoms, carbon atoms, and hydrogen atoms. The chemical vapor deposited film is formed by a plasma CVD method such that the concentration of the oxygen atoms is 10-35% by element.

Chemical vapor deposited film formed by plasma CVD method

A solar battery module has a structure in which a solar battery cell formed by a transparent electrode, a power generating element, and a back electrode is formed on a substrate, and it is sealed with a resin material such as EVA. However, there has been a problem that water enters from a gap between the substrate and a resin sealing material, thereby resulting in the corrosion of the resin or the solar battery cell. A barrier layer made of inorganic substances having portions in contact with the substrate and the second electrode is provided. Here, the barrier layer is formed by laminating at least SiOand an inorganic layer having a lower density than SiO, and the film having a lower density than SiOis directly formed on the substrate and the second electrode.

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Otsu, Japan

Takayoshi Fujimoto